Cypress Semiconductor CY7C1471BV33 Specification Sheet

72-mbit (2m x 36/4m x 18/1m x 72) flow-through sram with nobl architecture

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Features
No Bus Latency™ (NoBL™) architecture eliminates dead
cycles between write and read cycles
Supports up to 133 MHz bus operations with zero wait states
Data is transferred on every clock
Pin compatible and functionally equivalent to ZBT™ devices
Internally self timed output buffer control to eliminate the need
to use OE
Registered inputs for flow through operation
Byte Write capability
3.3V/2.5V IO supply (V
)
DDQ
Fast clock-to-output times
6.5 ns (for 133 MHz device)
Clock Enable (CEN) pin to enable clock and suspend operation
Synchronous self-timed writes
Asynchronous Output Enable (OE)
CY7C1471BV33, CY7C1473BV33 available in
JEDEC-standard Pb-free 100-pin TQFP, Pb-free and
non-Pb-free 165-Ball FBGA package. CY7C1475BV33
available in Pb-free and non-Pb-free 209-Ball FBGA package
Three Chip Enables (CE
, CE
1
expansion
Automatic power down feature available using ZZ mode or CE
deselect
IEEE 1149.1 JTAG Boundary Scan compatible
Burst Capability—linear or interleaved burst order
Low standby power
Selection Guide
Description
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Cypress Semiconductor Corporation
Document #: 001-15029 Rev. *B
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through
, CE
) for simple depth
2
3
198 Champion Court
CY7C1473BV33, CY7C1475BV33
SRAM with NoBL™ Architecture

Functional Description

The CY7C1471BV33, CY7C1473BV33, and CY7C1475BV33
are 3.3V, 2M x 36/4M x 18/1M x 72 synchronous flow through
burst SRAMs designed specifically to support unlimited true
back-to-back read or write operations without the insertion of
wait states. The CY7C1471BV33, CY7C1473BV33, and
CY7C1475BV33 are equipped with the advanced No Bus
Latency (NoBL) logic. NoBL™ is required to enable consecutive
read or write operations with data being transferred on every
clock cycle. This feature dramatically improves the throughput of
data through the SRAM, especially in systems that require
frequent write-read transitions.
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. The clock input is qualified by the
Clock Enable (CEN) signal, which when deasserted suspends
operation and extends the previous clock cycle. Maximum
access delay from the clock rise is 6.5 ns (133 MHz device).
Write operations are controlled by two or four Byte Write Select
(BW
) and a Write Enable (WE) input. All writes are conducted
X
with on-chip synchronous self timed write circuitry.
Three synchronous Chip Enables (CE
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. To avoid bus contention,
the output drivers are synchronously tri-stated during the data
portion of a write sequence. For best practice recommendations,
refer to the Cypress application note
Guidelines".
133 MHz
117 MHz
6.5
305
120
,
San Jose
CA 95134-1709
CY7C1471BV33
, CE
, CE
) and an
1
2
3
AN1064
"SRAM System
Unit
8.5
ns
275
mA
120
mA
408-943-2600
Revised March 05, 2008
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Summary of Contents for Cypress Semiconductor CY7C1471BV33

  • Page 1: Functional Description

    SRAMs designed specifically to support unlimited true back-to-back read or write operations without the insertion of wait states. The CY7C1471BV33, CY7C1473BV33, and CY7C1475BV33 are equipped with the advanced No Bus Latency (NoBL) logic. NoBL™ is required to enable consecutive read or write operations with data being transferred on every clock cycle.
  • Page 2 Logic Block Diagram – CY7C1471BV33 (2M x 36) ADDRESS A0, A1, A REGISTER MODE WRITE ADDRESS ADV/LD READ LOGIC SLEEP CONTROL Logic Block Diagram – CY7C1473BV33 (4M x 18) ADDRESS A0, A1, A REGISTER MODE WRITE ADDRESS ADV/LD BW A...
  • Page 3 LOGIC ADV/LD WRITE ADDRESS REGISTER 2 MEMORY WRITE ARRAY DRIVERS WRITE REGISTRY CONTROL LOGIC INPUT REGISTER 1 CY7C1471BV33 DQ s DQ Pa DQ Pb DQ Pc DQ Pd DQ Pe DQ Pf DQ Pg DQ Ph INPUT REGISTER 0 Page 3 of 32...
  • Page 4: Pin Configuration

    Pin Configuration BYTE C BYTE D Document #: 001-15029 Rev. *B CY7C1473BV33, CY7C1475BV33 Figure 1. 100-Pin TQFP Pinout CY7C1471BV33 CY7C1471BV33 BYTE B BYTE A Page 4 of 32 [+] Feedback...
  • Page 5 Pin Configuration (continued) BYTE B Document #: 001-15029 Rev. *B CY7C1473BV33, CY7C1475BV33 Figure 2. 100-Pin TQFP Pinout CY7C1473BV33 CY7C1471BV33 BYTE A Page 5 of 32 [+] Feedback...
  • Page 6 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout NC/576M NC/1G NC/144M MODE NC/576M NC/1G NC/144M MODE Document #: 001-15029 Rev. *B CY7C1473BV33, CY7C1475BV33 CY7C1471BV33 (2M x 36) CY7C1473BV33 (4M x 18) CY7C1471BV33 ADV/LD NC/288M ADV/LD NC/288M Page 6 of 32 [+] Feedback...
  • Page 7 209-Ball FBGA (14 x 22 x 1.76 mm) Pinout DQPg DQPc DQPd DQPh NC/144M Document #: 001-15029 Rev. *B CY7C1473BV33, CY7C1475BV33 CY7C1475BV33 (1M × 72) ADV/LD NC/576M NC/1G MODE CY7C1471BV33 DQPf DQPb DQPa DQPe NC/288M Page 7 of 32 [+] Feedback...
  • Page 8: Pin Definitions

    CE to select or deselect the device. and DQP are placed in a tri-state condition.The outputs are automatically is controlled by BW correspondingly. or left floating selects interleaved burst sequence. CY7C1471BV33 . During Page 8 of 32 [+] Feedback...
  • Page 9: Functional Overview

    No Connects. Not internally connected to the die. 144M, 288M, 576M, and 1G are address expansion pins and are not internally connected to the die. Functional Overview The CY7C1471BV33, CY7C1473BV33, and CY7C1475BV33 are synchronous flow through burst SRAMs designed specifically to eliminate wait states during write-read transitions.
  • Page 10 OE. Burst Write Accesses The CY7C1471BV33, CY7C1473BV33, and CY7C1475BV33 have an on-chip burst counter that enables the user to supply a single address and conduct up to four write operations without reasserting the address inputs.
  • Page 11 The truth table for CY7C1471BV33, CY7C1473BV33, and CY7C1475BV33 follows. Truth Table Address Operation Used Deselect Cycle None Deselect Cycle None Deselect Cycle None Continue Deselect Cycle None Read Cycle External (Begin Burst) Read Cycle Next (Continue Burst) NOP/Dummy Read External...
  • Page 12 The read/write truth table for CY7C1471BV33 follows. Truth Table for Read/Write Function Read Write No bytes written Write Byte A – (DQ and DQP Write Byte B – (DQ and DQP Write Byte C – (DQ and DQP Write Byte D – (DQ...
  • Page 13 IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1471BV33, CY7C1473BV33, and CY7C1475BV33 incorporate a serial boundary scan test access port (TAP). This port operates in accordance with IEEE Standard 1149.1-1990 but does not have the set of functions required for full 1149.1 compliance.
  • Page 14 BYPASS instruction is that it shortens the boundary scan path when multiple devices are connected together on a board. Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions. CY7C1471BV33 Page 14 of 32 [+] Feedback...
  • Page 15: Tap Controller State Diagram

    TAP Controller State Diagram TEST-LOGIC RESET RUN-TEST/ IDLE Document #: 001-15029 Rev. *B CY7C1473BV33, CY7C1475BV33 SELECT DR-SCA N CAPTURE-DR CAPTURE-IR SHIFT-DR EXIT1-DR PAUSE-DR EXIT2-DR UPDATE-DR UPDATE-IR CY7C1471BV33 SELECT IR-SCAN SHIFT-IR EXIT1-IR PAUSE-IR EXIT2-IR Page 15 of 32 [+] Feedback...
  • Page 16 TAP Controller Block Diagram Selection Circuitry TM S Document #: 001-15029 Rev. *B CY7C1473BV33, CY7C1475BV33 Bypass Register Selection Instruction Register Circuitry Identification Register Boundary Scan Register TAP CONTROLLER CY7C1471BV33 Page 16 of 32 [+] Feedback...
  • Page 17 = 1.0 mA = 2.5V = 100 µA = 3.3V = 2.5V = 3.3V = 2.5V = 3.3V = 2.5V GND < V < V CY7C1471BV33 to 2.5V 1.25V 50Ω Z = 50Ω 20pF Unit + 0.3 + 0.3 –0.3 –0.3 –5...
  • Page 18 CY7C1473BV33, CY7C1475BV33 Description Figure 3. TAP Timing t TH t CY C t TM SS t TM SH t TDIS t TDIH DON’T CA RE UNDEFINED = 1 ns. CY7C1471BV33 Unit t TDOV t TDOX Page 18 of 32 [+] Feedback...
  • Page 19: Identification Codes

    Identification Register Definitions CY7C1471BV33 Instruction Field Revision Number (31:29) [12] Device Depth (28:24) Architecture/Memory Type(23:18) Bus Width/Density(17:12) Cypress JEDEC ID Code (11:1) 00000110100 ID Register Presence Indicator (0) Scan Register Sizes Register Name Instruction Bypass Boundary Scan Order – 165FBGA Boundary Scan Order –...
  • Page 20 Bit # 165-Ball ID Bit # Document #: 001-15029 Rev. *B CY7C1473BV33, CY7C1475BV33 165-Ball ID Bit # 165-Ball ID 165-Ball ID Bit # 165-Ball ID CY7C1471BV33 Bit # 165-Ball ID Bit # 165-Ball ID Page 20 of 32 [+] Feedback...
  • Page 21 Boundary Scan Exit Order (1M x 72) Bit # 209-Ball ID Bit # Document #: 001-15029 Rev. *B CY7C1473BV33, CY7C1475BV33 209-Ball ID Bit # 209-Ball ID CY7C1471BV33 Bit # 209-Ball ID Page 21 of 32 [+] Feedback...
  • Page 22: Maximum Ratings

    = 0, inputs static /2). Undershoot: V (AC) > –2V (pulse width less than t (min.) within 200 ms. During this time V < V and V CY7C1471BV33 + 0.5V Ambient Temperature 0°C to +70°C 3.3V –5%/+10% 2.5V – 5% to V –40°C to +85°C...
  • Page 23: Thermal Resistance

    INCLUDING JIG AND SCOPE R = 1667Ω 2.5V OUTPUT 5 pF R = 1538Ω INCLUDING JIG AND SCOPE CY7C1471BV33 165 FBGA 209 BGA Package Package 165 FBGA 209 FBGA 16.3 15.2 ALL INPUT PULSES ≤ 1 ns ≤ 1 ns ALL INPUT PULSES ≤...
  • Page 24: Switching Characteristics

    SRAMs when sharing the same data OELZ CY7C1471BV33 = 3.3V and is on page 23 unless otherwise noted. 133 MHz 117 MHz (minimum) initially, before a read or write operation is initiated.
  • Page 25: Switching Waveforms

    OEHZ t OELZ READ READ BURST Q(A3) Q(A4) READ Q(A4+1) DON’T CARE UNDEFINED is LOW. When CE is HIGH, CE is HIGH, CE CY7C1471BV33 t CHZ Q(A4+1) D(A5) Q(A6) D(A7) t DOH W RITE READ W RITE DESELECT D(A5) Q(A6)
  • Page 26 23. The IGNORE CLOCK EDGE or STALL cycle (Clock 3) illustrates CEN being used to create a pause. A write is not performed during this cycle. Document #: 001-15029 Rev. *B CY7C1473BV33, CY7C1475BV33 [20, 21, 23] Q(A2) Q(A3) STALL READ WRITE STALL Q(A3) D(A4) DON’T CARE UNDEFINED CY7C1471BV33 t CHZ D(A4) Q(A5) t DOH READ DESELECT CONTINUE Q(A5) DESELECT Page 26 of 32 [+] Feedback...
  • Page 27 Document #: 001-15029 Rev. *B CY7C1473BV33, CY7C1475BV33 [24, 25] Figure 7. ZZ Mode Timing High-Z DON’T CARE The truth table for CY7C1471BV33, CY7C1473BV33, and CY7C1475BV33 follows. CY7C1471BV33 t ZZREC t RZZI DESELECT or READ Only [1, 2, 3, 4, 5, 6, 7]...
  • Page 28: Ordering Information

    CY7C1471BV33-133BZC 51-85165 165-Ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) CY7C1473BV33-133BZC CY7C1471BV33-133BZXC 51-85165 165-Ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free CY7C1473BV33-133BZXC CY7C1475BV33-133BGC 51-85167 209-Ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)
  • Page 29: Package Diagrams

    2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS CY7C1471BV33 1.40±0.05 12°±1° SEE DETAIL (8X) 0.20 MAX.
  • Page 30 Figure 9. 165-Ball FBGA (15 x 17 x 1.4 mm) TOP VIEW PIN 1 CORNER SEATING PLANE Document #: 001-15029 Rev. *B CY7C1473BV33, CY7C1475BV33 0.15(4X) CY7C1471BV33 PIN 1 CORNER BOTTOM VIEW Ø0.05 M C Ø0.25 M C A B Ø0.45±0.05(165X) 1.00 5.00...
  • Page 31 CY7C1471BV33 CY7C1473BV33, CY7C1475BV33 Package Diagrams (continued) Figure 10. 209-Ball FBGA (14 x 22 x 1.76 mm) 51-85167 ** Document #: 001-15029 Rev. *B Page 31 of 32 [+] Feedback...
  • Page 32 Document History Page Document Title: CY7C1471BV33/CY7C1473BV33/CY7C1475BV33, 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL™ Architecture Document Number: 001-15029 Issue REV. ECN NO. Orig. of Change Date 1024500 See ECN VKN/KKVTMP New Data Sheet 1274731 See ECN...

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