Cypress Semiconductor CY7C1480V25 Specification Sheet

72-mbit (2m x 36/4m x 18/1m x 72) pipelined sync sram

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Features
• Supports bus operation up to 250 MHz
• Available speed grades are 250, 200, and 167 MHz
• Registered inputs and outputs for pipelined operation
• 2.5V core power supply
• 2.5V/1.8V IO operation
• Fast clock-to-output time
— 3.0 ns (for 250-MHz device)
• Provide high-performance 3-1-1-1 access rate
• User selectable burst counter supporting Intel
®
Pentium
interleaved or linear burst sequences
• Separate processor and controller address strobes
• Synchronous self timed writes
• Asynchronous output enable
• Single cycle chip deselect
• CY7C1480V25, CY7C1482V25 available in
JEDEC-standard Pb-free 100-pin TQFP, Pb-free and
non-Pb-free 165-ball FBGA package. CY7C1486V25
available in Pb-free and non-Pb-free 209-ball FBGA
package
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• "ZZ" Sleep Mode option
Selection Guide
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Note
1. For best practices recommendations, refer to the Cypress application note System Design Guidelines at www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05282 Rev. *H
72-Mbit (2M x 36/4M x 18/1M x 72)
Functional Description
The CY7C1480V25/CY7C1482V25/CY7C1486V25 SRAM
integrates 2M x 36/4M x 18/1M × 72 SRAM cells with
advanced synchronous peripheral circuitry and a two-bit
counter for internal burst operation. All synchronous inputs are
gated by registers controlled by a positive-edge-triggered
Clock Input (CLK). The synchronous inputs include all
addresses, all data inputs, address-pipelining Chip Enable
(CE
), depth-expansion Chip Enables (CE
1
Control inputs (ADSC, ADSP, and ADV), Write Enables (BW
and BWE), and Global Write (GW). Asynchronous inputs
include the Output Enable (OE) and the ZZ pin.
®
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) is active. Subsequent burst
addresses can be internally generated as controlled by the
Advance pin (ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed Write cycle. This part supports Byte
Write operations (see
Table" on page 10
to two or four bytes wide, as controlled by the byte write control
inputs. When it is active LOW, GW causes all bytes to be
written.
The CY7C1480V25/CY7C1482V25/CY7C1486V25 operates
from a +2.5V core power supply while all outputs may operate
with either a +2.5 or +1.8V supply. All inputs and outputs are
JEDEC-standard JESD8-5-compatible.
250 MHz
3.0
450
120
198 Champion Court
CY7C1480V25
CY7C1482V25
CY7C1486V25
Pipelined Sync SRAM
[1]
"Pin Definitions" on page 7
for further details). Write cycles can be one
200 MHz
167 MHz
3.0
3.4
450
400
120
120
,
San Jose
CA 95134-1709
Revised April 23, 2007
and CE
), Burst
2
3
,
X
and
"Truth
Unit
ns
mA
mA
408-943-2600
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Summary of Contents for Cypress Semiconductor CY7C1480V25

  • Page 1 • Separate processor and controller address strobes • Synchronous self timed writes • Asynchronous output enable • Single cycle chip deselect • CY7C1480V25, CY7C1482V25 available in JEDEC-standard Pb-free 100-pin TQFP, Pb-free and non-Pb-free 165-ball FBGA package. CY7C1486V25 available in Pb-free and non-Pb-free 209-ball FBGA package •...
  • Page 2 Logic Block Diagram – CY7C1480V25 (2M x 36) A 0, A1, A ADDRESS REGISTER MODE ADSC ADSP D QP BYTE WRITE REGISTER D QP BYTE WRITE REGISTER D QP BYTE WRITE REGISTER BYTE WRITE REGISTER ENABLE REGISTER SLEEP CONTROL Logic Block Diagram – CY7C1482V25 (4M x 18)
  • Page 3 WRITE DRIVER WRITE DRIVER MEMORY ARRAY , DQP WRITE DRIVER , DQP WRITE DRIVER , DQP WRITE DRIVER , DQP WRITE DRIVER PIPELINED ENABLE CY7C1480V25 CY7C1482V25 CY7C1486V25 OUTPUT OUTPUT SENSE BUFFERS REGISTERS AMPS INPUT REGISTERS Page 3 of 32 [+] Feedback...
  • Page 4: Pin Configurations

    Pin Configurations CY7C1480V25 (2M x 36) Document #: 38-05282 Rev. *H 100-Pin TQFP Pinout CY7C1482V25 CY7C1480V25 CY7C1482V25 CY7C1486V25 (4M x 18) Page 4 of 32 [+] Feedback...
  • Page 5 Pin Configurations (continued) 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout NC/288M NC/144M MODE NC/288M NC/144M MODE Document #: 38-05282 Rev. *H CY7C1480V25 (2M x 36) CY7C1482V25 (4M x 18) CY7C1480V25 CY7C1482V25 CY7C1486V25 ADSC NC/576M ADSP NC/1G ADSC ADSP...
  • Page 6 Pin Configurations (continued) 209-Ball FBGA (14 x 22 x 1.76 mm) Pinout Document #: 38-05282 Rev. *H CY7C1486V25 (1M × 72) ADSP ADSC NC/288M NC/144M NC/576M NC/1G MODE CY7C1480V25 CY7C1482V25 CY7C1486V25 Page 6 of 32 [+] Feedback...
  • Page 7: Pin Definitions

    CE to select/deselect the device. CE and CE to select/deselect the device. CE serves as ground for the core and the IO circuitry. CY7C1480V25 CY7C1482V25 CY7C1486V25 , CE , and CE are sampled...
  • Page 8: Functional Overview

    A synchronous self-timed write mechanism has been provided to simplify the write operations. Because CY7C1480V25/CY7C1482V25/CY7C1486V25 is a common IO device, the Output Enable (OE) must be deasserted HIGH before presenting data to the DQs inputs.
  • Page 9 A synchronous self-timed write mechanism has been provided to simplify the write operations. Because CY7C1480V25/CY7C1482V25/CY7C1486V25 is a common IO device, the Output Enable (OE) must be deasserted HIGH before presenting data to the DQs inputs.
  • Page 10: Truth Table

    Truth Table The truth table for CY7C1480V25, CY7C1482V25, and CY7C1486V25 follows. Operation Add. Used Deselect Cycle, Power Down None Deselect Cycle, Power Down None Deselect Cycle, Power Down None Deselect Cycle, Power Down None Deselect Cycle, Power Down None Sleep Mode, Power Down...
  • Page 11 Truth Table for Read/Write The read/write truth table for the CY7C1480V25 follows. Function Read Read Write Byte A – (DQ and DQP Write Byte B – (DQ and DQP Write Bytes B, A Write Byte C – (DQ and DQP...
  • Page 12 IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1480V25/CY7C1482V25/CY7C1486V25 incorpo- rates a serial boundary scan test access port (TAP). This port operates in accordance with IEEE Standard 1149.1-1990 but does not have the set of functions required for full 1149.1 compliance. These functions from the IEEE specification are excluded because their inclusion places an added delay in the critical speed path of the SRAM.
  • Page 13 To guarantee that the boundary scan register captures the correct value of a signal, the SRAM signal must be stabilized long enough to meet the TAP controller’s capture setup plus hold time (t plus t portion CY7C1480V25 CY7C1482V25 CY7C1486V25 Unlike SAMPLE/PRELOAD Page 13 of 32...
  • Page 14 Do not use these instructions. t TH t CYC t TMSS t TMSH t TDIS t TDIH DON’T CARE UNDEFINED [9, 10] Over the Operating Range Description = 1 ns. CY7C1480V25 CY7C1482V25 CY7C1486V25 t TDOV t TDOX Unit Page 14 of 32 [+] Feedback...
  • Page 15 Description Output HIGH Voltage Output HIGH Voltage Output LOW Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage Input Load Current Identification Register Definitions CY7C1480V25 Instruction Field (2M x36) Revision Number (31:29) Device Depth (28:24) 01011 Architecture/Memory 000000 Type(23:18)
  • Page 16: Identification Codes

    Bit # 165-Ball ID Bit # Document #: 38-05282 Rev. *H Bit Size (x36) Bit Size (x18) Description 165-Ball ID Bit # 165-Ball ID CY7C1480V25 CY7C1482V25 CY7C1486V25 Bit Size (x72) Bit # 165-Ball ID Page 16 of 32 [+] Feedback...
  • Page 17 Boundary Scan Exit Order (4M x 18) Bit # 165-Ball ID Document #: 38-05282 Rev. *H Bit # 165-Ball ID CY7C1480V25 CY7C1482V25 CY7C1486V25 Bit # 165-Ball ID Page 17 of 32 [+] Feedback...
  • Page 18 Boundary Scan Exit Order (1M x 72) Bit # 209-Ball ID Bit # Document #: 38-05282 Rev. *H 209-Ball ID Bit # 209-Ball ID CY7C1480V25 CY7C1482V25 CY7C1486V25 Bit # 209-Ball ID Page 18 of 32 [+] Feedback...
  • Page 19: Maximum Ratings

    V , f = 0 /2), undershoot: V (AC) > –2V (Pulse width less than t (min.) within 200 ms. During this time V < V and V CY7C1480V25 CY7C1482V25 CY7C1486V25 + 0.5V Ambient Temperature 0°C to +70°C 2.5V –5%/+5% 1.7V to...
  • Page 20: Thermal Resistance

    5 pF R = 1583Ω INCLUDING JIG AND SCOPE R = 14KΩ 1.8V OUTPUT 5 pF R = 14KΩ INCLUDING JIG AND SCOPE CY7C1480V25 CY7C1482V25 CY7C1486V25 165 FBGA 209 FBGA Unit Package Package 165 FBGA 209 FBGA Unit Max. Max.
  • Page 21: Switching Characteristics

    V is less than t and t is less than t to eliminate bus contention between SRAMs when sharing the same OELZ CY7C1480V25 CY7C1482V25 CY7C1486V25 200 MHz 167 MHz Unit Min.
  • Page 22: Switching Waveforms

    DOH Q(A2) Q(A2 + 1) Q(A2 + 2) BURST READ DON’T CARE UNDEFINED is HIGH and CE is LOW. When CE is HIGH: CE CY7C1480V25 CY7C1482V25 CY7C1486V25 Burst continued with new base address Deselect cycle t CHZ Q(A2 + 3)
  • Page 23 WEH ADV suspends burst D(A2) D(A2 + 1) D(A2 + 1) D(A2 + 2) BURST WRITE DON’T CARE UNDEFINED LOW. CY7C1480V25 CY7C1482V25 CY7C1486V25 ADSC extends burst t ADS t ADH t WES t WEH ADVS ADVH D(A2 + 3)
  • Page 24 Document #: 38-05282 Rev. *H t WES t WEH t DS t DH t OELZ D(A3) Q(A4) Q(A4+1) Single WRITE BURST READ DON’T CARE UNDEFINED CY7C1480V25 CY7C1482V25 CY7C1486V25 D(A5) D(A6) Q(A4+2) Q(A4+3) Back-to-Back WRITEs Page 24 of 32 [+] Feedback...
  • Page 25 26. DQs are in high-Z when exiting ZZ sleep mode. Document #: 38-05282 Rev. *H t RZZI DESELECT or READ Only High-Z DON’T CARE “Truth Table” on page 10 for all possible signal conditions to deselect the device. CY7C1480V25 CY7C1482V25 CY7C1486V25 t ZZREC Page 25 of 32 [+] Feedback...
  • Page 26: Ordering Information

    CY7C1480V25-167BZC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) CY7C1482V25-167BZC CY7C1480V25-167BZXC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free CY7C1482V25-167BZXC CY7C1486V25-167BGC 51-85167 209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)
  • Page 27 CY7C1480V25-250BZC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) CY7C1482V25-250BZC CY7C1480V25-250BZXC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free CY7C1482V25-250BZXC CY7C1486V25-250BGC 51-85167 209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)
  • Page 28: Package Diagrams

    2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS CY7C1480V25 CY7C1482V25 CY7C1486V25 1.40±0.05 12°±1°...
  • Page 29 Figure 2. 165-Ball FBGA (15 x 17 x 1.4 mm), 51-85165 TOP VIEW PIN 1 CORNER SEATING PLANE Document #: 38-05282 Rev. *H 0.15(4X) CY7C1480V25 CY7C1482V25 CY7C1486V25 PIN 1 CORNER BOTTOM VIEW Ø0.05 M C Ø0.25 M C A B Ø0.45±0.05(165X)
  • Page 30 The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. CY7C1480V25 CY7C1482V25...
  • Page 31 Document History Page Document Title: CY7C1480V25/CY7C1482V25/CY7C1486V25 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM Document Number: 38-05282 Orig. of REV. ECN NO. Issue Date Change 114670 08/06/02 118281 01/21/03 233368 See ECN 299452 See ECN 323039 See ECN...
  • Page 32 Document Title: CY7C1480V25/CY7C1482V25/CY7C1486V25 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM Document Number: 38-05282 Orig. of REV. ECN NO. Issue Date Change 486690 See ECN 1026720 See ECN VKN/KKVTMP Added footnote #2 related to V Document #: 38-05282 Rev. *H Description of Change Corrected the typo in the 209-Ball FBGA pinout.

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Cy7c1482v25Cy7c1486v25

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