Cypress Semiconductor CY7C1471V33 Specification Sheet

72-mbit (2m x 36/4m x 18/1m x 72) flow-through sram with nobl architecture

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Features
• No Bus Latency™ (NoBL™) architecture eliminates dead
cycles between write and read cycles
• Supports up to 133 MHz bus operations with zero wait states
• Data is transferred on every clock
• Pin compatible and functionally equivalent to ZBT™ devices
• Internally self timed output buffer control to eliminate the
need to use OE
• Registered inputs for flow through operation
• Byte Write capability
• 3.3V/2.5V IO supply (V
DDQ
• Fast clock-to-output times
— 6.5 ns (for 133-MHz device)
• Clock Enable (CEN) pin to enable clock and suspend
operation
• Synchronous self timed writes
• Asynchronous Output Enable (OE)
• CY7C1471V33, CY7C1473V33 available in
JEDEC-standard Pb-free 100-Pin TQFP, Pb-free and
non-Pb-free 165-Ball FBGA package. CY7C1475V33
available in Pb-free and non-Pb-free 209-Ball FBGA
package
• Three Chip Enables (CE
, CE
1
expansion
• Automatic power down feature available using ZZ mode or
CE deselect
• IEEE 1149.1 JTAG Boundary Scan compatible
• Burst Capability — linear or interleaved burst order
• Low standby power
Selection Guide
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Note
1. For best practice recommendations, refer to the Cypress application note
Cypress Semiconductor Corporation
Document #: 38-05288 Rev. *J
72-Mbit (2M x 36/4M x 18/1M x 72)
Flow-Through SRAM with NoBL™ Architecture
)
, CE
) for simple depth
2
3
198 Champion Court
Functional Description
The CY7C1471V33, CY7C1473V33 and CY7C1475V33 are
3.3V, 2M x 36/4M x 18/1M x 72 synchronous flow through burst
SRAMs designed specifically to support unlimited true
back-to-back read or write operations without the insertion of
wait
states.
The
CY7C1471V33,
CY7C1475V33 are equipped with the advanced No Bus
Latency (NoBL) logic required to enable consecutive read or
write operations with data being transferred on every clock
cycle. This feature dramatically improves the throughput of
data through the SRAM, especially in systems that require
frequent write-read transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. The clock input is qualified by
the Clock Enable (CEN) signal, which when deasserted
suspends operation and extends the previous clock
cycle.Maximum access delay from the clock rise is 6.5 ns
(133-MHz device).
Write operations are controlled by two or four Byte Write Select
(BW
) and a Write Enable (WE) input. All writes are conducted
X
with on-chip synchronous self timed write circuitry.
Three synchronous Chip Enables (CE
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. To avoid bus contention,
the output drivers are synchronously tri-stated during the data
portion of a write sequence.
133 MHz
6.5
305
120
AN1064, SRAM System
Guidelines.
,
San Jose
CA 95134-1709
CY7C1471V33
CY7C1473V33
CY7C1475V33
[1]
CY7C1473V33
, CE
, CE
) and an
1
2
3
117 MHz
Unit
8.5
ns
275
mA
120
mA
408-943-2600
Revised July 04, 2007
and
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Summary of Contents for Cypress Semiconductor CY7C1471V33

  • Page 1 Document #: 38-05288 Rev. *J 72-Mbit (2M x 36/4M x 18/1M x 72) Functional Description The CY7C1471V33, CY7C1473V33 and CY7C1475V33 are 3.3V, 2M x 36/4M x 18/1M x 72 synchronous flow through burst SRAMs designed specifically to support unlimited true...
  • Page 2 Logic Block Diagram – CY7C1471V33 (2M x 36) ADDRESS A0, A1, A REGISTER MODE WRITE ADDRESS ADV/LD READ LOGIC SLEEP CONTROL Logic Block Diagram – CY7C1473V33 (4M x 18) ADDRESS A0, A1, A REGISTER MODE WRITE ADDRESS ADV/LD BW A...
  • Page 3 BURST LOGIC ADV/LD WRITE ADDRESS REGISTER 2 MEMORY WRITE ARRAY DRIVERS WRITE REGISTRY CONTROL LOGIC INPUT REGISTER 1 CY7C1471V33 CY7C1473V33 CY7C1475V33 DQ s DQ Pa DQ Pb DQ Pc DQ Pd DQ Pe DQ Pf DQ Pg DQ Ph INPUT...
  • Page 4: Pin Configurations

    Pin Configurations BYTE C BYTE D Document #: 38-05288 Rev. *J 100-Pin TQFP Pinout CY7C1471V33 CY7C1471V33 CY7C1473V33 CY7C1475V33 BYTE B BYTE A Page 4 of 32 [+] Feedback...
  • Page 5 Pin Configurations (continued) BYTE B Document #: 38-05288 Rev. *J 100-Pin TQFP Pinout CY7C1473V33 CY7C1471V33 CY7C1473V33 CY7C1475V33 BYTE A Page 5 of 32 [+] Feedback...
  • Page 6 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout NC/576M NC/1G NC/144M MODE NC/576M NC/1G NC/144M MODE Document #: 38-05288 Rev. *J CY7C1471V33 (2M x 36) CY7C1473V33 (4M x 18) CY7C1471V33 CY7C1473V33 CY7C1475V33 ADV/LD NC/288M ADV/LD NC/288M Page 6 of 32...
  • Page 7 209-Ball FBGA (14 x 22 x 1.76 mm) Pinout DQPg DQPc DQPd DQPh NC/144M Document #: 38-05288 Rev. *J CY7C1475V33 (1M × 72) ADV/LD NC/576M NC/1G MODE CY7C1471V33 CY7C1473V33 CY7C1475V33 DQPf DQPb DQPa DQPe NC/288M Page 7 of 32 [+] Feedback...
  • Page 8: Pin Definitions

    CE to select or deselect the device. and DQP is controlled by BW correspondingly. CY7C1471V33 CY7C1473V33 CY7C1475V33 are placed in a tri-state condition.The . During or left floating selects Page 8 of 32...
  • Page 9: Functional Overview

    No Connects. Not internally connected to the die. 144M, 288M, 576M, and 1G are address expansion pins and are not internally connected to the die. Functional Overview The CY7C1471V33, CY7C1473V33, and CY7C1475V33 are synchronous flow through burst SRAMs designed specifically to eliminate wait states during write-read transitions. All synchronous inputs pass through input registers controlled by the rising edge of the clock.
  • Page 10 The data written during the write operation is controlled by signals. The CY7C1471V33, CY7C1473V33, and CY7C1475V33 provides Byte Write capability that is described in the “Truth Table for Read/Write” on page with the selected BW input selectively writes to only the desired bytes.
  • Page 11: Truth Table

    Truth Table The truth table for CY7C1471V33, CY7C1473V33, CY7C1475V33 follows. Address Operation Used Deselect Cycle None Deselect Cycle None Deselect Cycle None Continue Deselect Cycle None Read Cycle External (Begin Burst) Read Cycle Next (Continue Burst) NOP/Dummy Read External (Begin Burst)
  • Page 12 Truth Table for Read/Write The read-write truth table for CY7C1471V33 follows. Function Read Write No bytes written Write Byte A – (DQ and DQP Write Byte B – (DQ and DQP Write Byte C – (DQ and DQP Write Byte D – (DQ...
  • Page 13 IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1471V33, CY7C1473V33, and CY7C1475V33 incorporate a serial boundary scan test access port (TAP). This port operates in accordance with IEEE Standard 1149.1-1990 but does not have the set of functions required for full 1149.1 compliance. These functions from the IEEE specification are excluded because their inclusion places an added delay in the critical speed path of the SRAM.
  • Page 14 Because there is a large difference in the clock frequencies, it is possible that during the Capture-DR state, an input or output may undergo a transition. The TAP may then try to capture a CY7C1471V33 CY7C1473V33 CY7C1475V33 PRELOAD...
  • Page 15 These instructions are not implemented but are reserved for future use. Do not use these instructions. t TH t CY C t TM SS t TM SH t TDIS t TDIH t TDOX DON’T CA RE UNDEFINED CY7C1471V33 CY7C1473V33 CY7C1475V33 t TDOV Page 15 of 32 [+] Feedback...
  • Page 16 11.Test conditions are specified using the load in TAP AC Test Conditions. t Document #: 38-05288 Rev. *J Description = 1 ns. CY7C1471V33 CY7C1473V33 CY7C1475V33 Unit Page 16 of 32...
  • Page 17 = 1.0 mA = 2.5V = 100 µA = 3.3V = 2.5V = 3.3V = 2.5V = 3.3V = 2.5V GND < V < V CY7C1471V33 CY7C1473V33 CY7C1475V33 to 2.5V 1.25V 50Ω Z = 50Ω 20pF Unit + 0.3 + 0.3 –0.3...
  • Page 18: Identification Codes

    Identification Register Definitions CY7C1471V33 Instruction Field (2Mx36) Revision Number (31:29) [13] Device Depth (28:24) Architecture/Memory 001001 Type(23:18) Bus Width/Density(17:12) 100100 Cypress JEDEC ID Code (11:1) 00000110100 ID Register Presence Indicator (0) Scan Register Sizes Register Name Instruction Bypass Boundary Scan Order – 165FBGA Boundary Scan Order –...
  • Page 19 Bit # 165-Ball ID Bit # Document #: 38-05288 Rev. *J 165-Ball ID Bit # 165-Ball ID 165-Ball ID Bit # 165-Ball ID CY7C1471V33 CY7C1473V33 CY7C1475V33 Bit # 165-Ball ID Bit # 165-Ball ID Page 19 of 32 [+] Feedback...
  • Page 20 Boundary Scan Exit Order (1M x 72) Bit # 209-Ball ID Bit # Document #: 38-05288 Rev. *J 209-Ball ID Bit # 209-Ball ID CY7C1471V33 CY7C1473V33 CY7C1475V33 Bit # 209-Ball ID Page 20 of 32 [+] Feedback...
  • Page 21: Maximum Ratings

    – 0.3V or V 0.3V /2). Undershoot: V (AC) > –2V (pulse width less than t (min.) within 200 ms. During this time V < V and V CY7C1471V33 CY7C1473V33 CY7C1475V33 + 0.5V Ambient Temperature 0°C to +70°C 3.3V –5%/+10% 2.5V – 5%...
  • Page 22: Thermal Resistance

    5 pF R = 351Ω INCLUDING JIG AND SCOPE R = 1667Ω 2.5V 5 pF R = 1538Ω INCLUDING JIG AND SCOPE CY7C1471V33 CY7C1473V33 CY7C1475V33 165 FBGA 209 BGA Unit Package Package 100 TQFP 165 FBGA 209 FBGA Unit °C/W 24.63...
  • Page 23: Switching Characteristics

    Test Loads and Waveforms” on page is less than t and t is less than t to eliminate bus contention between SRAMs when sharing the same OELZ CY7C1471V33 CY7C1473V33 CY7C1475V33 = 3.3V and unless otherwise noted. 117 MHz Unit (minimum) initially, before a read or write operation 22.
  • Page 24: Switching Waveforms

    READ READ BURST W RITE Q(A3) Q(A4) READ Q(A4+1) DON’T CARE UNDEFINED is LOW. When CE is HIGH, CE is HIGH, CE CY7C1471V33 CY7C1473V33 CY7C1475V33 t CHZ Q(A4+1) D(A5) Q(A6) D(A7) t DOH t OELZ W RITE READ W RITE...
  • Page 25 23. The IGNORE CLOCK EDGE or STALL cycle (Clock 3) illustrates CEN being used to create a pause. A write is not performed during this cycle. Document #: 38-05288 Rev. *J [20, 21, 23] Q(A2) Q(A3) STALL READ WRITE STALL Q(A3) D(A4) DON’T CARE UNDEFINED CY7C1471V33 CY7C1473V33 CY7C1475V33 t CHZ D(A4) Q(A5) t DOH READ DESELECT CONTINUE Q(A5) DESELECT Page 25 of 32...
  • Page 26 Document #: 38-05288 Rev. *J [24, 25] Figure 3. ZZ Mode Timing High-Z DON’T CARE “Truth Table” on page 11 for all possible signal conditions to deselect the device. CY7C1471V33 CY7C1473V33 CY7C1475V33 t ZZREC t RZZI DESELECT or READ Only Page 26 of 32...
  • Page 27: Ordering Information

    Speed Package (MHz) Ordering Code Diagram CY7C1471V33-133AXC 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free CY7C1473V33-133AXC CY7C1471V33-133BZC 51-85165 165-Ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) CY7C1473V33-133BZC CY7C1471V33-133BZXC 51-85165 165-Ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free...
  • Page 28: Package Diagrams

    2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS CY7C1471V33 CY7C1473V33 CY7C1475V33 1.40±0.05 12°±1°...
  • Page 29 Figure 5. 165-Ball FBGA (15 x 17 x 1.4 mm), 51-85165 TOP VIEW PIN 1 CORNER SEATING PLANE Document #: 38-05288 Rev. *J 0.15(4X) CY7C1471V33 CY7C1473V33 CY7C1475V33 PIN 1 CORNER BOTTOM VIEW Ø0.05 M C Ø0.25 M C A B Ø0.45±0.05(165X)
  • Page 30 The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. CY7C1471V33 CY7C1473V33...
  • Page 31 Document History Page Document Title: CY7C1471V33/CY7C1473V33/CY7C1475V33, 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL™ Architecture Document Number: 38-05288 Issue REV. ECN NO. Orig. of Change Date 114675 08/06/02 121521 02/07/03 223721 See ECN 235012 See ECN...
  • Page 32 Document Title: CY7C1471V33/CY7C1473V33/CY7C1475V33, 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL™ Architecture Document Number: 38-05288 Issue REV. ECN NO. Orig. of Change Date 472335 See ECN 1274732 See ECN VKN/AESA Document #: 38-05288 Rev. *J Description of Change...

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