Cypress Semiconductor NoBL CY7C1470BV25 Manual

72-mbit (2m x 36/4m x 18/1m x 72) pipelined sram with nobl architecture

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Features
Pin-compatible and functionally equivalent to ZBT™
Supports 250 MHz bus operations with zero wait states
Available speed grades are 250, 200, and 167 MHz
Internally self-timed output buffer control to eliminate the need
to use asynchronous OE
Fully registered (inputs and outputs) for pipelined operation
Byte Write capability
Single 2.5V power supply
2.5V IO supply (V
)
DDQ
Fast clock-to-output times
3.0 ns (for 250-MHz device)
Clock Enable (CEN) pin to suspend operation
Synchronous self-timed writes
CY7C1470BV25, CY7C1472BV25 available in
JEDEC-standard Pb-free 100-pin TQFP, Pb-free and
non-Pb-free 165-ball FBGA package. CY7C1474BV25
available in Pb-free and non-Pb-free 209-ball FBGA package
IEEE 1149.1 JTAG Boundary Scan compatible
Burst capability—linear or interleaved burst order
"ZZ" Sleep Mode option and Stop Clock option
Selection Guide
Description
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Cypress Semiconductor Corporation
Document #: 001-15032 Rev. *D
72-Mbit (2M x 36/4M x 18/1M x 72)
Pipelined SRAM with NoBL™ Architecture

Functional Description

The CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25
are 2.5V, 2M x 36/4M x 18/1M x 72 synchronous pipelined burst
SRAMs with No Bus Latency™ (NoBL™) logic, respectively.
They are designed to support unlimited true back-to-back read
or write operations with no wait states. The CY7C1470BV25,
CY7C1472BV25, and CY7C1474BV25 are equipped with the
advanced (NoBL) logic required to enable consecutive read or
write operations with data being transferred on every clock cycle.
This feature dramatically improves the throughput of data in
systems that require frequent read or write transitions. The
CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25 are
pin-compatible and functionally equivalent to ZBT devices.
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. All data outputs pass through output
registers controlled by the rising edge of the clock. The clock
input is qualified by the Clock Enable (CEN) signal, which when
deasserted suspends operation and extends the previous clock
cycle. Write operations are controlled by the Byte Write Selects
(BW
CY7C1472BV25, and BW
Write Enable (WE) input. All writes are conducted with on-chip
synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. To avoid bus contention,
the output drivers are synchronously tri-stated during the data
portion of a write sequence.
250 MHz
3.0
450
120
198 Champion Court
CY7C1472BV25, CY7C1474BV25
–BW
for
CY7C1470BV25,
a
d
–BW
a
h
200 MHz
3.0
450
120
,
San Jose
CA 95134-1709
CY7C1470BV25
BW
–BW
for
a
b
for CY7C1474BV25) and a
, CE
, CE
) and an
1
2
3
167 MHz
Unit
3.4
ns
400
mA
120
mA
408-943-2600
Revised February 29, 2008
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Summary of Contents for Cypress Semiconductor NoBL CY7C1470BV25

  • Page 1: Functional Description

    Features ■ Pin-compatible and functionally equivalent to ZBT™ ■ Supports 250 MHz bus operations with zero wait states ❐ Available speed grades are 250, 200, and 167 MHz ■ Internally self-timed output buffer control to eliminate the need to use asynchronous OE ■...
  • Page 2 Logic Block Diagram – CY7C1470BV25 (2M x 36) A0, A1, A MODE WRITE ADDRESS REGISTER 1 ADV/LD Logic Block Diagram – CY7C1472BV25 (4M x 18) A0, A1, A MODE WRITE ADDRESS ADV/LD Document #: 001-15032 Rev. *D CY7C1472BV25, CY7C1474BV25 ADDRESS REGISTER 0 BURST LOGIC...
  • Page 3 Logic Block Diagram – CY7C1474BV25 (1M x 72) A0, A1, A MODE WRITE ADDRESS ADV/LD Document #: 001-15032 Rev. *D CY7C1472BV25, CY7C1474BV25 ADDRESS REGISTER 0 BURST LOGIC ADV/LD WRITE ADDRESS REGISTER 1 REGISTER 2 WRITE REGISTRY MEMORY AND DATA COHERENCY WRITE ARRAY CONTROL LOGIC...
  • Page 4: Pin Configurations

    Pin Configurations DQPc CY7C1470BV25 (2M × 36) DQPd Document #: 001-15032 Rev. *D CY7C1472BV25, CY7C1474BV25 Figure 1. 100-Pin TQFP Pinout DQPb CY7C1472BV25 DQPb DQPa CY7C1470BV25 DQPa (4M × 18) Page 4 of 29 [+] Feedback...
  • Page 5 Pin Configurations (continued) 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout NC/576M NC/1G NC/144M MODE NC/576M NC/1G NC/144M MODE Document #: 001-15032 Rev. *D CY7C1472BV25, CY7C1474BV25 CY7C1470BV25 (2M x 36) CY7C1472BV25 (4M x 18) CY7C1470BV25 ADV/LD NC/288M ADV/LD DQPa NC/288M Page 5 of 29 [+] Feedback...
  • Page 6 Pin Configurations (continued) 209-Ball FBGA (14 x 22 x 1.76 mm) Pinout DQPg DQPc DQPd DQPh NC/144M Document #: 001-15032 Rev. *D CY7C1472BV25, CY7C1474BV25 CY7C1474BV25 (1M × 72) ADV/LD NC/576M NC/1G MODE CY7C1470BV25 DQPf DQPb DQPa DQPe NC/288M Page 6 of 29 [+] Feedback...
  • Page 7 Table 1. Pin Definitions Pin Name IO Type Input- Address Inputs Used to Select One of the Address Locations. Sampled at the rising edge of the Synchronous CLK. Input- Byte Write Select Inputs, Active LOW. Qualified with WE to conduct writes to the SRAM. Sampled Synchronous on the rising edge of CLK.
  • Page 8: Functional Overview

    Table 1. Pin Definitions (continued) Pin Name IO Type Test Mode Select TMS Pin Controls the Test Access Port State Machine. Sampled on the rising edge of TCK. Synchronous JTAG Clock Clock Input to the JTAG Circuitry. Power Supply Power Supply Inputs to the Core of the Device. IO Power Supply Power Supply for the IO Circuitry.
  • Page 9 access (read, write, or deselect) is latched into the Address Register (provided the appropriate control signals are asserted). On the next clock rise the data presented to DQ and DQP /DQP for CY7C1470BV25, DQ a,b,c,d a,b,c,d CY7C1472BV25, /DQP a,b,c,d,e,f,g,h CY7C1474BV25) (or a subset for Byte Write operations, see “Partial Write Cycle Description”...
  • Page 10 Table 4. Truth Table The truth table for CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25 follows. Address Operation Deselect Cycle Continue Deselect Cycle Read Cycle External (Begin Burst) Read Cycle (Continue Burst) NOP/Dummy Read External (Begin Burst) Dummy Read (Continue Burst) Write Cycle External (Begin Burst) Write Cycle...
  • Page 11 Table 5. Partial Write Cycle Description The partial write cycle description for CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25 follows. Function (CY7C1470BV25) Read Write – No bytes written Write Byte a – (DQ and DQP Write Byte b – (DQ and DQP Write Bytes b, a Write Byte c –...
  • Page 12 IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25 incorporates a serial boundary scan test access port (TAP). This port operates in accordance with IEEE Standard 1149.1-1990 but does not have the set of functions required for full 1149.1 compliance.
  • Page 13 Instruction Register Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO balls as shown in the “TAP Controller Block Diagram” on page 12. During power up, the instruction register is loaded with the IDCODE instruction.
  • Page 14 possible to capture all other signals and simply ignore the value of the CLK captured in the boundary scan register. After the data is captured, it is possible to shift out the data by putting the TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO balls.
  • Page 15 TAP AC Switching Characteristics [9, 10] Over the Operating Range Parameter Clock TCK Clock Cycle Time TCYC TCK Clock Frequency TCK Clock HIGH time TCK Clock LOW time Output Times TCK Clock LOW to TDO Valid TDOV TCK Clock LOW to TDO Invalid TDOX Setup Times TMS Setup to TCK Clock Rise...
  • Page 16 2.5V TAP AC Test Conditions Input pulse levels... V Input rise and fall time ...1 ns Input timing reference levels... 1.25V Output reference levels ... 1.25V Test load termination supply voltage ... 1.25V TAP DC Electrical Characteristics And Operating Conditions (0°C <...
  • Page 17 Table 8. Identification Codes Instruction Code EXTEST Captures IO ring contents. Places the boundary scan register between TDI and TDO. Forces all SRAM outputs to High-Z state. This instruction is not 1149.1-compliant. IDCODE Loads the ID register with the vendor ID code and places the register between TDI and TDO. This operation does not affect SRAM operations.
  • Page 18 Boundary Scan Exit Order (4M x 18) Bit # 165-Ball ID Bit # Boundary Scan Exit Order (1M x 72) Bit # 209-Ball ID Bit # Document #: 001-15032 Rev. *D CY7C1472BV25, CY7C1474BV25 165-Ball ID Bit # 165-Ball ID 209-Ball ID Bit # 209-Ball ID CY7C1470BV25...
  • Page 19: Maximum Ratings

    Maximum Ratings Exceeding maximum ratings may impair the useful life of the device. These user guidelines are not tested. Storage Temperature ... –65°C to +150°C Ambient Temperature with Power Applied ... –55°C to +125°C Supply Voltage on V Relative to GND ...–0.5V to +3.6V Supply Voltage on V Relative to GND...–0.5V to +V DC to Outputs in Tri-State...
  • Page 20: Thermal Resistance

    Electrical Characteristics [12, 13] Over the Operating Range (continued) Parameter Description Automatic CE Power Down Current—CMOS Inputs Automatic CE Power Down Current—TTL Inputs Capacitance Tested initially and after any design or process changes that may affect these parameters. Parameter Description Address Input Capacitance ADDRESS Data Input Capacitance...
  • Page 21: Switching Characteristics

    Switching Characteristics Over the Operating Range. Timing reference is 1.25V when V Waveforms” on page 20 unless otherwise noted. Parameter Description [15] (typical) to the First Access Read or Write Power Clock Clock Cycle Time Maximum Operating Frequency Clock HIGH Clock LOW Output Times Data Output Valid After CLK Rise...
  • Page 22: Switching Waveforms

    Switching Waveforms Figure 6 shows read-write timing waveform. t CYC CENS CENH ADV/LD ADDRESS Data In-Out (DQ) WRITE WRITE D(A1) D(A2) Notes 19. For this waveform ZZ is tied LOW. 20. When CE is LOW, CE is LOW, CE is HIGH, and CE 21.
  • Page 23 Switching Waveforms (continued) Figure 7 shows NOP, STALL and DESELECT Cycles waveform. ADV/LD ADDRESS Data In-Out (DQ) WRITE READ D(A1) Q(A2) Figure 8 shows ZZ Mode timing waveform. SUPPLY A LL INPUTS (except ZZ) Outputs (Q) Notes 22. The IGNORE CLOCK EDGE or STALL cycle (Clock 3) illustrated CEN being used to create a pause. A write is not performed during this cycle. 23.
  • Page 24: Ordering Information

    Ordering Information Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered. Speed Package (MHz) Ordering Code Diagram CY7C1470BV25-167AXC 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free CY7C1472BV25-167AXC CY7C1470BV25-167BZC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm)
  • Page 25 Ordering Information (continued) Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered. Speed Package (MHz) Ordering Code Diagram CY7C1470BV25-250AXC 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free CY7C1472BV25-250AXC CY7C1470BV25-250BZC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm)
  • Page 26: Package Diagrams

    Package Diagrams Figure 9. 100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm), 51-85050 R 0.08 MIN. 0° MIN. 0.20 MAX. 0.25 GAUGE PLANE R 0.08 MIN. 0°-7° 0.20 MAX. 0.60±0.15 0.20 MIN. 1.00 REF. DETAIL Document #: 001-15032 Rev. *D CY7C1472BV25, CY7C1474BV25 16.00±0.20 14.00±0.10...
  • Page 27 Package Diagrams (continued) Figure 10. 165-Ball FBGA (15 x 17 x 1.4 mm), 51-85165 TOP VIEW PIN 1 CORNER SEATING PLANE Document #: 001-15032 Rev. *D CY7C1472BV25, CY7C1474BV25 0.15(4X) CY7C1470BV25 PIN 1 CORNER BOTTOM VIEW Ø0.05 M C Ø0.25 M C A B Ø0.45±0.05(165X) 1.00 5.00...
  • Page 28 CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Package Diagrams (continued) Figure 11. 209-Ball FBGA (14 x 22 x 1.76 mm), 51-85167 51-85167-** Document #: 001-15032 Rev. *D Page 28 of 29 [+] Feedback...
  • Page 29 Document History Page Document Title: CY7C1470BV25/CY7C1472BV25/CY7C1474BV25, 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL™ Architecture Document Number: 001-15032 REV. ECN No. Issue Date Orig. of Change 1032642 See ECN VKN/KKVTMP 1562503 See ECN VKN/AESA 1897447 See ECN VKN/AESA 2082487 See ECN...

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