Cypress Semiconductor CY7C1440AV33 Specification Sheet

36-mbit (1m x 36/2m x 18/512k x 72) pipelined sync sram

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Features
• Supports bus operation up to 250 MHz
• Available speed grades are 250, 200 and 167 MHz
• Registered inputs and outputs for pipelined operation
• 3.3V core power supply
• 2.5V/3.3V I/O power supply
• Fast clock-to-output times
— 2.6 ns (for 250-MHz device)
• Provide high-performance 3-1-1-1 access rate
• User-selectable burst counter supporting Intel
®
Pentium
interleaved or linear burst sequences
• Separate processor and controller address strobes
• Synchronous self-timed writes
• Asynchronous output enable
• Single Cycle Chip Deselect
• CY7C1440AV33, CY7C1442AV33 available in lead-free
100-pin TQFP package, lead-free and non-lead-free
165-ball FBGA package. CY7C1446AV33 available in
lead-free and non-lead-free 209-ball FBGA package
• Also available in lead-free packages
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• "ZZ" Sleep Mode Option
Selection Guide
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Note:
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05383 Rev. *E
36-Mbit (1M x 36/2M x 18/512K x 72)
Functional Description
The CY7C1440AV33/CY7C1442AV33/CY7C1446AV33 SRAM
integrates 1M x 36/2M x 18 and 512K x 72 SRAM cells with
advanced synchronous peripheral circuitry and a two-bit
counter for internal burst operation. All synchronous inputs are
gated by registers controlled by a positive-edge-triggered
Clock Input (CLK). The synchronous inputs include all
addresses, all data inputs, address-pipelining Chip Enable
(CE
), depth-expansion Chip Enables (CE
1
Control inputs (ADSC, ADSP, and ADV), Write Enables (BW
and BWE), and Global Write (GW). Asynchronous inputs
include the Output Enable (OE) and the ZZ pin.
®
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed Write cycle.This part supports Byte Write
operations (see Pin Descriptions and Truth Table for further
details). Write cycles can be one to two or four bytes wide as
controlled by the byte write control inputs. GW when active
LOW causes all bytes to be written.
The
operates from a +3.3V core power supply while all outputs may
operate with either a +2.5 or +3.3V supply. All inputs and
outputs are JEDEC-standard JESD8-5-compatible.
250 MHz
2.6
475
120
198 Champion Court
CY7C1440AV33
CY7C1442AV33
CY7C1446AV33
Pipelined Sync SRAM
[1]
CY7C1440AV33/CY7C1442AV33/CY7C1446AV33
200 MHz
167 MHz
3.2
3.4
425
375
120
120
,
San Jose
CA 95134-1709
Revised June 23, 2006
and CE
), Burst
2
3
X
Unit
ns
mA
mA
408-943-2600
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Summary of Contents for Cypress Semiconductor CY7C1440AV33

  • Page 1 • Separate processor and controller address strobes • Synchronous self-timed writes • Asynchronous output enable • Single Cycle Chip Deselect • CY7C1440AV33, CY7C1442AV33 available in lead-free 100-pin TQFP package, lead-free and non-lead-free 165-ball FBGA package. CY7C1446AV33 available in lead-free and non-lead-free 209-ball FBGA package •...
  • Page 2 Logic Block Diagram – CY7C1440AV33 (1M x 36) A0, A1, A ADDRESS REGISTER MODE ADSC ADSP BYTE WRITE REGISTER BYTE WRITE REGISTER BYTE WRITE REGISTER BYTE WRITE REGISTER ENABLE REGISTER SLEEP CONTROL Logic Block Diagram – CY7C1442AV33 (2M x 18)
  • Page 3 WRITE DRIVER WRITE DRIVER MEMORY ARRAY , DQP WRITE DRIVER , DQP WRITE DRIVER , DQP WRITE DRIVER , DQP WRITE DRIVER PIPELINED ENABLE CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 OUTPUT OUTPUT SENSE BUFFERS REGISTERS AMPS INPUT REGISTERS Page 3 of 31 [+] Feedback...
  • Page 4: Pin Configurations

    Pin Configurations CY7C1440AV33 (1M x 36) Document #: 38-05383 Rev. *E 100-pin TQFP Pinout CY7C1442AV33 CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 (2M x 18) Page 4 of 31 [+] Feedback...
  • Page 5 (continued) 165-ball FBGA (15 x 17 x 1.4 mm) Pinout NC/288M NC/144M NC/72M MODE NC/288M NC/144M NC/72M MODE Document #: 38-05383 Rev. *E CY7C1440AV33 (1M x 36) CY7C1442AV33 (2M x 18) CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 ADSC NC/576M ADSP NC/1G ADSC ADSP...
  • Page 6 CY7C1446AV33 (512K × 72) ADSC ADSP NC/288M NC/144M NC/576M NC/1G MODE Description and CE to select/deselect the device. ADSP is ignored if CE CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 , CE , and CE are sampled active. is HIGH. CE Page 6 of 31 [+] Feedback...
  • Page 7 Not available for AJ package version. Not is assumed active throughout this document is sampled only when a new external address is loaded. . This pin is not available on TQFP packages. CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 is sampled only when a new external is deasserted HIGH.
  • Page 8: Functional Overview

    Byte Write operation will remain unaltered. A synchronous self-timed Write mechanism has been provided to simplify the Write operations. Because CY7C1440AV33/CY7C1442AV33/CY7C1446AV33 is a common I/O device, the Output Enable (OE) must be deasserted HIGH before presenting data to the DQs inputs.
  • Page 9: Truth Table

    Test Conditions ZZ > V – 0.2V ZZ > V – 0.2V ZZ < 0.2V This parameter is sampled This parameter is sampled ZZ ADSP ADSC and CE CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 Third Fourth Address Address A1: A0 A1: A0 Min. Max.
  • Page 10 READ Cycle, Suspend Burst Current WRITE Cycle, Suspend Burst Current WRITE Cycle, Suspend Burst Current [4,8,9] Truth Table for Read/Write Function (CY7C1440AV33) Read Read Write Byte A – (DQ and DQP Write Byte B – (DQ and DQP Write Bytes B, A Write Byte C –...
  • Page 11: Tap Controller State Diagram

    Write All Bytes Write All Bytes IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1440AV33/CY7C1442AV33/CY7C1446AV33 incor- porates a serial boundary scan test access port (TAP). This part is fully compliant with IEEE Standard 1149.1. The TAP operates using JEDEC-standard 3.3V or 2.5V I/O logic levels.
  • Page 12 Once the data is captured, it is possible to shift out the data by putting the TAP into the Shift-DR state. This places the bound- ary scan register between the TDI and TDO pins. or to the selection of another boundary scan test operation. CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 Page 12 of 31...
  • Page 13 These instructions are not implemented but are reserved for future use. Do not use these instructions. t TH t CYC t TMSS t TMSH t TDIS t TDIH t TDOV t TDOX DON’T CARE UNDEFINED CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 Page 13 of 31 [+] Feedback...
  • Page 14 Input rise and fall time ...1 ns Input timing reference levels..1.25V Output reference levels ..1.25V Test load termination supply voltage ..1.25V 2.5V TAP AC Output Load Equivalent 50Ω 20pF = 1 ns. CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 Min. Max. Unit to 2.5V 1.25V 50Ω...
  • Page 15 Output HIGH Voltage Output LOW Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage Input Load Current Identification Register Definitions CY7C1440AV33 Instruction Field Revision Number (31:29) [13] Device Depth (28:24) Architecture/Memory Type(23:18) Bus Width/Density(17:12) Cypress JEDEC ID Code (11:1)
  • Page 16: Identification Codes

    Do Not Use: This instruction is reserved for future use. BYPASS Places the bypass register between TDI and TDO. This operation does not affect SRAM operations. 165-ball FBGA Boundary Scan Order CY7C1440AV33 (1M x 36), CY7C1442AV33 (2M x 18) Bit # ball ID Bit # Notes: 14.
  • Page 17 Bit # ball ID Bit # Note: 16. Bit# 138 is preset HIGH. Document #: 38-05383 Rev. *E [14, 16] ball ID Bit # ball ID CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 Bit # ball ID Internal Page 17 of 31 [+] Feedback...
  • Page 18: Maximum Ratings

    V , f = 0 /2), undershoot: V (AC) > –2V (Pulse width less than t (min.) within 200 ms. During this time V < V and V CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 + 0.5V Ambient Temperature 0°C to +70°C 3.3V –5%/+10% 2.5V – 5% to V Min.
  • Page 19 5 pF R = 351Ω INCLUDING JIG AND SCOPE R = 1667Ω 2.5V OUTPUT 5 pF R = 1538Ω INCLUDING JIG AND SCOPE CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 165 FBGA 209 FBGA Max. Max. Max. Unit 165 FBGA 209 FBGA Unit Package Package 20.8...
  • Page 20: Switching Characteristics

    [21, 22, 23] is the time that the power needs to be supplied above V and t is less than t to eliminate bus contention between SRAMs when sharing the same OELZ = 2.5V. CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 –200 –167 Min. Max.
  • Page 21: Switching Waveforms

    DOH Q(A2) Q(A2 + 1) Q(A2 + 2) BURST READ DON’T CARE UNDEFINED is HIGH and CE is LOW. When CE is HIGH: CE CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 Burst continued with new base address Deselect cycle t CHZ Q(A2 + 3)
  • Page 22 WEH ADV suspends burst D(A2) D(A2 + 1) D(A2 + 1) D(A2 + 2) BURST WRITE DON’T CARE UNDEFINED LOW. CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 ADSC extends burst t ADS t ADH t WES t WEH ADVH ADVS D(A2 + 3)
  • Page 23 Document #: 38-05383 Rev. *E t WES t WEH t DS t DH t OELZ D(A3) Q(A4) Q(A4+1) Single WRITE BURST READ DON’T CARE UNDEFINED CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 D(A5) D(A6) Q(A4+2) Q(A4+3) Back-to-Back WRITEs Page 23 of 31 [+] Feedback...
  • Page 24 30. Device must be deselected when entering ZZ mode. See Cycle Descriptions table for all possible signal conditions to deselect the device. 31. DQs are in high-Z when exiting ZZ sleep mode. Document #: 38-05383 Rev. *E CY7C1440AV33 CY7C1442AV33 CY7C1446AV33...
  • Page 25: Ordering Information

    CY7C1440AV33-167BZC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) CY7C1442AV33-167BZC CY7C1440AV33-167BZXC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free CY7C1442AV33-167BZXC CY7C1446AV33-167BGC 51-85167 209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)
  • Page 26 CY7C1440AV33-250BZC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) CY7C1442AV33-250BZC CY7C1440AV33-250BZXC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free CY7C1442AV33-250BZXC CY7C1446AV33-250BGC 51-85167 209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)
  • Page 27: Package Diagrams

    2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 1.40±0.05 12°±1°...
  • Page 28 (continued) 165-ball FBGA (15 x 17 x 1.4 mm) (51-85165) TOP VIEW PIN 1 CORNER SEATING PLANE Document #: 38-05383 Rev. *E 0.15(4X) CY7C1440AV33 CY7C1442AV33 CY7C1446AV33 PIN 1 CORNER BOTTOM VIEW Ø0.05 M C Ø0.25 M C A B Ø0.45±0.05(165X) 1.00...
  • Page 29 The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. CY7C1440AV33 CY7C1442AV33...
  • Page 30 Document History Page Document Title: CY7C1440AV33/CY7C1442AV33/CY7C1446AV33 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM Document Number: 38-05383 REV. ECN NO. Issue Date 124437 03/04/03 254910 See ECN 306335 See ECN 332173 See ECN 417547 See ECN Document #: 38-05383 Rev. *E Orig.
  • Page 31 Document Title: CY7C1440AV33/CY7C1442AV33/CY7C1446AV33 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM Document Number: 38-05383 Orig. of REV. ECN NO. Issue Date Change 473650 See ECN Document #: 38-05383 Rev. *E Description of Change Added the Maximum Rating for Supply Voltage on V...

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