Cypress Semiconductor CY7C1410AV18 Specification Sheet

36-mbit qdr-ii sram 2-word burst architecture

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Features
Separate independent read and write data ports
Supports concurrent transactions
250 MHz clock for high bandwidth
2-word burst on all accesses
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 500 MHz) at 250 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
Available in x8, x9, x18, and x36 configurations
Full data coherency, providing most current data
Core V
= 1.8V (±0.1V); IO V
DD
Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1410AV18 – 4M x 8
CY7C1425AV18 – 4M x 9
CY7C1412AV18 – 2M x 18
CY7C1414AV18 – 1M x 36
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
Cypress Semiconductor Corporation
Document #: 38-05615 Rev. *E
= 1.4V to V
DDQ
DD
250 MHz
250
x8
800
x9
800
x18
850
x36
1000
198 Champion Court
CY7C1410AV18, CY7C1425AV18
CY7C1412AV18, CY7C1414AV18
36-Mbit QDR™-II SRAM 2-Word

Functional Description

The CY7C1410AV18, CY7C1425AV18, CY7C1412AV18, and
CY7C1414AV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR-II architecture. QDR-II architecture consists
of two separate ports: the read port and the write port to access
the memory array. The read port has data outputs to support read
operations and the write port has data inputs to support write
operations. QDR-II architecture has separate data inputs and
data outputs to completely eliminate the need to "turn-around"
the data bus required with common IO devices. Access to each
port is accomplished through a common address bus. The read
address is latched on the rising edge of the K clock and the write
address is latched on the rising edge of the K clock. Accesses to
the QDR-II read and write ports are completely independent of
one another. To maximize data throughput, both read and write
ports are provided with DDR interfaces. Each address location
is associated with two 8-bit words (CY7C1410AV18), 9-bit words
(CY7C1425AV18), 18-bit words (CY7C1412AV18), or 36-bit
words (CY7C1414AV18) that burst sequentially into or out of the
device. Because data can be transferred into and out of the
device on every rising edge of both input clocks (K and K and C
and C), memory bandwidth is maximized while simplifying
system design by eliminating bus "turn-arounds."
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
200 MHz
167 MHz
200
700
700
725
850
,
San Jose
CA 95134-1709
Burst Architecture
Unit
167
MHz
620
mA
620
650
740
408-943-2600
Revised June 13, 2008
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Summary of Contents for Cypress Semiconductor CY7C1410AV18

  • Page 1: Functional Description

    To maximize data throughput, both read and write ports are provided with DDR interfaces. Each address location is associated with two 8-bit words (CY7C1410AV18), 9-bit words (CY7C1425AV18), 18-bit words (CY7C1412AV18), or 36-bit words (CY7C1414AV18) that burst sequentially into or out of the device.
  • Page 2 Logic Block Diagram (CY7C1410AV18) [7:0] Address (20:0) Register Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1425AV18) [8:0] Address (20:0) Register Gen. DOFF Control Logic Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 Write Write Address Register Control Logic Read Data Reg.
  • Page 3 Control Logic [1:0] Logic Block Diagram (CY7C1414AV18) [35:0] Address (18:0) Register Gen. DOFF Control Logic [3:0] Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 Write Write Address Register Control Logic Read Data Reg. Reg. Reg. Reg. Write Write Address...
  • Page 4: Pin Configuration

    Pin Configuration The pin configuration for CY7C1410AV18, CY7C1425AV18, CY7C1412AV18, and CY7C1414AV18 follow. NC/72M DOFF NC/72M DOFF Note 1. NC/72M, NC/144M, and NC/288M are not connected to the die and can be tied to any voltage level. Document #: 38-05615 Rev. *E...
  • Page 5 Pin Configuration (continued) The pin configuration for CY7C1410AV18, CY7C1425AV18, CY7C1412AV18, and CY7C1414AV18 follow. NC/144M DOFF NC/288M NC/72M DOFF Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout CY7C1412AV18 (2M x 18)
  • Page 6: Pin Definitions

    Synchronous Internally, the device is organized as 4M x 8 (2 arrays each of 2M x 8) for CY7C1410AV18, 4M x 9 (2 arrays each of 2M x 9) for CY7C1425AV18, 2M x 18 (2 arrays each of 1M x 18) for CY7C1412AV18 and 1M x 36 (2 arrays each of 512K x 36) for CY7C1414AV18.
  • Page 7 Power Supply Power Supply Inputs to the Core of the Device. Ground Ground for the Device. Power Supply Power Supply Inputs for the Outputs of the Device. Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 Pin Description Switching Characteristics on page 23.
  • Page 8: Functional Overview

    Each access consists of two 8-bit data transfers in the case of CY7C1410AV18, two 9-bit data transfers in the case of CY7C1425AV18, two 18-bit data transfers in the case of CY7C1412AV18, and two 36-bit data transfers in the case of CY7C1414AV18 in one clock cycle.
  • Page 9: Application Example

    Delayed K Delayed K# R = 50ohms Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 synchronized to the output clock (C/C) of the QDR-II. In single clock mode, CQ is generated with respect to K and CQ is generated with respect to K. The timing for the echo clocks is...
  • Page 10: Truth Table

    Truth Table The truth table for CY7C1410AV18, CY7C1425AV18, CY7C1412AV18, and CY7C1414AV18 follows. Operation Write Cycle: Load address on the rising edge of K; input write data on K and K rising edges. Read Cycle: Load address on the rising edge of K;...
  • Page 11 L–H – L–H – L–H – L–H – Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 [2, 8] Comments [2, 8] Comments – During the Data portion of a write sequence, all four bytes (D the device. L–H During the Data portion of a write sequence, all four bytes (D the device.
  • Page 12 TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 Instruction Register Three-bit instructions can be serially loaded into the instruction register.
  • Page 13 Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO pins.
  • Page 14: Tap Controller State Diagram

    The state diagram for the TAP controller follows. TEST-LOGIC RESET TEST-LOGIC/ IDLE Note 9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 SELECT DR-SCAN CAPTURE-DR SHIFT-DR EXIT1-DR PAUSE-DR...
  • Page 15 10. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the 11. Overshoot: V (AC) < V + 0.85V (Pulse width less than t 12. All Voltage referenced to Ground. Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 Bypass Register Instruction Register Identification Register Boundary Scan Register...
  • Page 16 14. Test conditions are specified using the load in TAP AC Test Conditions. t Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 Description [14] Figure 2.
  • Page 17: Instruction Codes

    RESERVED Do Not Use: This instruction is reserved for future use. BYPASS Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 Value CY7C1425AV18 CY7C1412AV18 00000110100...
  • Page 18 Boundary Scan Order Bit # Bump ID Bit # Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 Bump ID Bit # Bump ID Bit # Bump ID Internal Page 18 of 29 [+] Feedback...
  • Page 19 DLL. Unstable Clock Clock Start (Clock Starts after DOFF Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 DLL Constraints ■ DLL uses K clock as its synchronizing input. The input must have low phase jitter, which is specified as t ■...
  • Page 20: Maximum Ratings

    , whichever is larger, V 19. The operation current is calculated with 50% read cycle and 50% write cycle. Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 Current into Outputs (LOW) ...20 mA Static Discharge Voltage (MIL-STD-883, M. 3015) . > 2001V Latch-up Current ...
  • Page 21 Current AC Electrical Characteristics [11] Over the Operating Range Parameter Description Input HIGH Voltage Input LOW Voltage Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 Test Conditions Max V 250MHz (x8) Both Ports Deselected, (x9) ≥ V ≤ V...
  • Page 22: Thermal Resistance

    20. Unless otherwise noted, test conditions are based on signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250Ω, V pulse levels of 0.25V to 1.25V, and output loading of the specified I Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 Test Conditions = 25°C, f = 1 MHz, V...
  • Page 23: Switching Characteristics

    , are specified with a load capacitance of 5 pF as in part (b) of state voltage. 25. At any voltage and temperature t is less than t Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 Description [22] , BWS...
  • Page 24: Switching Waveforms

    28. In this example, if address A0 = A1, then data Q00 = D10 and Q01 = D11. Write data is forwarded immediately as read results. This note applies to the whole diagram. Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18...
  • Page 25: Ordering Information

    CY7C1414AV18-200BZI CY7C1410AV18-200BZXI CY7C1425AV18-200BZXI CY7C1412AV18-200BZXI CY7C1414AV18-200BZXI Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 Package Diagram Package Type 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
  • Page 26 CY7C1414AV18-167BZI CY7C1410AV18-167BZXI CY7C1425AV18-167BZXI CY7C1412AV18-167BZXI CY7C1414AV18-167BZXI Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 Package Diagram Package Type 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
  • Page 27: Package Diagram

    Figure 6. 165-Ball FBGA (15 x 17 x 1.4 mm), 51-85195 TOP VIEW PIN 1 CORNER SEATING PLANE Document #: 38-05615 Rev. *E CY7C1410AV18, CY7C1425AV18 CY7C1412AV18, CY7C1414AV18 0.15(4X) NOTES : SOLDER PAD TYPE : NON SOLDER MASK DEFINED (NSMD) PACKAGE WEIGHT : 0.65g JEDEC REFERENCE : MO-216 / DESIGN 4.6C...
  • Page 28 Document History Page Document Title: CY7C1410AV18/CY7C1425AV18/CY7C1412AV18/CY7C1414AV18, 36-Mbit QDR™-II SRAM 2-Word Burst Architecture Document Number: 38-05615 SUBMISSION ORIG. OF REV. ECN NO. DATE CHANGE 247331 See ECN 326519 See ECN 413953 See ECN 468029 See ECN 1274725 See ECN VKN/AESA Modified footnote# 30 Document #: 38-05615 Rev.
  • Page 29 Document History Page Document Title: CY7C1410AV18/CY7C1425AV18/CY7C1412AV18/CY7C1414AV18, 36-Mbit QDR™-II SRAM 2-Word Burst Architecture Document Number: 38-05615 2511746 See ECN VKN/AESA Updated Logic Block diagrams Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at cypress.com/sales.

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