Cypress Semiconductor CY7C1471BV25 Specification Sheet

72-mbit (2m x 36/4m x 18/1m x 72) flow-through sram with nobl architecture

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Features
No Bus Latency™ (NoBL™) architecture eliminates dead
cycles between write and read cycles
Supports up to 133 MHz bus operations with zero wait states
Data transfers on every clock
Pin compatible and functionally equivalent to ZBT™ devices
Internally self timed output buffer control to eliminate the need
to use OE
Registered inputs for flow through operation
Byte Write capability
2.5V IO supply (V
)
DDQ
Fast clock-to-output times
6.5 ns (for 133-MHz device)
Clock Enable (CEN) pin to enable clock and suspend operation
Synchronous self timed writes
Asynchronous Output Enable (OE)
CY7C1471BV25, CY7C1473BV25 available in
JEDEC-standard Pb-free 100-pin TQFP, Pb-free and
non-Pb-free 165-ball FBGA package. CY7C1475BV25
available in Pb-free and non-Pb-free 209-ball FBGA package.
Three Chip Enables (CE
, CE
1
expansion.
Automatic power down feature available using ZZ mode or CE
deselect.
IEEE 1149.1 JTAG Boundary Scan compatible
Burst Capability - linear or interleaved burst order
Low standby power
Selection Guide
Description
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Cypress Semiconductor Corporation
Document #: 001-15013 Rev. *E
Flow-Through SRAM with NoBL™ Architecture
, CE
) for simple depth
2
3
133 MHz
6.5
305
120
198 Champion Court
CY7C1473BV25, CY7C1475BV25
72-Mbit (2M x 36/4M x 18/1M x 72)

Functional Description

The CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25
are 2.5V, 2M x 36/4M x 18/1M x 72 synchronous flow through
burst SRAMs designed specifically to support unlimited true
back-to-back read or write operations without the insertion of
wait states. The CY7C1471BV25, CY7C1473BV25, and
CY7C1475BV25 are equipped with the advanced No Bus
Latency (NoBL) logic required to enable consecutive read or
write operations with data transferred on every clock cycle. This
feature dramatically improves the throughput of data through the
SRAM, especially in systems that require frequent write-read
transitions.
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. The clock input is qualified by the
Clock Enable (CEN) signal, which when deasserted suspends
operation and extends the previous clock cycle. Maximum
access delay from the clock rise is 6.5 ns (133-MHz device).
Write operations are controlled by two or four Byte Write Select
(BW
) and a Write Enable (WE) input. All writes are conducted
X
with on-chip synchronous self timed write circuitry.
Three synchronous Chip Enables (CE
asynchronous Output Enable (OE) provide easy bank selection
and output tri-state control. To avoid bus contention, the output
drivers are synchronously tri-stated during the data portion of a
write sequence.
For best practice recommendations, refer to the Cypress appli-
cation note
AN1064, SRAM System Guidelines.
100 MHz
8.5
275
120
,
San Jose
CA 95134-1709
CY7C1471BV25
, CE
, CE
) and an
1
2
3
Unit
ns
mA
mA
408-943-2600
Revised February 29, 2008
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Summary of Contents for Cypress Semiconductor CY7C1471BV25

  • Page 1: Functional Description

    SRAMs designed specifically to support unlimited true back-to-back read or write operations without the insertion of wait states. The CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25 are equipped with the advanced No Bus Latency (NoBL) logic required to enable consecutive read or write operations with data transferred on every clock cycle.
  • Page 2 Logic Block Diagram – CY7C1471BV25 (2M x 36) ADDRESS A0, A1, A REGISTER MODE ADV/LD READ LOGIC Logic Block Diagram – CY7C1473BV25 (4M x 18) ADDRESS A0, A1, A REGISTER MODE ADV/LD BW A BW B Document #: 001-15013 Rev. *E...
  • Page 3 LOGIC ADV/LD WRITE ADDRESS REGISTER 2 MEMORY WRITE DRIVERS WRITE REGISTRY AND DATA COHERENCY CONTROL LOGIC REGISTER 1 CY7C1471BV25 ARRAY INPUT INPUT REGISTER 0 Page 3 of 30 DQ s DQ Pa DQ Pb DQ Pc DQ Pd DQ Pe...
  • Page 4: Pin Configurations

    Pin Configurations BYTE C BYTE D Document #: 001-15013 Rev. *E CY7C1473BV25, CY7C1475BV25 Figure 1. 100- Pin TQFP Pinout CY7C1471BV25 CY7C1471BV25 BYTE B BYTE A Page 4 of 30 [+] Feedback...
  • Page 5 Pin Configurations (continued) BYTE B Document #: 001-15013 Rev. *E CY7C1473BV25, CY7C1475BV25 Figure 2. 100-Pin TQFP Pinout CY7C1473BV25 CY7C1471BV25 BYTE A Page 5 of 30 [+] Feedback...
  • Page 6 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout NC/576M NC/1G NC/144M MODE NC/576M NC/1G NC/144M MODE Document #: 001-15013 Rev. *E CY7C1473BV25, CY7C1475BV25 CY7C1471BV25 (2M x 36) CY7C1473BV25 (4M x 18) CY7C1471BV25 ADV/LD NC/288M ADV/LD NC/288M Page 6 of 30 [+] Feedback...
  • Page 7 209-Ball FBGA (14 x 22 x 1.76 mm) Pinout DQPg DQPc DQPd DQPh NC/144M Document #: 001-15013 Rev. *E CY7C1473BV25, CY7C1475BV25 CY7C1475BV25 (1M × 72) ADV/LD NC/576M NC/1G MODE CY7C1471BV25 DQPf DQPb DQPa DQPe NC/288M Page 7 of 30 [+] Feedback...
  • Page 8 CE to select or deselect the device. and DQP are placed in a tri-state condition.The outputs are automatically is controlled by BW correspondingly. CY7C1471BV25 . During or left floating selects inter- Page 8 of 30 [+] Feedback...
  • Page 9: Functional Overview

    No Connects. Not internally connected to the die. 144M, 288M, 576M, and 1G are address expansion pins and are not internally connected to the die. Functional Overview The CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25 are synchronous flow through burst SRAMs designed specifi- cally to eliminate wait states during write read transitions. All synchronous inputs pass through input registers controlled by the rising edge of the clock.
  • Page 10: Sleep Mode

    OE. Burst Write Accesses The CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25 have an on-chip burst counter that makes it possible to supply a single address and conduct up to four Write operations without reasserting the address inputs.
  • Page 11 Table 4. Truth Table The truth table for CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25 follows. Address Operation Used Deselect Cycle None Deselect Cycle None Deselect Cycle None Continue Deselect Cycle None Read Cycle External (Begin Burst) Read Cycle Next (Continue Burst) NOP/Dummy Read...
  • Page 12 Table 5. Truth Table for Read/Write The read-write truth table for CY7C1471BV25 follows. Function Read Write No bytes written Write Byte A – (DQ and DQP Write Byte B – (DQ and DQP Write Byte C – (DQ and DQP Write Byte D –...
  • Page 13: Test Access Port (Tap)

    IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25 incorporate a serial boundary scan Test Access Port (TAP). This port operates in accordance with IEEE Standard 1149.1-1990 but does not have the set of functions required for full 1149.1 compliance.
  • Page 14 Capture-DR state, an input or output may undergo a transition. The TAP may then try to capture a signal while in transition (metastable state). This does not harm the device, but there is CY7C1471BV25 SAMPLE/PRELOAD instruction, Page 14 of 30...
  • Page 15 Do not use these instructions. Figure 5. TAP Timing t TH t CY C t TM SS t TM SH t TDIS t TDIH t TDOX DON’T CA RE UNDEFINED CY7C1471BV25 t TDOV Page 15 of 30 [+] Feedback...
  • Page 16 = 2.5V = 1.0 mA, V = 2.5V = 100 µA, V = 2.5V = 2.5V = 2.5V GND < V < V = 1 ns. CY7C1471BV25 Unit 1.25V 50Ω Z = 50Ω 20pF Unit + 0.3 –0.3 –5 µA...
  • Page 17 Table 8. Identification Register Definitions CY7C1471BV25 Instruction Field (2MX36) Revision Number (31:29) Device Depth (28:24) Architecture/Memory Type(23:18) Bus Width/Density(17:12) Cypress JEDEC ID Code (11:1) 00000110100 ID Register Presence Indicator (0) Table 9. Scan Register Sizes Register Name Instruction Bypass Boundary Scan Order – 165FBGA Boundary Scan Order –...
  • Page 18 Bit # 165-Ball ID Bit # Document #: 001-15013 Rev. *E CY7C1473BV25, CY7C1475BV25 165-Ball ID Bit # 165-Ball ID 165-Ball ID Bit # 165-Ball ID CY7C1471BV25 Bit # 165-Ball ID Bit # 165-Ball ID Page 18 of 30 [+] Feedback...
  • Page 19 Table 13. Boundary Scan Exit Order (1M x 72) Bit # 209-Ball ID Bit # Document #: 001-15013 Rev. *E CY7C1473BV25, CY7C1475BV25 209-Ball ID Bit # 209-Ball ID CY7C1471BV25 Bit # 209-Ball ID Page 19 of 30 [+] Feedback...
  • Page 20: Maximum Ratings

    ≤ 0.3V, – 0.3V or V /2). Undershoot: V (AC) > –2V (pulse width less than t (min.) within 200 ms. During this time V < V and V CY7C1471BV25 + 0.5V Ambient Temperature 0°C to +70°C 2.5V –5%/+5% 2.5V–5% to –40°C to +85°C...
  • Page 21: Thermal Resistance

    EIA/JESD51. Figure 7. AC Test Loads and Waveforms R = 1667Ω 2.5V OUTPUT 5 pF R = 1538Ω INCLUDING JIG AND SCOPE CY7C1471BV25 100 TQFP 165 FBGA 209 FBGA 100 TQFP 165 FBGA 209 FBGA Package Package Package 24.63...
  • Page 22: Switching Characteristics

    SRAMs when sharing the same data OELZ CY7C1471BV25 “AC Test Loads and 133 MHz 100 MHz 21. Transition is measured ±200 mV Page 22 of 30...
  • Page 23: Switching Waveforms

    READ BURST W RITE Q(A3) Q(A4) READ D(A2+1) Q(A4+1) DON’T CARE UNDEFINED is LOW. When CE is HIGH, CE is HIGH, CE CY7C1471BV25 t OEV t CHZ Q(A4+1) D(A5) Q(A6) D(A7) t DOH t OELZ W RITE READ W RITE...
  • Page 24 CY7C1473BV25, CY7C1475BV25 [19, 20, 22] Figure 9. NOP, STALL and DESELECT Cycles Q(A2) Q(A3) STALL READ WRITE STALL Q(A3) D(A4) DON’T CARE UNDEFINED CY7C1471BV25 t CHZ D(A4) Q(A5) t DOH READ DESELECT CONTINUE Q(A5) DESELECT Page 24 of 30 [+] Feedback...
  • Page 25 [23, 24] Figure 10. ZZ Mode Timing DDZZ High-Z DON’T CARE “Truth Table” on page 11 for all possible signal conditions to deselect the device. CY7C1471BV25 t ZZREC t RZZI DESELECT or READ Only Page 25 of 30 [+] Feedback...
  • Page 26: Ordering Information

    Speed Package (MHz) Ordering Code Diagram CY7C1471BV25-133AXC 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free CY7C1473BV25-133AXC CY7C1471BV25-133BZC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) CY7C1473BV25-133BZC CY7C1471BV25-133BZXC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free...
  • Page 27: Package Diagrams

    2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS CY7C1471BV25 1.40±0.05 12°±1° SEE DETAIL (8X) 0.20 MAX.
  • Page 28 Figure 12. 165-Ball FBGA (15 x 17 x 1.4 mm), 51-85165 TOP VIEW PIN 1 CORNER SEATING PLANE Document #: 001-15013 Rev. *E CY7C1473BV25, CY7C1475BV25 0.15(4X) CY7C1471BV25 PIN 1 CORNER BOTTOM VIEW Ø0.05 M C Ø0.25 M C A B Ø0.45±0.05(165X) 1.00 5.00...
  • Page 29 CY7C1471BV25 CY7C1473BV25, CY7C1475BV25 Package Diagrams (continued) Figure 13. 209-Ball FBGA (14 x 22 x 1.76 mm), 51-85167 51-85167-** Document #: 001-15013 Rev. *E Page 29 of 30 [+] Feedback...
  • Page 30 Document History Page Document Title: CY7C1471BV25/CY7C1473BV25/CY7C1475BV25, 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL™ Architecture Document Number: 001-15013 Issue Orig. of REV. ECN NO. Date Change 1024500 See ECN VKN/KKVTMP New Data Sheet 1274731 See ECN...

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