Cypress Semiconductor CY7C1422BV18 Specification Sheet

Features
■ 36-Mbit density (4M x 8, 4M x 9, 2M x 18, 1M x 36)
■ 300 MHz clock for high bandwidth
■
2-word burst for reducing address bus frequency
■ Double Data Rate (DDR) interfaces
(data transferred at 600 MHz) at 300 MHz
■ Two input clocks (K and K) for precise DDR timing
❐ SRAM uses rising edges only
■
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
■ Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
■ Synchronous internally self-timed writes
■ DDR-II operates with 1.5 cycle read latency when the DLL is
enabled
■
Operates similar to a DDR-I device with 1 cycle read latency in
DLL off mode
■ 1.8V core power supply with HSTL inputs and outputs
■ Variable drive HSTL output buffers
■
Expanded HSTL output voltage (1.4V–V
■ Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)
■ Offered in both Pb-free and non Pb-free packages
■ JTAG 1149.1 compatible test access port
■ Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1422BV18 – 4M x 8
CY7C1429BV18 – 4M x 9
CY7C1423BV18 – 2M x 18
CY7C1424BV18 – 1M x 36
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
Cypress Semiconductor Corporation
Document #: 001-07035 Rev. *D
36-Mbit DDR-II SIO SRAM 2-Word
)
DD
300 MHz 278 MHz
300 278
x8 825 775
x9 845 775
x18 880 815
x36 980 890
• 198 Champion Court
CY7C1422BV18, CY7C1429BV18
CY7C1423BV18, CY7C1424BV18
Burst Architecture

Functional Description

The CY7C1422BV18, CY7C1429BV18, CY7C1423BV18, and
CY7C1424BV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with Double Data Rate Separate IO (DDR-II SIO)
architecture. The DDR-II SIO consists of two separate ports: the
read port and the write port to access the memory array. The
read port has data outputs to support read operations and the
write port has data inputs to support write operations. The DDR-II
SIO has separate data inputs and data outputs to completely
eliminate the need to "turn-around" the data bus required with
common IO devices. Access to each port is accomplished
through a common address bus. Addresses for read and write
are latched on alternate rising edges of the input (K) clock. Write
data is registered on the rising edges of both K and K. Read data
is driven on the rising edges of C and C if provided, or on the
rising edge of K and K if C/C are not provided. Each address
location is associated with two 8-bit words in the case of
CY7C1422BV18, two 9-bit
CY7C1429BV18, two 18-bit
CY7C1423BV18, and two 36-bit words in the case of
CY7C1424BV18 that burst sequentially into or out of the device.
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs are tightly matched to the
two output echo clocks CQ/CQ, eliminating the need to capture
data separately from each individual DDR-II SIO SRAM in the
system design. Output data clocks (C/C) enable maximum
system clocking and data synchronization flexibility.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
250 MHz 200 MHz
250 200
700 600
700 600
740 600
800 665
,
• San Jose CA 95134-1709
words in the case of
words in the case of
167 MHz Unit
167 MHz
500 mA
500
500
560
• 408-943-2600
Revised June 16, 2008
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