Cypress Semiconductor CY7C1411JV18 Specification Sheet

36-mbit qdr-ii sram 4-word burst architecture

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Features
Separate independent read and write data ports
Supports concurrent transactions
300 MHz clock for high bandwidth
4-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 600 MHz) at 300 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
QDR-II operates with 1.5 cycle read latency when DLL is
enabled
Operates similar to a QDR-I device with 1 cycle read latency
in DLL off mode
Available in x 8, x 9, x 18, and x 36 configurations
Full data coherency, providing most current data
Core V
= 1.8 (±0.1V); IO V
DD
Available in 165-ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Selection Guide
Maximum Operating Frequency
Maximum Operating Current
Cypress Semiconductor Corporation
Document Number: 001-12557 Rev. *C
= 1.4V to V
DDQ
DD
300 MHz
300
x8
965
x9
970
x18
1010
x36
1130
198 Champion Court
CY7C1411JV18, CY7C1426JV18
CY7C1413JV18, CY7C1415JV18
36-Mbit QDR™-II SRAM 4-Word
Configurations
CY7C1411JV18 – 4M x 8
CY7C1426JV18 – 4M x 9
CY7C1413JV18 – 2M x 18
CY7C1415JV18 – 1M x 36

Functional Description

The CY7C1411JV18, CY7C1426JV18, CY7C1413JV18, and
CY7C1415JV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II architecture. QDR-II architecture
consists of two separate ports to access the memory array. The
read port has dedicated data outputs to support the read opera-
tions and the write port has dedicated data inputs to support the
write operations. QDR-II architecture has separate data inputs
and data outputs to completely eliminate the need to "turn
around" the data bus required with common IO devices. Access
to each port is through a common address bus. Addresses for
read and write addresses are latched on alternate rising edges
of the input (K) clock. Accesses to the QDR-II read and write
ports are completely independent of one another. To maximize
data throughput, read and write ports are equipped with DDR
interfaces. Each address location is associated with four 8-bit
words (CY7C1411JV18), 9-bit words (CY7C1426JV18), 18-bit
words (CY7C1413JV18), or 36-bit words (CY7C1415JV18) that
burst sequentially into or out of the device. Because data can be
transferred into and out of the device on every rising edge of both
input clocks (K and K and C and C), memory bandwidth is
maximized while simplifying system design by eliminating bus
"turn arounds".
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on chip
synchronous self-timed write circuitry.
250 MHz
250
745
760
790
870
,
San Jose
CA 95134-1709
Burst Architecture
200 MHz
Unit
200
MHz
620
mA
620
655
715
408-943-2600
Revised June 25, 2008
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Summary of Contents for Cypress Semiconductor CY7C1411JV18

  • Page 1: Functional Description

    DDR interfaces. Each address location is associated with four 8-bit words (CY7C1411JV18), 9-bit words (CY7C1426JV18), 18-bit words (CY7C1413JV18), or 36-bit words (CY7C1415JV18) that burst sequentially into or out of the device. Because data can be...
  • Page 2 Logic Block Diagram (CY7C1411JV18) [7:0] Address (19:0) Register Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1426JV18) [8:0] Address (19:0) Register Gen. DOFF Control Logic Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 Write Write Write Write Address Register...
  • Page 3 Control Logic [1:0] Logic Block Diagram (CY7C1415JV18) [35:0] Address (17:0) Register Gen. DOFF Control Logic [3:0] Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 Write Write Write Write Address Register Control Logic Read Data Reg. Reg. Reg. Reg. Write...
  • Page 4: Pin Configuration

    Pin Configuration The pin configuration for CY7C1411JV18, CY7C1413JV18, and CY7C1415JV18 follows. NC/72M DOFF NC/72M DOFF Note 1. NC/72M, NC/144M, and NC/288M are not connected to the die and can be tied to any voltage level. Document Number: 001-12557 Rev. *C...
  • Page 5 Pin Configuration The pin configuration for CY7C1411JV18, CY7C1413JV18, and CY7C1415JV18 follows. NC/144M DOFF NC/288M NC/72M DOFF Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout CY7C1413JV18 (2M x 18) NC/288M CY7C1415JV18 (1M x 36)
  • Page 6: Pin Definitions

    Internally, the device is organized as 4M x 8 (4 arrays each of 1M x 8) for CY7C1411JV18, 4M x 9 (4 arrays each of 1M x 9) for CY7C1426JV18, 2M x 18 (4 arrays each of 512K x 18) for CY7C1413JV18 and 1M x 36 (4 arrays each of 256K x 36) for CY7C1415JV18.
  • Page 7 Ground for the Device. Power Supply Power Supply Inputs for the Outputs of the Device. Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 Pin Description output impedance are set to 0.2 x RQ, where RQ is a resistor connected...
  • Page 8: Functional Overview

    Single Clock Mode The CY7C1411JV18 can be used with a single clock that controls both the input and output registers. In this mode the device recognizes only a single pair of input clock (K and K) that control both the input and output registers.
  • Page 9: Application Example

    Delayed K Delayed K# R = 50ohms Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 of ±15% is between 175Ω and 350Ω output impedance is adjusted every 1024 cycles upon power up to account for drifts in supply voltage and temperature.
  • Page 10: Truth Table

    Truth Table The truth table for CY7C1411JV18, CY7C1426JV18, CY7C1413JV18, and CY7C1415JV18 follows. Operation RPS WPS Write Cycle: Load address on the rising edge of K; input write data on two consecutive K and K rising edges. Read Cycle: Load address on the rising edge of K;...
  • Page 11 – L–H – L–H – L–H – Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 [2, 10] [2, 10] Comments – During the data portion of a write sequence, all four bytes (D the device. L–H During the data portion of a write sequence, all four bytes (D the device.
  • Page 12 TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 Instruction Register Three-bit instructions can be serially loaded into the instruction register.
  • Page 13 TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins. Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 PRELOAD places an initial data pattern at the latched parallel outputs of the boundary scan register cells before the selection of another boundary scan test operation.
  • Page 14: Tap Controller State Diagram

    The state diagram for the TAP controller follows. TEST-LOGIC RESET TEST-LOGIC/ IDLE Note 11. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 [11] SELECT DR-SCAN CAPTURE-DR SHIFT-DR EXIT1-DR...
  • Page 15 12. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the 13. Overshoot: V (AC) < V + 0.85V (Pulse width less than t 14. All Voltage referenced to Ground. Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 Bypass Register Instruction Register Identification Register Boundary Scan Register...
  • Page 16 16. Test conditions are specified using the load in TAP AC Test Conditions. t Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 Description [16] Figure 2.
  • Page 17: Instruction Codes

    RESERVED Do Not Use: This instruction is reserved for future use. BYPASS Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 Value CY7C1426JV18 CY7C1413JV18 00000110100...
  • Page 18 Boundary Scan Order Bit # Bump ID Bit # Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 Bump ID Bit # Bump ID Bit # Bump ID Internal Page 18 of 28 [+] Feedback...
  • Page 19 DLL. Unstable Clock Clock Start (Clock Starts after DOFF Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 DLL Constraints ■ DLL uses K clock as its synchronizing input. The input must have low phase jitter, which is specified as t ■...
  • Page 20: Maximum Ratings

    , whichever is larger, V 21. The operation current is calculated with 50% read cycle and 50% write cycle. Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 Current into Outputs (LOW) ... 20 mA Static Discharge Voltage (MIL-STD-883, M. 3015).. > 2001V Latch Up Current ...
  • Page 21 Current AC Electrical Characteristics [13] Over the Operating Range Parameter Description Input HIGH Voltage Input LOW Voltage Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 Test Conditions Max V 300 MHz (x8) Both Ports Deselected, (x9) ≥ V ≤ V...
  • Page 22: Thermal Resistance

    22. Unless otherwise noted, test conditions are based on signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250Ω, V pulse levels of 0.25V to 1.25V, and output loading of the specified I Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 Test Conditions = 25°C, f = 1 MHz, V...
  • Page 23: Switching Characteristics

    25. t , are specified with a load capacitance of 5 pF as in (b) of 26. At any given voltage and temperature t is less than t Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 Description [23] , BWS...
  • Page 24: Switching Waveforms

    29. In this example, if address A2 = A1, then data Q20 = D10 and Q21 = D11. Write data is forwarded immediately as read results. This note applies to the whole diagram. Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18...
  • Page 25: Ordering Information

    CY7C1415JV18-250BZI CY7C1411JV18-250BZXI CY7C1426JV18-250BZXI CY7C1413JV18-250BZXI CY7C1415JV18-250BZXI Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 Package Diagram Package Type 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
  • Page 26 CY7C1415JV18-200BZI CY7C1411JV18-200BZXI CY7C1426JV18-200BZXI CY7C1413JV18-200BZXI CY7C1415JV18-200BZXI Document Number: 001-12557 Rev. *C CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 Package Diagram Package Type 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
  • Page 27: Package Diagram

    CY7C1411JV18, CY7C1426JV18 CY7C1413JV18, CY7C1415JV18 Package Diagram Figure 6. 165-Ball FBGA (15 x 17 x 1.40 mm), 51-85195 51-85195-*A Document Number: 001-12557 Rev. *C Page 27 of 28 [+] Feedback...
  • Page 28 Document History Page Document Title: CY7C1411JV18/CY7C1426JV18/CY7C1413JV18/CY7C1415JV18, 36-Mbit QDR™-II SRAM 4-Word Burst Architecture Document Number: 001-12557 ISSUE ORIG. OF REV. ECN NO. DATE CHANGE 808457 See ECN 1462587 See ECN VKN/AESA Converted from preliminary to final 2189567 See ECN VKN/AESA Minor Change-Moved to the external web...

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