Cypress Semiconductor Perform CY7C1413BV18 Manual

36-mbit qdr-ii sram 4-word burst architecture

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Features
Separate independent read and write data ports
Supports concurrent transactions
300 MHz clock for high bandwidth
4-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 600 MHz) at 300 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
QDR-II operates with 1.5 cycle read latency when DLL is
enabled
Operates as a QDR-I device with 1 cycle read latency in DLL
off mode
Available in x 8, x 9, x 18, and x 36 configurations
Full data coherency, providing most current data
Core V
= 1.8 (±0.1V); IO V
DD
Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
Cypress Semiconductor Corporation
Document Number: 001-07037 Rev. *D
= 1.4V to V
DDQ
DD
300 MHz
278 MHz
300
x8
885
x9
900
x18
940
x36
1040
198 Champion Court
CY7C1411BV18, CY7C1426BV18
CY7C1413BV18, CY7C1415BV18
36-Mbit QDR™-II SRAM 4-Word
Configurations
CY7C1411BV18 – 4M x 8
CY7C1426BV18 – 4M x 9
CY7C1413BV18 – 2M x 18
CY7C1415BV18 – 1M x 36

Functional Description

The CY7C1411BV18, CY7C1426BV18, CY7C1413BV18, and
CY7C1415BV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II architecture. QDR-II architecture
consists of two separate ports to access the memory array. The
read port has dedicated data outputs to support the read opera-
tions and the write port has dedicated data inputs to support the
write operations. QDR-II architecture has separate data inputs
and data outputs to completely eliminate the need to
"turn-around" the data bus required with common IO devices.
Access to each port is through a common address bus.
Addresses for read and write addresses are latched on alternate
rising edges of the input (K) clock. Accesses to the QDR-II read
and write ports are completely independent of one another. To
maximize data throughput, read and write ports are equipped
with DDR interfaces. Each address location is associated with
four
8-bit
words
(CY7C1426BV18), 18-bit words (CY7C1413BV18), or 36-bit
words (CY7C1415BV18) that burst sequentially into or out of the
device. Because data can be transferred into and out of the
device on every rising edge of both input clocks (K and K and C
and C), memory bandwidth is maximized while simplifying
system design by eliminating bus "turn-arounds."
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on chip
synchronous self-timed write circuitry.
250 MHz
200 MHz
278
250
815
745
830
760
865
790
950
870
,
San Jose
CA 95134-1709
Burst Architecture
(CY7C1411BV18),
9-bit
167 MHz
200
167
620
535
620
535
655
565
715
615
408-943-2600
Revised June 16, 2008
words
Unit
MHz
mA
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Summary of Contents for Cypress Semiconductor Perform CY7C1413BV18

  • Page 1: Functional Description

    Features ■ Separate independent read and write data ports ❐ Supports concurrent transactions ■ 300 MHz clock for high bandwidth ■ 4-word burst for reducing address bus frequency ■ Double Data Rate (DDR) interfaces on both read and write ports (data transferred at 600 MHz) at 300 MHz ■...
  • Page 2 Logic Block Diagram (CY7C1411BV18) [7:0] Address (19:0) Register Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1426BV18) [8:0] Address (19:0) Register Gen. DOFF Control Logic Document Number: 001-07037 Rev. *D CY7C1411BV18, CY7C1426BV18 CY7C1413BV18, CY7C1415BV18 Write Write Write Write Address Register Control Logic Read Data Reg.
  • Page 3 Logic Block Diagram (CY7C1413BV18) [17:0] Address (18:0) Register Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1415BV18) [35:0] Address (17:0) Register Gen. DOFF Control Logic [3:0] Document Number: 001-07037 Rev. *D CY7C1411BV18, CY7C1426BV18 CY7C1413BV18, CY7C1415BV18 Write Write Write Write Address Register Control Logic...
  • Page 4: Pin Configuration

    Pin Configuration The pin configuration for CY7C1411BV18, CY7C1426BV18, CY7C1413BV18, and CY7C1415BV18 follow. NC/72M DOFF NC/72M DOFF Note 1. NC/72M, NC/144M and NC/288M are not connected to the die and can be tied to any voltage level. Document Number: 001-07037 Rev. *D CY7C1411BV18, CY7C1426BV18 CY7C1413BV18, CY7C1415BV18 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout...
  • Page 5 Pin Configuration (continued) The pin configuration for CY7C1411BV18, CY7C1426BV18, CY7C1413BV18, and CY7C1415BV18 follow. NC/144M DOFF NC/288M NC/72M DOFF Document Number: 001-07037 Rev. *D CY7C1411BV18, CY7C1426BV18 CY7C1413BV18, CY7C1415BV18 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout CY7C1413BV18 (2M x 18) NC/288M CY7C1415BV18 (1M x 36) NC/72M...
  • Page 6: Pin Definitions

    Pin Definitions Pin Name Input- Data Input Signals. Sampled on the rising edge of K and K clocks when valid write operations are active. [x:0] CY7C1411BV18 − D Synchronous CY7C1426BV18 − D CY7C1413BV18 − D CY7C1415BV18 − D Write Port Select − Active LOW. Sampled on the rising edge of the K clock. When asserted active, a Input- Synchronous write operation is initiated.
  • Page 7 Pin Definitions (continued) Pin Name Echo Clock CQ Referenced with Respect to C. This is a free running clock and is synchronized to the input clock for output data (C) of the QDR-II. In the single clock mode, CQ is generated with respect to K. The timings for the echo clocks are shown in the AC timing table.
  • Page 8: Functional Overview

    Functional Overview The CY7C1411BV18, CY7C1426BV18, CY7C1413BV18 and CY7C1415BV18 are synchronous pipelined burst SRAMs with a read port and a write port. The read port is dedicated to read operations and the write port is dedicated to write operations. Data flows into the SRAM through the write port and flows out through the read port.
  • Page 9: Application Example

    includes forwarding data from a write cycle that was initiated on the previous K clock rise. Read accesses and write access must be scheduled such that one transaction is initiated on any clock cycle. If both ports are selected on the same K clock rise, the arbitration depends on the previous state of the SRAM.
  • Page 10: Truth Table

    Truth Table The truth table for CY7C1411BV18, CY7C1426BV18, CY7C1413BV18, and CY7C1415BV18 follows. Operation RPS WPS Write Cycle: Load address on the rising edge of K; input write data on two consecutive K and K rising edges. Read Cycle: Load address on the rising edge of K;...
  • Page 11 Write Cycle Descriptions The write cycle description table for CY7C1426BV18 follows. L–H – During the Data portion of a write sequence, the single byte (D – L–H During the Data portion of a write sequence, the single byte (D L–H –...
  • Page 12 IEEE 1149.1 Serial Boundary Scan (JTAG) These SRAMs incorporate a serial boundary scan Test Access Port (TAP) in the FBGA package. This part is fully compliant with IEEE Standard #1149.1-2001. The TAP operates using JEDEC standard 1.8V IO logic levels. Disabling the JTAG Feature It is possible to operate the SRAM without using the JTAG feature.
  • Page 13 IDCODE The IDCODE instruction loads a vendor-specific, 32-bit code into the instruction register. It also places the instruction register between the TDI and TDO pins and shifts the IDCODE out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction is loaded into the instruction register at power up or whenever the TAP controller is Test-Logic-Reset state.
  • Page 14: Tap Controller State Diagram

    TAP Controller State Diagram The state diagram for the TAP controller follows. TEST-LOGIC RESET TEST-LOGIC/ IDLE Note 11. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 001-07037 Rev. *D CY7C1411BV18, CY7C1426BV18 CY7C1413BV18, CY7C1415BV18 [11]...
  • Page 15 TAP Controller Block Diagram Selection Circuitry TAP Electrical Characteristics [12, 13, 14] Over the Operating Range Parameter Description Output HIGH Voltage Output HIGH Voltage Output LOW Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage Input and Output Load Current Notes 12.
  • Page 16 TAP AC Switching Characteristics [15, 16] Over the Operating Range Parameter TCK Clock Cycle Time TCYC TCK Clock Frequency TCK Clock HIGH TCK Clock LOW Setup Times TMS Setup to TCK Clock Rise TMSS TDI Setup to TCK Clock Rise TDIS Capture Setup to TCK Rise Hold Times...
  • Page 17: Instruction Codes

    Identification Register Definitions Instruction Field CY7C1411BV18 Revision Number (31:29) Cypress Device ID 11010011011000111 11010011011001111 11010011011010111 11010011011100111 Defines the type of (28:12) Cypress JEDEC ID 00000110100 (11:1) ID Register Presence (0) Scan Register Sizes Register Name Instruction Bypass Boundary Scan Instruction Codes Instruction Code EXTEST...
  • Page 18 Boundary Scan Order Bit # Bump ID Bit # Document Number: 001-07037 Rev. *D CY7C1411BV18, CY7C1426BV18 CY7C1413BV18, CY7C1415BV18 Bump ID Bit # Bump ID Bit # Bump ID Internal Page 18 of 30 [+] Feedback...
  • Page 19 Power Up Sequence in QDR-II SRAM QDR-II SRAMs must be powered up and initialized in a predefined manner to prevent undefined operations. Power Up Sequence ■ Apply power and drive DOFF either HIGH or LOW (All other inputs can be HIGH or LOW). ❐...
  • Page 20: Maximum Ratings

    Maximum Ratings Exceeding maximum ratings may impair the useful life of the device. These user guidelines are not tested. Storage Temperature ... –65°C to +150°C Ambient Temperature with Power Applied.. –55°C to +125°C Supply Voltage on V Relative to GND ...–0.5V to +2.9V Supply Voltage on V Relative to GND...–0.5V to +V DC Applied to Outputs in High-Z ...
  • Page 21 Electrical Characteristics (continued) DC Electrical Characteristics [14] Over the Operating Range Parameter Description [21] Operating Supply Automatic Power down Current AC Electrical Characteristics [13] Over the Operating Range Parameter Description Input HIGH Voltage Input LOW Voltage Document Number: 001-07037 Rev. *D CY7C1411BV18, CY7C1426BV18 CY7C1413BV18, CY7C1415BV18 Test Conditions...
  • Page 22: Thermal Resistance

    Capacitance Tested initially and after any design or process change that may affect these parameters. Parameter Description Input Capacitance Clock Input Capacitance Output Capacitance Thermal Resistance Tested initially and after any design or process change that may affect these parameters. Parameter Description Θ...
  • Page 23: Switching Characteristics

    Switching Characteristics [22, 23] Over the Operating Range Cypress Consortium Description Parameter Parameter (Typical) to the First Access POWER K Clock and C Clock Cycle Time KHKH Input Clock (K/K; C/C) HIGH KHKL Input Clock (K/K; C/C) LOW KLKH K Clock Rise to K Clock Rise and C KHKH KHKH to C Rise (rising edge to rising edge)
  • Page 24 Switching Characteristics (continued) [22, 23] Over the Operating Range Cypress Consortium Description Parameter Parameter Output Times C/C Clock Rise (or K/K in single CHQV clock mode) to Data Valid Data Output Hold after Output C/C CHQX Clock Rise (Active to Active) C/C Clock Rise to Echo Clock Valid CCQO CHCQV...
  • Page 25: Switching Waveforms

    Switching Waveforms Figure 5. Read/Write/Deselect Sequence READ t KH t KL t HC t SA t HA t KHCH t KHCH t CYC t CQH t CQHCQH Notes 29. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0, that is, A0+1. 30.
  • Page 26: Ordering Information

    Ordering Information Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered. Speed (MHz) Ordering Code CY7C1411BV18-300BZC CY7C1426BV18-300BZC CY7C1413BV18-300BZC CY7C1415BV18-300BZC CY7C1411BV18-300BZXC CY7C1426BV18-300BZXC CY7C1413BV18-300BZXC CY7C1415BV18-300BZXC CY7C1411BV18-300BZI CY7C1426BV18-300BZI CY7C1413BV18-300BZI CY7C1415BV18-300BZI CY7C1411BV18-300BZXI...
  • Page 27 Ordering Information (continued) Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered. Speed (MHz) Ordering Code CY7C1411BV18-250BZC CY7C1426BV18-250BZC CY7C1413BV18-250BZC CY7C1415BV18-250BZC CY7C1411BV18-250BZXC CY7C1426BV18-250BZXC CY7C1413BV18-250BZXC CY7C1415BV18-250BZXC CY7C1411BV18-250BZI CY7C1426BV18-250BZI CY7C1413BV18-250BZI CY7C1415BV18-250BZI...
  • Page 28 Ordering Information (continued) Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered. Speed (MHz) Ordering Code CY7C1411BV18-167BZC CY7C1426BV18-167BZC CY7C1413BV18-167BZC CY7C1415BV18-167BZC CY7C1411BV18-167BZXC CY7C1426BV18-167BZXC CY7C1413BV18-167BZXC CY7C1415BV18-167BZXC CY7C1411BV18-167BZI CY7C1426BV18-167BZI CY7C1413BV18-167BZI CY7C1415BV18-167BZI...
  • Page 29: Package Diagram

    CY7C1411BV18, CY7C1426BV18 CY7C1413BV18, CY7C1415BV18 Package Diagram Figure 6. 165-ball FBGA (15 x 17 x 1.4 mm), 51-85195 51-85195-*A Document Number: 001-07037 Rev. *D Page 29 of 30 [+] Feedback...
  • Page 30 Document History Page Document Title: CY7C1411BV18/CY7C1426BV18/CY7C1413BV18/CY7C1415BV18, 36-Mbit QDR™-II SRAM 4-Word Burst Architecture Document Number: 001-07037 SUBMISSION ORIG. OF REV. ECN NO. DATE CHANGE 433267 See ECN 462004 See ECN 850381 See ECN 1523289 See ECN VKN/AESA Converted from preliminary to final, Updated Logic Block diagram, Updated 2478647 See ECN VKN/AESA Changed Ambient Temperature with Power Applied from “–10°C to +85°C”...

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