Cypress Semiconductor CY7C1460AV33 Specification Sheet

Cypress Semiconductor CY7C1460AV33 Specification Sheet

36-mbit (1m x 36/2m x 18/512k x 72) pipelined sram with nobl architecture

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Features
• Pin-compatible and functionally equivalent to ZBT™
• Supports 250-MHz bus operations with zero wait states
— Available speed grades are 250, 200 and 167 MHz
• Internally self-timed output buffer control to eliminate
the need to use asynchronous OE
• Fully registered (inputs and outputs) for pipelined
operation
• Byte Write capability
• 3.3V power supply
• 3.3V/2.5V I/O power supply
• Fast clock-to-output times
— 2.6 ns (for 250-MHz device)
• Clock Enable (CEN) pin to suspend operation
• Synchronous self-timed writes
• CY7C1460AV33, CY7C1462AV33 available in
JEDEC-standard lead-free 100-pin TQFP, lead-free and
non-lead-free 165-ball FBGA package. CY7C1464AV33
available in lead-free and non-lead-free 209-ball FBGA
package
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• Burst capability—linear or interleaved burst order
• "ZZ" Sleep Mode option and Stop Clock option
Logic Block Diagram-CY7C1460AV33 (1M x 36)
A0, A1, A
MODE
CLK
C
CEN
ADV/LD
BW
a
BW
b
BW
c
BW
d
WE
OE
CE1
CE2
CE3
ZZ
Cypress Semiconductor Corporation
Document #: 38-05353 Rev. *D
36-Mbit (1M x 36/2M x 18/512K x 72)
Pipelined SRAM with NoBL™ Architecture
ADDRESS
REGISTER 0
A1
A1'
D1
Q1
A0
BURST
A0'
D0
Q0
LOGIC
ADV/LD
C
WRITE ADDRESS
WRITE ADDRESS
REGISTER 1
REGISTER 2
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
READ LOGIC
SLEEP
CONTROL
198 Champion Court
Functional Description
The CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 are
3.3V, 1M x 36/2M x 18/512K x72 Synchronous pipelined burst
SRAMs with No Bus Latency™ (NoBL™) logic, respectively.
They are designed to support unlimited true back-to-back
Read/Write
operations
with
CY7C1460AV33/CY7C1462AV33/CY7C1464AV33
equipped with the advanced (NoBL) logic required to enable
consecutive Read/Write operations with data being trans-
ferred on every clock cycle. This feature dramatically improves
the throughput of data in systems that require frequent
Write/Read
CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 are pin
compatible and functionally equivalent to ZBT devices.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. All data outputs pass through
output registers controlled by the rising edge of the clock. The
clock input is qualified by the Clock Enable (CEN) signal,
which when deasserted suspends operation and extends the
previous clock cycle.
Write operations are controlled by the Byte Write Selects
(BW
–BW
for
CY7C1464AV33,
a
h
CY7C1460AV33 and BW
–BW
a
Write Enable (WE) input. All writes are conducted with on-chip
synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. In order to avoid bus
contention, the output drivers are synchronously tri-stated
during the data portion of a write sequence.
S
D
E
A
N
T
S
A
E
MEMORY
S
WRITE
ARRAY
A
T
DRIVERS
E
M
E
P
R
S
I
N
E
G
INPUT
INPUT
E
REGISTER 1
REGISTER 0
,
San Jose
CA 95134-1709
CY7C1460AV33
CY7C1462AV33
CY7C1464AV33
no
wait
states.
The
transitions.
The
BW
–BW
a
d
for CY7C1462AV33) and a
b
, CE
, CE
) and an
1
2
3
O
U
T
P
U
T
B
DQs
U
DQP
a
F
DQP
b
F
DQP
E
c
R
DQP
d
S
E
E
408-943-2600
Revised June 22, 2006
are
for
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Summary of Contents for Cypress Semiconductor CY7C1460AV33

  • Page 1 209-ball FBGA package • IEEE 1149.1 JTAG-Compatible Boundary Scan • Burst capability—linear or interleaved burst order • “ZZ” Sleep Mode option and Stop Clock option Logic Block Diagram-CY7C1460AV33 (1M x 36) ADDRESS A0, A1, A REGISTER 0 MODE...
  • Page 2: Selection Guide

    WRITE REGISTRY MEMORY AND DATA COHERENCY WRITE ARRAY CONTROL LOGIC DRIVERS INPUT REGISTER 1 READ LOGIC Sleep Control 250 MHz 200 MHz CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 INPUT REGISTER 0 INPUT REGISTER 0 167 MHz Unit Page 2 of 27 [+] Feedback...
  • Page 3: Pin Configurations

    Pin Configurations DQPc CY7C1460AV33 (1M × 36) DQPd Document #: 38-05353 Rev. *D 100-pin TQFP Pinout DQPb CY7C1462AV33 (2M × 18) DQPb DQPa CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 DQPa Page 3 of 27 [+] Feedback...
  • Page 4 165-ball FBGA (15 x 17 x 1.4 mm) Pinout NC/576M NC/1G NC/144M NC/72M MODE NC/576M NC/1G NC/144M NC/72M MODE Document #: 38-05353 Rev. *D CY7C1460AV33 (1M × 36) CY7C1462AV33 (2M × 18) CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 ADV/LD NC/288M ADV/LD NC/288M Page 4 of 27 [+] Feedback...
  • Page 5 Pin Description controls DQ , BW controls DQ and DQP , BW controls DQ , BW controls DQ and DQP , BW controls DQ CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 DQPf DQPb DQPa DQPe NC/288M and DQP , BW controls DQ and DQP...
  • Page 6 The is controlled by BW , and DQP is controlled by BW , DQP is controlled by BW or left floating. ZZ pin has an internal pull-down. CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 –DQ are placed in a tri-state [31:0] , DQP...
  • Page 7 HIGH on the subsequent clock rise, the chip enables , CE , and CE CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 , CE CY7C1464AV33, a,b,c,d,e,f,g,h for CY7C1460AV33 and DQ /DQP CY7C1464AV33, a,b,c,d,e,f,g,h for CY7C1460AV33 & DQ /DQP CY7C1464AV33, a,b,c,d for CY7C1462AV33) signals. The...
  • Page 8: Truth Table

    The correct BW (BW CY7C1464AV33, BW for CY7C1460AV33 and BW a,b,c,d CY7C1462AV33) inputs must be driven in each cycle of the burst write in order to write the correct bytes of data. Sleep Mode The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation “sleep”...
  • Page 9 (Continue Burst) IGNORE CLOCK Current EDGE (Stall) SLEEP MODE None Partial Write Cycle Description Function (CY7C1460AV33) Read Write – No bytes written Write Byte a – (DQ and DQP Write Byte b – (DQ and DQP Write Bytes b, a Write Byte c –...
  • Page 10: Tap Controller State Diagram

    IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 incor- porates a serial boundary scan test access port (TAP). This part is fully compliant with 1149.1. The TAP operates using JEDEC-standard 3.3V or 2.5V I/O logic level. CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 contains a TAP controller, instruction register, boundary scan register, bypass register, and ID register.
  • Page 11 The IDCODE instruction is loaded into the instruction register upon power-up or whenever the TAP controller is given a test logic reset state. Document #: 38-05353 Rev. *D CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 SAMPLE Z The SAMPLE Z instruction causes the boundary scan register to be connected between the TDI and TDO pins when the TAP controller is in a Shift-DR state.
  • Page 12 TH t CYC t TMSS t TMSH t TDIS t TDIH t TDOX DON’T CARE UNDEFINED [9, 10] Over the Operating Range Description = 1 ns. CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 t TDOV Min. Max. Unit Page 12 of 27 [+] Feedback...
  • Page 13 Output HIGH Voltage Output LOW Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage Input Load Current Identification Register Definitions CY7C1460AV33 Instruction Field Revision Number (31:29) [12] Device Depth (28:24) Architecture/Memory Type(23:18) Bus Width/Density(17:12) Cypress JEDEC ID Code (11:1)
  • Page 14: Identification Codes

    BYPASS Places the bypass register between TDI and TDO. This operation does not affect SRAM operations. Document #: 38-05353 Rev. *D Bit Size (×36) Bit Size (×18) Description CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 Bit Size (×72) Page 14 of 27 [+] Feedback...
  • Page 15 165-ball FBGA Boundary Scan Order CY7C1460AV33 (1M x 36), CY7C1462AV33 (2M x 18) Bit# ball ID Bit# Note: 13. Bit# 89 is preset HIGH. Document #: 38-05353 Rev. *D [13] ball ID Bit# ball ID CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 Bit# ball ID...
  • Page 16 Bit# Ball ID Bit# Note: 14. Bit# 138 is preset HIGH. Document #: 38-05353 Rev. *D [13, 14] ball ID Bit# ball ID CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 Bit# ball ID 2 Mbit 1 Mbit Internal Page 16 of 27 [+] Feedback...
  • Page 17: Maximum Ratings

    V , f = 0 /2), undershoot: V (AC)> –2V (Pulse width less than t (min.) within 200 ms. During this time V < V and V CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 Ambient Temperature 0°C to +70°C 3.3V 2.5V –5% to –5%/+10%...
  • Page 18 3.3V 5 pF R = 351Ω INCLUDING JIG AND SCOPE R = 1667Ω 2.5V 5 pF R =1538Ω INCLUDING JIG AND SCOPE CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 165 FBGA 209 FBGA Max. Max. Unit 165 FBGA 209 FBGA Package Package Unit °C/W 20.8...
  • Page 19: Switching Characteristics

    Max. Min. [19, 20, 21] [19, 20, 21] and t is less than t to eliminate bus contention between SRAMs when sharing the same EOLZ 2.5V. DDQ= CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 –200 –167 Max. Min. Max. Unit Page 19 of 27...
  • Page 20: Switching Waveforms

    OEHZ BURST READ READ BURST WRITE Q(A3) Q(A4) READ D(A2+1) Q(A4+1) DON’T CARE UNDEFINED is LOW. When CE is HIGH,CE is HIGH or CE CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 Q(A4) Q(A4+1) D(A5) Q(A6) OELZ WRITE READ WRITE DESELECT D(A5) Q(A6) D(A7) is LOW or CE is HIGH.
  • Page 21 29. I/Os are in High-Z when exiting ZZ sleep mode. Document #: 38-05353 Rev. *D D(A1) Q(A2) Q(A3) READ WRITE STALL Q(A3) D(A4) DON’T CARE High-Z DON’T CARE CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 D(A4) Q(A5) READ DESELECT CONTINUE Q(A5) DESELECT UNDEFINED ZZREC t RZZI...
  • Page 22: Ordering Information

    CY7C1460AV33-167BZC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) CY7C1462AV33-167BZC CY7C1460AV33-167BZXC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free CY7C1462AV33-167BZXC CY7C1464AV33-167BGC 51-85167 209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)
  • Page 23 CY7C1460AV33-250BZC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) CY7C1462AV33-250BZC CY7C1460AV33-250BZXC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free CY7C1462AV33-250BZXC CY7C1464AV33-250BGC 51-85167 209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)
  • Page 24: Package Diagrams

    2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 1.40±0.05 12°±1°...
  • Page 25 (continued) TOP VIEW PIN 1 CORNER SEATING PLANE Document #: 38-05353 Rev. *D 165-ball FBGA (15 x 17 x 1.4 mm) (51-85165) 0.15(4X) CY7C1460AV33 CY7C1462AV33 CY7C1464AV33 PIN 1 CORNER BOTTOM VIEW Ø0.05 M C Ø0.25 M C A B Ø0.45±0.05(165X) 1.00...
  • Page 26 The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. CY7C1460AV33 CY7C1462AV33...
  • Page 27 Document History Page Document Title: CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL™ Architecture Document Number: 38-05353 REV. ECN No. Issue Date 254911 See ECN 303533 See ECN 331778 See ECN 417509 See ECN 473229 See ECN Document #: 38-05353 Rev.

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