Reference Document; Figure 46. Thermal Resistance Suffix 6; Figure 47. Thermal Resistance Suffix 7 - ST STM32L15 QC Series Datasheet

Package information
7.6.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
130/134

Figure 46. Thermal resistance suffix 6

3000.00
2500.00
Forbidden areaTJ > TJ max
2000.00
PD (mW)
1500.00
1000.00
500.00
0.00
100

Figure 47. Thermal resistance suffix 7

3000.00
2500.00
Forbidden areaTJ > TJ max
2000.00
PD (mW)
1500.00
1000.00
500.00
0.00
105 75
DS10262 Rev 8
STM32L151xC/C-A STM32L152xC/C-A
75 50 25 0
Temperature (°C)
50 25 0
Temperature (°C)
LQFP64 10x10 mm / WLCSP64
UFBGA132 7x7 mm
LQFP144 20x20 mm
LQFP 100 14x14 mm
LQFP64 10x10 mm / WLCSP64
UFBGA132 7x7 mm
LQFP144 20x20 mm
LQFP 100 14x14 mm
MSv34196V1
MS31407V4