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Ultra-low-power 32-bit MCU Arm
Flash, 32KB SRAM, 8KB EEPROM, LCD, USB, ADC, DAC
Features
• Ultra-low-power platform
– 1.65 V to 3.6 V power supply
– -40°C to 105°C temperature range
– 305 nA standby mode (3 wakeup pins)
– 1.15 µA standby mode + RTC
– 0.475 µA stop mode (16 wakeup lines)
– 1.35 µA stop mode + RTC
– 11 µA Low-power run mode
– 230 µA/MHz run mode
– 10 nA ultra-low I/O leakage
– 8 µs wakeup time
®
• Core: Arm
Cortex
– From 32 kHz up to 32 MHz max
– 1.25 DMIPS/MHz (Dhrystone 2.1)
– Memory protection unit
• Up to 23 capacitive sensing channels
• CRC calculation unit, 96-bit unique ID
• Reset and supply management
– Low-power, ultrasafe BOR (brownout reset)
with 5 selectable thresholds
– Ultra-low-power POR/PDR
– Programmable voltage detector (PVD)
• Clock sources
– 1 to 24 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– High Speed Internal 16 MHz factory-
trimmed RC (+/- 1%)
– Internal low-power 37 kHz RC
– Internal multispeed low-power 65 kHz to
4.2 MHz
– PLL for CPU clock and USB (48 MHz)
• Pre-programmed bootloader
– USB and USART supported
• Serial wire debug, JTAG and trace
September 2021
This is information on a product in full production.
STM32L15xQC STM32L15xRC-A
STM32L15xVC-A STM32L15xZC
®
-M3 32-bit CPU
®
-based Cortex
LQFP144 (20 × 20 mm)
LQFP100 (14 × 14 mm)
LQFP64 (10 × 10 mm)
• Up to 116 fast I/Os (102 I/Os 5V tolerant), all
mappable on 16 external interrupt vectors
• Memories
– 256 Kbytes of Flash memory with ECC
– 32 Kbytes of RAM
– 8 Kbytes of true EEPROM with ECC
– 128-byte backup register
• LCD driver (except STM32L151xC/C-A
devices) up to 8x40 segments, contrast
adjustment, blinking mode, step-up converter
• Rich analog peripherals (down to 1.8V)
– 2x operational amplifiers
– 12-bit ADC 1 Msps up to 40 channels
– 12-bit DAC 2 ch with output buffers
– 2x ultra-low-power-comparators
(window mode and wake up capability)
• DMA controller 12x channels
• 9x peripheral communication interfaces
– 1x USB 2.0 (internal 48 MHz PLL)
– 3x USARTs
– Up to 8x SPIs (2x I2S, 3x 16 Mbit/s)
– 2x I2Cs (SMBus/PMBus)
• 11x timers: 1x 32-bit, 6x 16-bit with up to 4
IC/OC/PWM channels, 2x 16-bit basic timers,
2x watchdog timers (independent and window)
DS10262 Rev 8
®
-M3, 256KB
-
Datasheet
production data
UFBGA132
WLCSP64
(7 × 7 mm)
(0.4 mm pitch)
www.st.com
1/134
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Table of Contents
Related Manuals for ST STM32L15 QC Series
Summary of Contents for ST STM32L15 QC Series
- Page 1 – PLL for CPU clock and USB (48 MHz) 2x watchdog timers (independent and window) • Pre-programmed bootloader – USB and USART supported • Serial wire debug, JTAG and trace September 2021 DS10262 Rev 8 1/134 This is information on a product in full production. www.st.com...
- Page 2 STM32L151xC/C-A STM32L152xC/C-A Table 1. Device summary Reference Part numbers STM32L151QC STM32L151QCH6 STM32L151RC-A STM32L151RCT6A, STM32L151RCY6 STM32L151VC-A STM32L151VCT6A STM32L151ZC STM32L151ZCT6 STM32L152QC STM32L152QCH6 STM32L152RC-A STM32L152RCT6A STM32L152VC-A STM32L152VCT6A STM32L152ZC STM32L152ZCT6 2/134 DS10262 Rev 8...
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Page 3: Table Of Contents
STM32L151xC/C-A STM32L152xC/C-A Contents Contents Introduction ..........9 Description . - Page 4 Contents STM32L151xC/C-A STM32L152xC/C-A 3.16 Timers and watchdogs ........28 3.16.1 General-purpose timers (TIM2, TIM3, TIM4, TIM5, TIM9, TIM10 and TIM11) .
- Page 5 STM32L151xC/C-A STM32L152xC/C-A Contents 6.3.4 Supply current characteristics ....... . 63 6.3.5 Wakeup time from low-power mode .
- Page 6 List of tables STM32L151xC/C-A STM32L152xC/C-A List of tables Table 1. Device summary ............2 Table 2.
- Page 7 STM32L151xC/C-A STM32L152xC/C-A List of tables Table 47. C characteristics............94 Table 48.
- Page 8 List of figures STM32L151xC/C-A STM32L152xC/C-A List of figures Figure 1. Ultra-low-power STM32L151xC/C-A and STM32L152xC/C-A block diagram ..13 Figure 2. Clock tree ............. . 22 Figure 3.
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Page 9: Introduction
This STM32L151xC/C-A and STM32L152xC/C-A datasheet must be read in conjunction with the STM32L1xxxx reference manual (RM0038). The application note “Getting started with STM32L1xxxx hardware development” (AN3216) gives a hardware implementation overview. Both documents are available from the STMicroelectronics website www.st.com. ®(a) ®... -
Page 10: Description
Description STM32L151xC/C-A STM32L152xC/C-A Description The ultra-low-power STM32L151xC/C-A and STM32L152xC/C-A devices incorporate the ® connectivity power of the universal serial bus (USB) with the high-performance Arm ® Cortex -M3 32-bit RISC core operating at a frequency of 32 MHz (33.3 DMIPS), a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 256 Kbytes and RAM up to 32 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses. -
Page 11: Device Overview
STM32L151xC/C-A STM32L152xC/C-A Description Device overview Table 2. Ultra-low-power STM32L151xC/C-A and STM32L152xC/C-A device features and peripheral counts Peripheral STM32L15xRC-A STM32L15xVC-A STM32L15xQC STM32L15xZC Flash (Kbytes) Data EEPROM (Kbytes) RAM (Kbytes) 32 bit General- Timers purpose Basic 8(3) Communi- cation interfaces USART GPIOs Operation amplifiers 12-bit synchronized ADC Number of channels... -
Page 12: Ultra-Low-Power Device Continuum
Ultrasafe reset: same reset strategy including power-on reset, power-down reset, brownout reset and programmable voltage detector 2.2.4 Features ST ultra-low-power continuum also lies in feature compatibility: • More than 15 packages with pin count from 20 to 144 pins and size down to 3 x 3 mm •... -
Page 13: Functional Overview
STM32L151xC/C-A STM32L152xC/C-A Functional overview Functional overview Figure 1. Ultra-low-power STM32L151xC/C-A and STM32L152xC/C-A block diagram TRACECK, TRACED0, TRACED1, TRACED2, TRACED4 @ VDD 33 VDD CORE JTAG & SW Trace Controller ETM POWER pbus VDD33=1.65V to 3.6V NJTRST VOLT . REG Ibus M3 CPU JTDI EEPROM 64bits... -
Page 14: Low-Power Modes
Functional overview STM32L151xC/C-A STM32L152xC/C-A Low-power modes The ultra-low-power STM32L151xC/C-A and STM32L152xC/C-A devices support dynamic voltage scaling to optimize its power consumption in run mode. The voltage from the internal low-drop regulator that supplies the logic can be adjusted according to the system’s maximum operating frequency and the external voltage supply. -
Page 15: Table 3. Functionalities Depending On The Operating Power Supply Range
STM32L151xC/C-A STM32L152xC/C-A Functional overview • Stop mode without RTC Stop mode achieves the lowest power consumption while retaining the RAM and register contents. All clocks are stopped, the PLL, MSI RC, HSI and LSI RC, LSE and HSE crystal oscillators are disabled. The voltage regulator is in the low-power mode. The device can be woken up from Stop mode by any of the EXTI line, in 8 µs. -
Page 16: Table 4. Cpu Frequency Range Depending On Dynamic Voltage Scaling
Functional overview STM32L151xC/C-A STM32L152xC/C-A Table 3. Functionalities depending on the operating power supply range (continued) Functionalities depending on the operating power supply range Operating power supply DAC and ADC Dynamic voltage scaling range operation range Conversion time up Range 1, Range 2 or = 2.0 to 2.4 V Functional to 500 Ksps... -
Page 17: Table 5. Functionalities Depending On The Working Mode
STM32L151xC/C-A STM32L152xC/C-A Functional overview Table 5. Functionalities depending on the working mode (from Run/active down to standby) Stop Standby Low- Low- Run/Active Sleep power power Wakeup Wakeup Sleep capability capability Flash Backup Registers EEPROM Brown-out rest (BOR) Programmable Voltage Detector (PVD) Power On Reset (POR) -
Page 18: Arm ® Cortex ® -M3 Core With Mpu
Functional overview STM32L151xC/C-A STM32L152xC/C-A Table 5. Functionalities depending on the working mode (from Run/active down to standby) (continued) Stop Standby Low- Low- Run/Active Sleep power power Wakeup Wakeup Sleep capability capability Tempsensor OP amp Comparators 16-bit and 32-bit Timers IWDG WWDG Touch sensing Systic Timer... -
Page 19: Reset And Supply Management
STM32L151xC/C-A STM32L152xC/C-A Functional overview The memory protection unit (MPU) improves system reliability by defining the memory attributes (such as read/write access permissions) for different memory regions. It provides up to eight different regions and an optional predefined background region. Owing to its embedded Arm core, the STM32L151xC/C-A and STM32L152xC/C-A devices are compatible with all Arm tools and software. -
Page 20: Voltage Regulator
Functional overview STM32L151xC/C-A STM32L152xC/C-A Five BOR thresholds are available through option bytes, starting from 1.8 V to 3 V. To reduce the power consumption in Stop mode, it is possible to automatically switch off the internal reference voltage (V ) in Stop mode. The device remains in reset mode when REFINT is below a specified threshold, V or V... -
Page 21: Clock Management
STM32L151xC/C-A STM32L152xC/C-A Functional overview Clock management The clock controller distributes the clocks coming from different oscillators to the core and the peripherals. It also manages clock gating for low-power modes and ensures clock robustness. It features: • Clock prescaler: to get the best trade-off between speed and current consumption, the clock frequency to the CPU and peripherals can be adjusted by a programmable prescaler. -
Page 22: Figure 2. Clock Tree
Functional overview STM32L151xC/C-A STM32L152xC/C-A Figure 2. Clock tree Standby supplied voltage domain enable Watchdog Watchdog LSI RC LSI tempo RTC enable LSE OSC LSE tempo Radio Sleep Timer Radio Sleep Timer enable LS LS DDCORE CK_LCD 1 MHz LCD enable @V33 CK_ADC ADC enable... -
Page 23: Low-Power Real-Time Clock And Backup Registers
STM32L151xC/C-A STM32L152xC/C-A Functional overview Low-power real-time clock and backup registers The real-time clock (RTC) is an independent BCD timer/counter. Dedicated registers contain the sub-second, second, minute, hour (12/24 hour), week day, date, month, year, in BCD (binary-coded decimal) format. Correction for 28, 29 (leap year), 30, and 31 day of the month are made automatically. -
Page 24: Memories
Functional overview STM32L151xC/C-A STM32L152xC/C-A Memories The STM32L151xC/C-A and STM32L152xC/C-A devices have the following features: • 32 Kbytes of embedded RAM accessed (read/write) at CPU clock speed with 0 wait states. With the enhanced bus matrix, operating the RAM does not lead to any performance penalty during accesses to the system bus (AHB and APB buses). -
Page 25: Lcd (Liquid Crystal Display)
To improve the accuracy of the temperature sensor measurement, each device is individually factory-calibrated by ST. The temperature sensor factory calibration data are DS10262 Rev 8 25/134... -
Page 26: Internal Voltage Reference (Vrefint )
ADC). The precise voltage of V is individually measured for each part by REFINT ST during production test and stored in the system memory area. It is accessible in read- only mode. See Table 15: Embedded internal reference voltage calibration values. -
Page 27: Ultra-Low-Power Comparators And Reference Voltage
STM32L151xC/C-A STM32L152xC/C-A Functional overview 3.13 Ultra-low-power comparators and reference voltage The STM32L151xC/C-A and STM32L152xC/C-A devices embed two comparators sharing the same current bias and reference voltage. The reference voltage can be internal or external (coming from an I/O). • One comparator with fixed threshold •... -
Page 28: Timers And Watchdogs
Functional overview STM32L151xC/C-A STM32L152xC/C-A 3.16 Timers and watchdogs The ultra-low-power STM32L151xC/C-A and STM32L152xC/C-A devices include seven general-purpose timers, two basic timers, and two watchdog timers. Table 6 compares the features of the general-purpose and basic timers. Table 6. Timer feature comparison Counter Capture/compare Complementary... -
Page 29: Basic Timers (Tim6 And Tim7)
STM32L151xC/C-A STM32L152xC/C-A Functional overview They can also be used as simple time bases and be clocked by the LSE clock source (32.768 kHz) to provide time bases independent from the main CPU clock. 3.16.2 Basic timers (TIM6 and TIM7) These timers are mainly used for DAC trigger generation. They can also be used as generic 16-bit time bases. -
Page 30: Serial Peripheral Interface (Spi)
Functional overview STM32L151xC/C-A STM32L152xC/C-A 3.17.3 Serial peripheral interface (SPI) Up to three SPIs are able to communicate at up to 16 Mbits/s in slave and master modes in full-duplex and half-duplex communication modes. The 3-bit prescaler gives 8 master mode frequencies and the frame is configurable to 8 bits or 16 bits. -
Page 31: Development Support
STM32L151xC/C-A STM32L152xC/C-A Functional overview 3.19 Development support 3.19.1 Serial wire JTAG debug port (SWJ-DP) The Arm SWJ-DP interface is embedded, and is a combined JTAG and serial wire debug port that enables either a serial wire debug or a JTAG probe to be connected to the target. The JTAG JTMS and JTCK pins are shared with SWDAT and SWCLK, respectively, and a specific sequence on the JTMS pin is used to switch between JTAG-DP and SW-DP. -
Page 32: Pin Descriptions
Pin descriptions STM32L151xC/C-A STM32L152xC/C-A Pin descriptions Figure 3. STM32L15xRC-A LQFP64 pinout 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 VDD_2 VSS_ PC13-WKUP2 PC14-OSC32_IN PA13 PA12 PC15-OSC32_OUT PA11 PH0 -OSC_IN PH1- OSC_OUT PA10 NRST LQFP64 VSSA... -
Page 33: Figure 4. Stm32L15Xrc Wlcsp64 Ballout
STM32L151xC/C-A STM32L152xC/C-A Pin descriptions Figure 4. STM32L15xRC WLCSP64 ballout VDD_2 PC10 BOOT0 VSS_3 VDD_3 PC14- OSC32_IN VSS_2 PA14 PC11 PC15- OSC32_OUT PC13- PA11 PA12 PA15 PC12 VLCD NRST WKUP2 PH1- PH0- PA10 PA13 OSC_OUT OSC_IN VSSA PA0- PB15 PB14 PB11 VSS_4 WKUP1 PB13... -
Page 34: Figure 5. Stm32L15Xvc-A Lqfp100 Pinout
Pin descriptions STM32L151xC/C-A STM32L152xC/C-A Figure 5. STM32L15xVC-A LQFP100 pinout VDD_2 VSS_2 PA13 PE6-WKUP3 PA12 PA11 PC13-WKUP2 PA10 PC14-OSC32_IN PC15-OSC32_OUT VSS_5 VDD_5 PH0-OSC_IN LQFP100 PH1-OSC_OUT NRST PD15 PD14 PD13 PD12 PD11 VSSA PD10 VREF- VREF+ VDDA PB15 PA0-WKUP1 PB14 PB13 PB12 ai15692c 1. -
Page 35: Figure 6. Stm32L15Xqc Ufbga132 Ballout
STM32L151xC/C-A STM32L152xC/C-A Pin descriptions Figure 6. STM32L15xQC UFBGA132 ballout BOOT0 PA15 PA14 PA13 PA12 PC12 PC10 PA11 PC13- VDD_3 PG13 PC11 PA10 PG14 WKUP2 PC14- PE6- PG10 VSS_3 PG12 OSC32 WKUP3 PC15- VLCD VSS_6 OSC32 _OUT VSS_10 VSS_2 VSS_1 VSS_5 VSS_9 OSC_IN VDD_5... -
Page 36: Figure 7. Stm32L15Xzc Lqfp144 Pinout
Pin descriptions STM32L151xC/C-A STM32L152xC/C-A Figure 7. STM32L15xZC LQFP144 pinout DD_2 SS_2 PA13 PE6-WKUP3 PA12 V LCD PA11 PC13-WKUP2 PA10 PC14-OSC32_IN PC15-OSC32_OUT DD_9 SS_9 LQFP144 SS_5 DD_5 PF10 OSC_IN PD15 OSC_OUT PD14 NRST DD_8 SS_8 PD13 PD12 PD11 PD10 REF- REF+ PB15 PA0 -WKUP1 PB14... -
Page 37: Table 7. Legend/Abbreviations Used In The Pinout Table
STM32L151xC/C-A STM32L152xC/C-A Pin descriptions Table 7. Legend/abbreviations used in the pinout table Name Abbreviation Definition Unless otherwise specified in brackets below the pin name, the pin function Pin name during and after reset is the same as the actual pin name Supply pin Pin type Input only pin... - Page 38 Pin descriptions STM32L151xC/C-A STM32L152xC/C-A Table 8. STM32L151xC/C-A and STM32L152xC/C-A pin definitions (continued) Pins Pin functions Main Pin name function Additional Alternate functions (after reset) functions WKUP2/ PC13- RTC_TAMP1/ PC13 WKUP2 RTC_TS/ RTC_OUT PC14- PC14 OSC32_IN OSC32_IN PC15- PC15 OSC32_OUT OSC32_OUT SS_5 SS_5 DD_5...
- Page 39 STM32L151xC/C-A STM32L152xC/C-A Pin descriptions Table 8. STM32L151xC/C-A and STM32L152xC/C-A pin definitions (continued) Pins Pin functions Main Pin name function Additional Alternate functions (after reset) functions ADC_IN11/ LCD_SEG19 COMP1_INP ADC_IN12/ 10 D6 LCD_SEG20 COMP1_INP ADC_IN12/ LCD_SEG20 COMP1_INP ADC_IN13/ 11 F7 LCD_SEG21 COMP1_INP/ 12 E7 REF-...
- Page 40 Pin descriptions STM32L151xC/C-A STM32L152xC/C-A Table 8. STM32L151xC/C-A and STM32L152xC/C-A pin definitions (continued) Pins Pin functions Main Pin name function Additional Alternate functions (after reset) functions 19 G6 DD_4 DD_4 ADC_IN4/ SPI1_NSS/SPI3_NSS/ 20 H7 DAC_OUT1/ I2S3_WS/USART2_CK COMP1_INP ADC_IN5/ TIM2_CH1_ETR/ 21 E5 DAC_OUT2/ SPI1_SCK COMP1_INP...
- Page 41 STM32L151xC/C-A STM32L152xC/C-A Pin descriptions Table 8. STM32L151xC/C-A and STM32L152xC/C-A pin definitions (continued) Pins Pin functions Main Pin name function Additional Alternate functions (after reset) functions PF13 PF13 ADC_IN3b PF14 PF14 ADC_IN6b PF15 PF15 ADC_IN7b ADC_IN8b ADC_IN9b ADC_IN22/ COMP1_INP ADC_IN23/ COMP1_INP ADC_IN24/ TIM2_CH1_ETR COMP1_INP...
- Page 42 Pin descriptions STM32L151xC/C-A STM32L152xC/C-A Table 8. STM32L151xC/C-A and STM32L152xC/C-A pin definitions (continued) Pins Pin functions Main Pin name function Additional Alternate functions (after reset) functions TIM9_CH1/SPI2_SCK/ I2S2_CK/ ADC_IN19/ 34 G1 PB13 PB13 USART3_CTS/ COMP1_INP LCD_SEG13 TIM9_CH2/SPI2_MISO/ ADC_IN20/ COMP1_INP 35 F2 PB14 PB14 USART3_RTS/...
- Page 43 STM32L151xC/C-A STM32L152xC/C-A Pin descriptions Table 8. STM32L151xC/C-A and STM32L152xC/C-A pin definitions (continued) Pins Pin functions Main Pin name function Additional Alternate functions (after reset) functions TIM3_CH1/I2S2_MCK/ 37 E1 LCD_SEG24 TIM3_CH2/I2S3_MCK/ 38 E2 LCD_SEG25 39 E3 TIM3_CH3/LCD_SEG26 D12 66 40 D1 TIM3_CH4/LCD_SEG27 USART1_CK/MCO/ 100 D11...
- Page 44 Pin descriptions STM32L151xC/C-A STM32L152xC/C-A Table 8. STM32L151xC/C-A and STM32L152xC/C-A pin definitions (continued) Pins Pin functions Main Pin name function Additional Alternate functions (after reset) functions SPI3_MOSI/I2S3_SD/ USART3_CK/LCD_SEG30/ 113 B10 53 C4 PC12 PC12 LCD_SEG42/ LCD_COM6 TIM9_CH1/SPI2_NSS/ I2S2_WS SPI2_SCK/I2S2_CK TIM3_ETR/LCD_SEG31/ 54 A3 LCD_SEG43/LCD_COM7 SPI2_MISO/USART2_CTS SPI2_MOSI/I2S2_SD/...
- Page 45 STM32L151xC/C-A STM32L152xC/C-A Pin descriptions Table 8. STM32L151xC/C-A and STM32L152xC/C-A pin definitions (continued) Pins Pin functions Main Pin name function Additional Alternate functions (after reset) functions TIM3_CH1/SPI1_MISO/ 56 B4 NJTRST SPI3_MISO/ COMP2_INP LCD_SEG8/NJTRST TIM3_CH2/I2C1_SMBA/ SPI1_MOSI/ 57 A5 COMP2_INP SPI3_MOSI/ I2S3_SD/LCD_SEG9 TIM4_CH1/I2C1_SCL/ 58 B5 COMP2_INP USART1_TX/...
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Page 46: Table 9. Alternate Function Input/Output
Alternate functions Table 9. Alternate function input/output Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 .. AFIO11 AFIO12 .. AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 EVENT BOOT0... - Page 47 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 .. AFIO11 AFIO12 .. AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 EVENT PA12 SPI1_MOSI...
- Page 48 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 .. AFIO11 AFIO12 .. AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 EVENT PB11 TIM2_CH4...
- Page 49 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 .. AFIO11 AFIO12 .. AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 COM4/ SPI3_SCK EVENT...
- Page 50 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 .. AFIO11 AFIO12 .. AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 EVENT USART3_TX SEG28...
- Page 51 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 .. AFIO11 AFIO12 .. AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 EVENT TIMx_IC4 EVENT...
- Page 52 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 .. AFIO11 AFIO12 .. AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 EVENT TIM5_ETR EVENT...
- Page 53 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 .. AFIO11 AFIO12 .. AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 EVENT EVENT EVENT...
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Page 54: Memory Mapping
Memory mapping STM32L151xC/C-A STM32L152xC/C-A Memory mapping Figure 8. Memory map 0x4002 67FF DMA2 0x4002 6400 DMA1 0x4002 6000 reserved 0x4002 4000 Flash interface 0x4002 3C00 0x4002 3800 0xFFFF FFFF reserved 0x4002 3400 0x4002 3000 0xE010 0000 reserved Cortex-M3 internal peripherals 0x4002 1800 0xE000 0000 Port H... -
Page 55: Electrical Characteristics
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Electrical characteristics Parameter conditions Unless otherwise specified, all voltages are referenced to V 6.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at T = 25 °C and T max (given by... -
Page 56: Power Supply Scheme
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A 6.1.6 Power supply scheme Figure 11. Power supply scheme Standby-power circuitry (LSE,RTC,Wake-up logic, RTC backup registers) GP I/Os Logic Kernel logic (CPU, Digital & Memories) Regulator N × 100 nF + 1 × 4.7 μF REF+ Analog: 100 nF OSC,PLL,COMP,... -
Page 57: Optional Lcd Power Supply Scheme
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics 6.1.7 Optional LCD power supply scheme Figure 12. Optional LCD power supply scheme VSEL Step-up DD1/2/.../N N x 100 nF Converter + 1 x 10 μF Option 1 100 nF Option 2 SS1/2/.../N MS32462V2 1. Option 1: LCD power supply is provided by a dedicated VLCD supply source, VSEL switch is open. 2. -
Page 58: Absolute Maximum Ratings
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 10: Voltage characteristics, Table 11: Current characteristics, and Table 12: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. -
Page 59: Operating Conditions
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics 4. Positive current injection is not possible on these I/Os. A negative injection is induced by V <V must never be INJ(PIN) exceeded. Refer to Table 10 for maximum allowed input voltage values. 5. A positive injection is induced by V >... -
Page 60: Embedded Reset And Power Control Block Characteristics
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Table 13. General operating conditions (continued) Symbol Parameter Conditions Unit 6 suffix version –40 Junction temperature range °C 7 suffix version –40 1. When the ADC is used, refer to Table 55: ADC characteristics. 2. It is recommended to power V and V from the same source. - Page 61 STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Table 14. Embedded reset and power control block characteristics (continued) Symbol Parameter Conditions Unit Falling edge 2.45 2.55 Brown-out reset threshold 3 BOR3 Rising edge 2.54 2.66 Falling edge 2.68 2.85 Brown-out reset threshold 4 BOR4 Rising edge 2.78 2.95...
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Page 62: Embedded Internal Reference Voltage
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A 6.3.3 Embedded internal reference voltage The parameters given in Table 16 are based on characterization results, unless otherwise specified. Table 15. Embedded internal reference voltage calibration values Calibration value name Description Memory address Raw data acquired at VREFINT_CAL temperature of 30 °C ±5 °C 0x1FF8 00F8 - 0x1FF8 00F9... -
Page 63: Supply Current Characteristics
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics 6.3.4 Supply current characteristics The current consumption is a function of several parameters and factors such as the operating voltage, temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory and executed binary code. The current consumption is measured as described in Figure 13: Current consumption measurement... -
Page 64: Table 17. Current Consumption In Run Mode, Code With Data Processing Running From Flash
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Table 17. Current consumption in Run mode, code with data processing running from Flash HCLK Symbol Parameter Conditions Unit [MHz] Range3, =1.2 V μA CORE VOS[1:0]=11 1200 1.15 up to 16MHz, Range2, HCLK included f /2 above =1.5 V HCLK CORE... -
Page 65: Table 18. Current Consumption In Run Mode, Code With Data Processing Running From Ram
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Table 18. Current consumption in Run mode, code with data processing running from RAM Symbol Parameter Conditions Unit HCLK Range3, =1.2 V μA CORE VOS[1:0]=11 1200 0.935 up to 16 MHz, Range2, HCLK included f /2 above =1.5 V HCLK CORE... -
Page 66: Table 19. Current Consumption In Sleep Mode
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Table 19. Current consumption in Sleep mode Symbol Parameter Conditions Unit HCLK Range3, Vcore=1.2 V VOS[1:0]=11 up to 16 MHz, Range2, HCLK included f Vcore=1.5 V HCLK above 16 MHz (PLL ON) VOS[1:0]=10 1100 Range1, Supply current in Vcore=1.8 V 1250 Sleep mode, code... -
Page 67: Table 20. Current Consumption In Low-Power Run Mode
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics 2. Oscillator bypassed (HSEBYP = 1 in RCC_CR register) Table 20. Current consumption in Low-power run mode Symbol Parameter Conditions Unit = -40 °C to 25 °C MSI clock, 65 kHz = 85 °C = 32 kHz HCLK = 105 °C peripherals... -
Page 68: Table 21. Current Consumption In Low-Power Sleep Mode
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Table 21. Current consumption in Low-power sleep mode Symbol Parameter Conditions Unit MSI clock, 65 kHz = 32 kHz = -40 °C to 25 °C HCLK Flash OFF = -40 °C to 25 °C MSI clock, 65 kHz = 32 kHz = 85 °C HCLK... -
Page 69: Table 22. Typical And Maximum Current Consumptions In Stop Mode
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Table 22. Typical and maximum current consumptions in Stop mode Symbol Parameter Conditions Unit = -40°C to 25°C = 1.8 V = -40°C to 25°C 1.35 = 55°C 1.95 = 85°C 4.35 RTC clocked by LSI = 105°C 11.0 or LSE external clock... - Page 70 Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Table 22. Typical and maximum current consumptions in Stop mode (continued) Symbol Parameter Conditions Unit Regulator in LP mode, HSI and HSE OFF, independent = -40°C to 25°C watchdog and LSI enabled Supply current in = -40°C to 25°C 0.475 (Stop) Stop mode (RTC...
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Page 71: Table 23. Typical And Maximum Current Consumptions In Standby Mode
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Table 23. Typical and maximum current consumptions in Standby mode Symbol Parameter Conditions Unit = -40 °C to 25 °C 0.82 = 1.8 V = -40 °C to 25 °C 1.15 RTC clocked by LSI (no independent watchdog) = 55 °C 1.15... -
Page 72: Table 24. Peripheral Current Consumption
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Table 24. Peripheral current consumption Typical consumption, V = 3.0 V, T = 25 °C Range 1, Range 2, Range 3, Low-power Peripheral Unit CORE CORE CORE 1.8 V 1.5 V 1.2 V sleep and VOS[1:0] = VOS[1:0] = VOS[1:0] = TIM2... - Page 73 STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Table 24. Peripheral current consumption (continued) Typical consumption, V = 3.0 V, T = 25 °C Range 1, Range 2, Range 3, Low-power Peripheral Unit CORE CORE CORE 1.8 V 1.5 V 1.2 V sleep and VOS[1:0] = VOS[1:0] = VOS[1:0] =...
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Page 74: Wakeup Time From Low-Power Mode
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A 1. Data based on differential I measurement between all peripherals OFF an one peripheral with clock enabled, in the following conditions: f = 32 MHz (range 1), f = 16 MHz (range 2), f = 4 MHz HCLK HCLK HCLK... -
Page 75: External Clock Source Characteristics
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Table 25. Low-power mode wakeup timings Symbol Parameter Conditions Unit Wakeup from Sleep mode = 32 MHz WUSLEEP HCLK = 262 kHz HCLK Flash enabled Wakeup from Low-power sleep WUSLEEP_LP mode, f = 262 kHz = 262 kHz HCLK HCLK Flash switched OFF... -
Page 76: Figure 14. High-Speed External Clock Source Ac Timing Diagram
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Table 26. High-speed external user clock characteristics (continued) Symbol Parameter Conditions Unit OSC_IN input pin high level voltage 0.7V HSEH OSC_IN input pin low level voltage 0.3V HSEL w(HSEH) OSC_IN high or low time w(HSEL) r(HSE) OSC_IN rise or fall time f(HSE) OSC_IN input capacitance... -
Page 77: Table 27. Low-Speed External User Clock Characteristics
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Low-speed external user clock generated from an external source The characteristics given in the following table result from tests performed using a low- speed external clock source, and under the conditions summarized in Table Table 27. Low-speed external user clock characteristics Symbol Parameter Conditions... -
Page 78: Table 28. Hse Oscillator Characteristics
. PCB and MCU pin capacitance must be included (10 pF can be used as a rough estimate of the combined pin and board capacitance) when sizing and C . Refer to the application note AN2867 “Oscillator design guide for ST microcontrollers” available from the ST website www.st.com. 78/134... -
Page 79: Figure 16. Hse Oscillator Circuit Diagram
2. Refer to the note and caution paragraphs below the table, and to the application note AN2867 “Oscillator design guide for ST microcontrollers”. 3. The oscillator selection can be optimized in terms of supply current using an high quality resonator with small R value for example MSIV-TIN32.768kHz. -
Page 80: Figure 17. Typical Application With A 32.768 Khz Crystal
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Note: For C and C , it is recommended to use high-quality ceramic capacitors in the 5 pF to 15 pF range selected to match the requirements of the crystal or resonator (see Figure 17). and C are usually the same size. -
Page 81: Internal Clock Source Characteristics
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics 6.3.7 Internal clock source characteristics The parameters given in Table 30 are derived from tests performed under the conditions summarized in Table High-speed internal (HSI) RC oscillator Table 30. HSI oscillator characteristics Symbol Parameter Conditions Unit Frequency = 3.0 V ±... -
Page 82: Table 32. Msi Oscillator Characteristics
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Multi-speed internal (MSI) RC oscillator Table 32. MSI oscillator characteristics Symbol Parameter Condition Max Unit MSI range 0 65.5 MSI range 1 MSI range 2 Frequency after factory calibration, done at MSI range 3 = 3.3 V and T = 25 °C MSI range 4 1.05... - Page 83 STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Table 32. MSI oscillator characteristics (continued) Symbol Parameter Condition Max Unit MSI range 0 MSI range 1 MSI range 2 MSI range 3 MSI range 4 MSI oscillator stabilization time µs STAB(MSI) MSI range 5 MSI range 6, Voltage range 1 and 2 MSI range 3,...
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Page 84: Pll Characteristics
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A 6.3.8 PLL characteristics The parameters given in Table 33 are derived from tests performed under the conditions summarized in Table Table 33. PLL characteristics Value Symbol Parameter Unit PLL input clock PLL_IN PLL input clock duty cycle PLL output clock PLL_OUT PLL lock time... -
Page 85: Table 35. Flash Memory And Data Eeprom Characteristics
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Flash memory and data EEPROM Table 35. Flash memory and data EEPROM characteristics Symbol Parameter Conditions Unit Operating voltage 1.65 Read / Write / Erase Programming/ erasing Erasing 3.28 3.94 time for byte / word / prog Programming 3.28... -
Page 86: Emc Characteristics
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A 6.3.10 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by two electromagnetic events until a failure occurs. The failure is indicated by the LEDs: •... -
Page 87: Electrical Sensitivity Characteristics
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics To complete these trials, ESD stress can be applied directly on the device, over the range of specification values. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015). Electromagnetic Interference (EMI) The electromagnetic field emitted by the device are monitored while a simple application is executed (toggling 2 LEDs through the I/O ports). -
Page 88: I/O Current Injection Characteristics
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Static latch-up Two complementary static tests are required on six parts to assess the latch-up performance: • A supply overvoltage is applied to each power supply pin • A current injection is applied to each input, output and configurable I/O pin These tests are compliant with EIA/JESD 78A IC latch-up standard. -
Page 89: I/O Port Characteristics
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics 6.3.13 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in Table 48 are derived from tests performed under the conditions summarized in Table 13. All I/Os are CMOS and TTL compliant. Table 42. I/O static characteristics Symbol Parameter Conditions... -
Page 90: Table 43. Output Voltage Characteristics
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Output driving current The GPIOs (general purpose input/outputs) can sink or source up to ±8 mA, and sink or source up to ±20 mA with the non-standard V specifications given in Table In the user application, the number of I/O pins which can drive current must be limited to respect the absolute maximum rating specified in Section 6.2:... -
Page 91: Table 44. I/O Ac Characteristics
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Input/output AC characteristics The definition and values of input/output AC characteristics are given in Figure 18 Table 44, respectively. Unless otherwise specified, the parameters given in Table 44 are derived from tests performed under the conditions summarized in Table Table 44. -
Page 92: Nrst Pin Characteristics
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Figure 18. I/O AC characteristics definition t r(IO)out EXTERNAL t f(IO)out OUTPUT ON 50pF Maximum frequency is achieved if (t r + t f ) ≤ 2/3)T and if the duty cycle is (45-55%) when loaded by 50pF ai14131c 6.3.14 NRST pin characteristics... -
Page 93: Tim Timer Characteristics
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Figure 19. Recommended NRST pin protection External reset circuit(1) R PU Internal reset NRST Filter 0.1 μF STM32L1xx ai17854b 1. The reset network protects the device against parasitic resets. 0.1 uF capacitor must be placed as close as possible to the chip. -
Page 94: Communications Interfaces
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A 6.3.16 Communications interfaces C interface characteristics The device I C interface meets the requirements of the standard I C communication protocol with the following restrictions: SDA and SCL are not “true” open-drain I/O pins. When configured as open-drain, the PMOS connected between the I/O pin and V disabled, but is still present. -
Page 95: Table 48. Scl Frequency
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Figure 20. I C bus AC waveforms and measurement circuit DD_I2C DD_I2C STM32L1xx C bus S TART REPEATED S TART S TART su(STA) r(SDA) f(SDA) su(SDA) su(STA:STO) S TOP h(SDA) h(STA) w(SCKL) su(STO) r(SCK) w(SCKH) f(SCK) ai17855c 1. - Page 96 Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A SPI characteristics Unless otherwise specified, the parameters given in the following table are derived from tests performed under the conditions summarized in Table Refer to Section 6.3.12: I/O current injection characteristics for more details on the input/output alternate function characteristics (NSS, SCK, MOSI, MISO).
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Page 97: Figure 21. Spi Timing Diagram - Slave Mode And Cpha = 0
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Figure 21. SPI timing diagram - slave mode and CPHA = 0 NSS input MISO MSB OUT BIT6 OUT LSB OUT OUTPUT (SI) MOSI MSB IN LSB IN BIT1 IN INPUT (SI) Figure 22. SPI timing diagram - slave mode and CPHA = 1 NSS input SU(NSS) h(NSS) -
Page 98: Figure 23. Spi Timing Diagram - Master Mode
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Figure 23. SPI timing diagram - master mode High NSS input t c(SCK) CPHA= 0 CPOL=0 CPHA= 0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 t w(SCKH) t r(SCK) t su(MI) t w(SCKL) t f(SCK) MISO BIT6 IN MSB IN LSB IN INP UT... -
Page 99: Table 50. Usb Startup Time
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics USB characteristics The USB interface is USB-IF certified (full speed). Table 50. USB startup time Symbol Parameter Unit USB transceiver startup time µs STARTUP 1. Guaranteed by design. Table 51. USB DC electrical characteristics Symbol Parameter Conditions Min. -
Page 100: Table 53. I2S Characteristics
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A 1. Guaranteed by design. 2. Measured from 10% to 90% of the data signal. For more detailed informations, refer to USB Specification - Chapter 7 (version 2.0). I2S characteristics Table 53. I2S characteristics Symbol Parameter Conditions Unit I2S Main Clock Output 256 x 8K 256xFs... -
Page 101: Figure 25. I 2 S Slave Timing Diagram (Philips Protocol)
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Figure 25. I S slave timing diagram (Philips protocol) 1. Measurement points are done at CMOS levels: 0.3 × V and 0.7 × V 2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first byte. -
Page 102: 12-Bit Adc Characteristics
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A 6.3.17 12-bit ADC characteristics Unless otherwise specified, the parameters given in Table 55 are guaranteed by design. Table 54. ADC clock frequency Symbol Parameter Conditions Unit REF+ = < V REF+ 2.4 V ≤ V ≤ 3.6 V >... - Page 103 STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Table 55. ADC characteristics (continued) Symbol Parameter Conditions Unit Direct channels 0.25 2.4 V ≤ V ≤ 3.6 V Multiplexed channels 0.56 2.4 V ≤ V ≤ 3.6 V µs Sampling time Direct channels 0.56 1.8 V ≤ V ≤...
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Page 104: Table 56. Adc Accuracy
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A (1)(2) Table 56. ADC accuracy Symbol Parameter Test conditions Unit Total unadjusted error Offset error 2.4 V ≤ V ≤ 3.6 V 2.4 V ≤ V ≤ 3.6 V REF+ Gain error = 8 MHz, R = 50 Ω... -
Page 105: Table 57. Maximum Source Impedance Rain Max
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics Figure 27. ADC accuracy characteristics Output code (1) Example of an actual transfer curve (2) Ideal transfer curve (3) End-point correlation line = ADC resolution = total unajusted error: maximum deviation between the actual and ideal transfer curves = offset error: maximum deviation between the first actual transition and the first ideal one = gain error: deviation between the last ideal... -
Page 106: Figure 29. Maximum Dynamic Current Consumption On V
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Figure 29. Maximum dynamic current consumption on V supply pin during ADC REF+ conversion Sampling (n cycles) Conversion (12 cycles) ADC clock ref+ 700µA 300µA MS36686V1 Table 57. Maximum source impedance R max (kΩ) Ts (cycles) Multiplexed channels Direct channels (µs) -
Page 107: Dac Electrical Specifications
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics 6.3.18 DAC electrical specifications Data guaranteed by design, unless otherwise specified. Table 58. DAC characteristics Symbol Parameter Conditions Unit Analog supply voltage Reference supply must always be below REF+ REF+ voltage Lower reference voltage REF- Current consumption on No load, middle code (0x800) supply DDVREF+... - Page 108 Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Table 58. DAC characteristics (continued) Symbol Parameter Conditions Unit = 3.3V = 3.0V REF+ = 0 to 50 °C DAC output buffer OFF Offset error temperature dOffset/dT µV/°C coefficient (code 0x800) = 3.3V = 3.0V REF+ = 0 to 50 °C DAC output buffer ON ≤...
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Page 109: Operational Amplifier Characteristics
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics 4. Difference between measured value at Code i and the value at Code i on a line drawn between Code 0 and last Code 4095. 5. Difference between the value measured at Code (0x800) and the ideal value = V REF+ 6. - Page 110 Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A Table 59. Operational amplifier characteristics (continued) Symbol Parameter Condition Unit Normal mode Power supply PSRR rejection ratio Low-power mode Normal mode 1000 3000 >2.4 V Low-power mode Bandwidth Normal mode 2200 <2.4 V Low-power mode >2.4 V Normal mode (between 0.1 V and -0.1 V)
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Page 111: Temperature Sensor Characteristics
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics 6.3.20 Temperature sensor characteristics Table 60. Temperature sensor calibration values Calibration value name Description Memory address TS ADC raw data acquired at temperature of 30 °C ±5 °C TS_CAL1 0x1FF8 00FA - 0x1FF8 00FB = 3 V ±10 mV TS ADC raw data acquired at temperature of 110 °C ±5 °C TS_CAL2... -
Page 112: Table 63. Comparator 2 Characteristics
Electrical characteristics STM32L151xC/C-A STM32L152xC/C-A 1. Guaranteed by characterization results. 2. The delay is characterized for 100 mV input step with 10 mV overdrive on the inverting input, the non- inverting input set to the reference. 3. Comparator consumption only. Internal reference voltage not included. Table 63. -
Page 113: Lcd Controller
STM32L151xC/C-A STM32L152xC/C-A Electrical characteristics 6.3.22 LCD controller The device embeds a built-in step-up converter to provide a constant LCD reference voltage independently from the V voltage. An external capacitor C must be connected to the pin to decouple this converter. Table 64. -
Page 114: Package Information
Package information STM32L151xC/C-A STM32L152xC/C-A Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. -
Page 115: Figure 32. Lqfp64 Recommended Footprint
STM32L151xC/C-A STM32L152xC/C-A Package information Table 65. LQFP64 mechanical data (continued) millimeters inches Symbol 0.090 0.200 0.0035 0.0079 12.000 0.4724 10.000 0.3937 7.500 0.2953 12.000 0.4724 10.000 0.3937 7.500 0.2953 0.500 0.0197 0° 3.5° 7° 0° 3.5° 7° 0.450 0.600 0.750 0.0177 0.0236 0.0295... -
Page 116: Figure 33. Lqfp64 Top View Example
ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. -
Page 117: Wlcsp64 Package Information
STM32L151xC/C-A STM32L152xC/C-A Package information WLCSP64 package information WLCSP64 is a 64-ball, 0.4 mm pitch wafer level chip scale package. Figure 34. WLCSP64 outline bbb Z Detail A Bump side Side view Bump Orientation reference Seating plane (4x) Detail A Wafer back side (rotated 90 °) A0JV_ME_V2 1. -
Page 118: Table 67. Wlcsp64 Recommended Pcb Design Rules
Package information STM32L151xC/C-A STM32L152xC/C-A Table 66. WLCSP64 mechanical data (continued) millimeters inches Symbol 4.504 4.539 4.574 0.1773 0.1787 0.1801 4.876 4.911 4.946 0.1920 0.1933 0.1947 0.400 0.0157 2.800 0.1102 0.870 0.0343 1.056 0.0416 0.100 0.0039 0.100 0.0039 0.100 0.0039 0.050 0.0020 0.050 0.0020... -
Page 119: Figure 36. Wlcsp64 Top View Example
ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. -
Page 120: Lqfp100 Package Information
Package information STM32L151xC/C-A STM32L152xC/C-A LQFP100 package information LQFP100 is a 100-pin, 14 x 14 mm, low-profile quad flat package. Figure 37. LQFP100 outline SEATING PLANE 0.25 mm GAUGE PLANE PIN 1 IDENTIFICATION 1L_LQFP100_ME_V1 1. Drawing is not to scale. Table 68. LQPF100 mechanical data millimeters inches Symbol... -
Page 121: Figure 38. Lqfp100 Recommended Footprint
STM32L151xC/C-A STM32L152xC/C-A Package information Table 68. LQPF100 mechanical data (continued) millimeters inches Symbol 0.0° 3.5° 7.0° 0.0° 3.5° 7.0° 0.080 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. Figure 38. LQFP100 recommended footprint 16.7 14.3 12.3... -
Page 122: Figure 39. Lqfp100 Top View Example
ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. -
Page 123: Ufbga132 Package Information
STM32L151xC/C-A STM32L152xC/C-A Package information UFBGA132 package information UFBGA132 is a 132-ball, 7 x 7 mm, ultra thin, fine-pitch ball grid array package. Figure 40. UFBGA132 outline A1 ball identifier Øb (132 balls) BOTTOM VIEW TOP VIEW Ø C A B Ø... -
Page 124: Figure 41. Ufbga132 Recommended Footprint
Package information STM32L151xC/C-A STM32L152xC/C-A Table 69. UFBGA132 mechanical data (continued) millimeters inches Symbol 0.080 0.0031 0.150 0.0059 0.050 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Figure 41. UFBGA132 recommended footprint 124/134 DS10262 Rev 8... -
Page 125: Figure 42. Ufbga132 Top View Example
ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. -
Page 126: Lqfp144 Package Information
Package information STM32L151xC/C-A STM32L152xC/C-A LQFP144 package information LQFP144 is a 144-pin 20 x 20 mm, low-profile quad flat package. Figure 43. LQFP144 outline SEATING PLANE 0.25 mm ccc C GAUGE PLANE PIN 1 IDENTIFICATION 1A_ME_V3 1. Drawing is not to scale. 126/134 DS10262 Rev 8... -
Page 127: Table 70. Lqfp144 Mechanical Data
STM32L151xC/C-A STM32L152xC/C-A Package information Table 70. LQFP144 mechanical data millimeters inches Symbol 1.600 0.0630 0.050 0.150 0.0020 0.0059 1.350 1.400 1.450 0.0531 0.0551 0.0571 0.170 0.220 0.270 0.0067 0.0087 0.0106 0.090 0.200 0.0035 0.0079 21.800 22.000 22.200 0.8583 0.8661 0.8740 19.800 20.000 20.200... -
Page 128: Figure 45. Lqfp144 Top View Example
ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. -
Page 129: Thermal Characteristics
STM32L151xC/C-A STM32L152xC/C-A Package information Thermal characteristics The maximum chip-junction temperature, T max, in degrees Celsius, may be calculated using the following equation: max = T max + (P max × Θ Where: • max is the maximum ambient temperature in °C, •... -
Page 130: Reference Document
Package information STM32L151xC/C-A STM32L152xC/C-A Figure 46. Thermal resistance suffix 6 3000.00 2500.00 Forbidden areaTJ > TJ max 2000.00 PD (mW) LQFP64 10x10 mm / WLCSP64 1500.00 UFBGA132 7x7 mm LQFP144 20x20 mm LQFP 100 14x14 mm 1000.00 500.00 0.00 Temperature (°C) MS31407V4 Figure 47. -
Page 131: Ordering Information
TR = tape and reel No character = tray or tube For a list of available options (speed, package, etc.) or for further information on any aspect of this device, contact the nearest ST sales office. DS10262 Rev 8 131/134... -
Page 132: Revision History
Revision History STM32L151xC/C-A STM32L152xC/C-A Revision History Table 73. Document revision history Date Revision Changes 01-Apr-2014 Initial release. Updated Table 3: Functionalities depending on the operating power supply range. Updated Table 17: Current consumption in Run mode, code with data processing running from Flash. - Page 133 STM32L151xC/C-A STM32L152xC/C-A Revision History Table 73. Document revision history (continued) Date Revision Changes Updated Table 16: Embedded internal reference voltage temperature coefficient at 100ppm/°C. and table note 3: “guaranteed by design” changed by “guaranteed by characterization results”. Updated Table 63: Comparator 2 characteristics new maximum threshold voltage temperature coefficient at 100ppm/°C.
- Page 134 ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
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