Table 67. Wlcsp64 Recommended Pcb Design Rules; Figure 35. Wlcsp64 Recommended Footprint - ST STM32L15 QC Series Datasheet

Package information
Symbol
D
E
e
e1
F
G
aaa
bbb
ccc
ddd
eee
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Dimension
Pitch
Dpad
Dsm
PCB pad design
118/134
Table 66. WLCSP64 mechanical data (continued)
millimeters
Min Typ
4.504 4.539
4.876 4.911
- 0.400
- 2.800
- 0.870
- 1.056
- -
- -
- -
- -
- -

Figure 35. WLCSP64 recommended footprint

Table 67. WLCSP64 recommended PCB design rules

DS10262 Rev 8
STM32L151xC/C-A STM32L152xC/C-A
Max Min
4.574 0.1773
4.946 0.1920
- -
- -
- -
- -
0.100 -
0.100 -
0.100 -
0.050 -
0.050 -
Dpad
Dsm
Recommended values
0.4
260 µm max. (circular)
220 µm recommended
300 µm min. (for 260 µm diameter pad)
Non-solder mask defined via underbump allowed.
(1)
inches
Typ Max
0.1787 0.1801
0.1933 0.1947
0.0157 -
0.1102 -
0.0343 -
0.0416 -
- 0.0039
- 0.0039
- 0.0039
- 0.0020
- 0.0020
MS18965V2