Heat Spreader - AXIOMTEK SCM186 User Manual

SCM186 NXP i.MX 8M Plus ARM-based Evaluation Kit

2.3.2 Heat Spreader

The heat spreader is designed for the SCM186 module. The thermal pad on the heat spreader
is designed to make contact with the necessary components on the SCM186 module. When
mounting the heat spreader, you must make sure that the thermal pads on the heat spreader
make complete contact (no space between thermal pad and component) with the
corresponding components on the SCM186 module, and then a customized heatsink or thermal
chassis must be completely contacted with the heat spreader. This is especially critical for
SCM186 module that is with high CPU speed to ensure that the heat spreader acts as a proper
thermal interface for cooling solutions.
This SMARC module has four assembly holes for installing heat spreader plate. Use the four
copper pillar screws and four screws to secure the heat spreader to the SCM186 module. The
heat spreader has another four assembly holes (using M3 screws) can be used for installing a
customized heatsink or a thermal chassis as a proper thermal interface for cooling solutions.
Be careful not to over-tighten the screws.
8 Board and Pin Assignments