SCM188 NXP i.MX 8M Plus ARM-based SMARC Module
2.3.2 Heat Spreader
The heat spreader is designed for the SCM188 module. The thermal pad on the heat spreader
is designed to make contact with the necessary components (refer to the red marks in 2.3.1
drawing) on the SCM188 module. When mounting the heat spreader, you must make sure that
the thermal pads on the heat spreader make complete contact (no space between thermal pad
and component) with the corresponding components on the SCM188 module, and then a
customized heatsink or thermal chassis must be completely contacted with the heat spreader.
This is especially critical for SCM186 module that is with high CPU speed to ensure that the
heat spreader acts as a proper thermal interface for cooling solutions.
This SMARC module has four assembly holes for installing heat spreader plate. Use the four
copper pillar screws and four screws to secure the heat spreader to the SCM188 module. The
heat spreader has another four assembly holes (using M3 screws) can be used for installing a
customized heatsink or a thermal chassis as a proper thermal interface for cooling solutions.
Be careful not to over-tighten the screws.
8
Board and Pin Assignments
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