iWave iW-RainboW-G40D User Manual
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i.MX 8M Plus SMARC Development Platform Hardware User Guide
iW-RainboW-G40D
i.MX 8M Plus Quad/QuadLite/Dual
SMARC Development Platform
Hardware User Guide
REL1.0
iWave Systems Technologies Pvt. Ltd.
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Summary of Contents for iWave iW-RainboW-G40D

  • Page 1 8M Plus SMARC Development Platform Hardware User Guide iW-RainboW-G40D i.MX 8M Plus Quad/QuadLite/Dual SMARC Development Platform Hardware User Guide REL1.0 iWave Systems Technologies Pvt. Ltd. Page 1 of 84...
  • Page 2 If you are not the intended recipient (or authorized to receive for the recipient), you are hereby notified that any disclosure, copying distribution or use of any of the information contained within this document is STRICTLY PROHIBITED. Thank you. “iWave Systems Tech. Pvt. Ltd.” REL1.0 iWave Systems Technologies Pvt.
  • Page 3 No warranty of accuracy is given concerning the contents of the information contained in this publication. To the extent permitted by law no liability (including liability to any person by reason of negligence) will be accepted by iWave Systems, its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or inaccuracies in this document.
  • Page 4: Table Of Contents

    2.8.4 Capacitive Touch Connector ........................70 2.8.5 USB2.0 Header ............................71 2.8.6 Display Backlight Power Header ......................72 On Board Settings ............................. 74 2.10 Carrier Expansion Connectors ........................76 TECHNICAL SPECIFICATION ..........................81 REL1.0 iWave Systems Technologies Pvt. Ltd. Page 4 of 84...
  • Page 5 Mechanical Characteristics........................84 3.4.1 i.MX 8M Plus Q/QL/D SMARC Carrier Board Mechanical Dimensions ............. 84 3.4.2 Guidelines to insert the SMARC SOM into Carrier Board ................ 86 ORDERING INFORMATION ..........................88 REL1.0 iWave Systems Technologies Pvt. Ltd. Page 5 of 84...
  • Page 6 Figure 30: Mechanical dimension of i.MX 8M Plus Q/QL/D SMARC Carrier Board- Bottom View ......... 85 Figure 31: Mechanical dimension of i.MX 8M Plus Q/QL/D SMARC Carrier Board- Side View ..........86 Figure 32: SOM Insertion Guideline ............................ 87 REL1.0 iWave Systems Technologies Pvt. Ltd. Page 6 of 84...
  • Page 7 Table 22: Expansion Connector2 Pinout ..........................78 Table 23: Power Input Requirement ........................... 82 Table 24: Power Output Specification ..........................82 Table 25: Environmental Specification ..........................83 Table 26: Orderable Product Part Numbers ........................88 REL1.0 iWave Systems Technologies Pvt. Ltd. Page 7 of 84...
  • Page 8: Introduction

    “iW-RainboW-G40M-i.MX 8M Plus-SMARC-SOM-HardwareUserGuide”. Overview iW-RainboW-G40D-i.MX 8M Plus Development Platform comes with i.MX 8M Plus Q/QL/D based SMARC SOM, SMARC V2.1.1 Generic Carrier. The development board can be used for quick prototyping of various applications targeted by the i.MX 8M Plus Q/QL/D application processor. With the 120mmx120mm Nano ITX form factor, SMARC carrier board is highly packed with all the necessary on-board connectors to validate the features of i.MX 8M Plus...
  • Page 9 8M Plus SMARC Development Platform Hardware User Guide Acronyms Abbreviations Secure Digital SMARC SOM Smart Mobility Architecture To Be Defined UART Universal Asynchronous Receiver/Transmitter Universal Serial Bus USB OTG USB On The Go Voltage REL1.0 iWave Systems Technologies Pvt. Ltd. Page 9 of 84...
  • Page 10: Terminology Description

    Note: Signal Type does not include internal pull-ups or pull-downs implemented by the chip vendors and only includes the pull-ups or pull-downs implemented On-SMARC SOM. References • IMX8MPXEC_Rev_x.pdf • iMX_8M_Plus_RM_Revx.pdf • SMARC Specification V2.1.1 REL1.0 iWave Systems Technologies Pvt. Ltd. Page 10 of 84...
  • Page 11: Architecture And Design

    Either MIPI_DSI or LVDS can be supported on SOM, in default configuration MIPI_DSI is supported. Shared between M.2 Connector and 2 Audio Codec iWave Systems Technologies Pvt. Ltd. mktg@iwavesystems.com Figure 1: i.MX 8M Plus Q/QL/D SMARC Development Platform Block Diagram REL1.0...
  • Page 12: I.mx 8M Plus Q/Ql/D Smarc Development Platform Features

    • RTC Coin Cell holder • Capacitive Touch Connector • LVDS Backlight Header On Board Switches • Power ON/OFF Switch • Board Configuration DIP Switch • Boot Selection DIP Switch REL1.0 iWave Systems Technologies Pvt. Ltd. Page 12 of 84...
  • Page 13 At a time, do not set Both the PCIe Channel A & B neither to M.2 connector nor to PCIe X4 connector. Either USB Type C connector or USB 3.0 Type A TOP connector can be supported at a time. Anyone can be selected using on Board Switches. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 13 of 84...
  • Page 14: Smarc Mxm Connector

    This SMARC MXM Edge mating connector (J18) is physically located at the top of the board as shown below. Figure 2: SMARC MXM Connector REL1.0 iWave Systems Technologies Pvt. Ltd. Page 14 of 84...
  • Page 15: Smarc Pcb Edge Connector Pin Assignment

    Dual Magjack. GBE0_MDI3+ GBE0_MDI3+ IO, GBE Gigabit Ethernet0 MDI differential pair 3 positive to bottom port of Dual Magjack. GBE0_LINK100# GBE0_LINK100# I, 3.3V CMOS Ethernet0 100Mbps link status LED REL1.0 iWave Systems Technologies Pvt. Ltd. Page 15 of 84...
  • Page 16 MDI differential pair 0 negative to bottom port of Dual Magjack. GBE0_MDI0+ GBE0_MDI0+ IO, GBE Gigabit Ethernet0 MDI differential pair 0 positive to bottom port of Dual Magjack. SPI0_CS1# Power Ground. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 16 of 84...
  • Page 17 Chip Select 1. ESPI_CS1# QSPI_CS1# SPI1_CK / ESPI_CK ECSPI2_SCLK ECSPI2_SCLK/AH21 I, 1.8V CMOS eCSPI2 Clock. / QSPI_CK SPI1_DIN / ECSPI2_MISO(I2C4_S I2C4_SCL/ AF8 IO, 1.8V CMOS eCSPI2 DATA 0. ESPI_IO_1 QSPI_IO_1 REL1.0 iWave Systems Technologies Pvt. Ltd. Page 17 of 84...
  • Page 18 USB Port1 Data Plus Note: Connected to USB Hub USB1- USB_HUB1OUT_DM IO, USB HS USB Port1 Data Minus Note: Connected to USB Hub USB1_EN_OC# USB_HUB1_OC O, 3.3V CMOS USB Port1 Power REL1.0 iWave Systems Technologies Pvt. Ltd. Page 18 of 84...
  • Page 19 PCIE_A_CKREQ# SAI3_MCLK/AJ20 (Optional Note: In SOM PCIE_CLKREQ_B(S Optionally connected AI3_MCLK)) to PCIE_CLKREQ_B. Power Ground. PCIE_C_REFCK+ PCIE_REF_PAD_CLK_ P/D16 PCIE_C_REFCK- PCIE_REF_PAD_CLK_ N/E16 Power Ground. PCIE_A_REFCK+ PCIE_REFCLK_DP I, PCIe PCIe Reference Clock Positive. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 19 of 84...
  • Page 20 I, TMDS HDMI Transceiver CLK DP1_LANE3- Negative to HDMI Connector. P103 Power Ground. P104 HDMI_HPD / HDMI_TX_HPD HDMI_HPD/AE22 O, 1.8V CMOS HDMI Hot Plug Detect 100K PU DP1_HPD from HDMI Connector. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 20 of 84...
  • Page 21 General Purpose HDA_RST# O4_2(SAI1_RXD0) Input/ Output 4. USB Type C Port selection. P113 GPIO5 / SMARC_GPIO_5_GPI SAI5_RXC/AD14 IO, 1.8V CMOS General Purpose PWM_OUT O3_20(SAI5_RXC) Input/ Output 5. Connected to M.2 Reset. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 21 of 84...
  • Page 22 4bit DIP Switch (SW5). P124 BOOT_SEL1# BOOT_SEL1# O, 1.8V CMOS Boot Media Select bit from 4bit DIP Switch (SW5). BOOT_SEL2# BOOT_SEL2# O, 1.8V CMOS Boot Media Select bit P125 REL1.0 iWave Systems Technologies Pvt. Ltd. Page 22 of 84...
  • Page 23 Expansion Connector1. P135 SER1_RX UART3_RXD NAND_ALE/N25 I,1.8V CMOS UART3 Receiver to Carrier Expansion Connector1 P136 SER2_TX NC (Optionally UART1_TXD/AJ3 O, 1.8V CMOS UART1_TX) Note: In default configuration UART1_TX used for REL1.0 iWave Systems Technologies Pvt. Ltd. Page 23 of 84...
  • Page 24 VDD_IN O, 5V Power Supply Voltage. P154 VDD_IN VDD_IN O, 5V Power Supply Voltage. P155 VDD_IN VDD_IN O, 5V Power Supply Voltage. P156 VDD_IN VDD_IN O, 5V Power Supply Voltage. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 24 of 84...
  • Page 25 Gigabit Ethernet1 GBE1_MDI0- GBE1_MDI0- IO, GBE MDI differential pair 0 negative to top port of Dual Magjack. GBE1_LINK100# GBE1_LINK100# I, 3.3V CMOS Ethernet1 100Mbps link status LED signal to top REL1.0 iWave Systems Technologies Pvt. Ltd. Page 25 of 84...
  • Page 26 NC (Optionally GBE0_SON) GBE1_LINK_ACT# GBE1_LINK_ACT# I, 3.3V CMOS Gigabit Ethernet1 activity status LED signal to top port of Dual Magjack. PCIE_D_RX+ NC (Optionally GBE0_SIP) PCIE_D_RX- NC (Optionally GBE0_SIN) Power Ground. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 26 of 84...
  • Page 27 ND_DATA00) Data Receiver. HDA_CK / I2S2_CK SAI3_TX_BCLK(SAI3_ SAI3_TXC/AH19 I, 1.8V CMOS Serial Audio Interface 3 TXC) Clock. SATA_ACT# USB5_EN_OC# USB_HUB4_OC O, 3.3V CMOS USB Port4 Power Enable/ Over Current Indicator REL1.0 iWave Systems Technologies Pvt. Ltd. Page 27 of 84...
  • Page 28 TypeC Connector (J20). Power Ground. USB3+ USB_OTG1_DP USB1_D_P/D10 IO, USB HS USB Port3 High Speed Data Positive to Top Port of Dual Stack USB3.0 TypeA Connector (J17) or TypeC Connector (J20). REL1.0 iWave Systems Technologies Pvt. Ltd. Page 28 of 84...
  • Page 29 PCIE_B_RST# I, 3.3V CMOS Note: This is optional feature in SOM. PCIE_C_RST# PCIE_C_RX+ NC (Optionally GBE1_SIP) PCIE_C_RX- NC (Optionally GBE1_SIN) Power Ground. PCIE_C_TX+ NC (Optionally GBE1_SOP) PCIE_C_TX- NC (Optionally GBE1_SON) REL1.0 iWave Systems Technologies Pvt. Ltd. Page 29 of 84...
  • Page 30 / negative DSI1_CLK- S110 Power Ground. S111 LVDS1_0+ / LVDS1_D0_P LVDS1_D0_P/ LVDS1 differential data0 eDP1_TX0+ / positive DSI1_D0+ S112 LVDS1_0- / LVDS1_D0_N LVDS1_D0_N/ LVDS1 differential data0 eDP1_TX0- / negative DSI1_D0- REL1.0 iWave Systems Technologies Pvt. Ltd. Page 30 of 84...
  • Page 31 Lane 0 Positive DSI0_D0+ Note: Optionally LVDS0_D0_P/ D29 connected to LVDS0 differential data0 positive S126 LVDS0_0- / LVDS0/DSI0_D0_N MIPI_DSI1_D0_N/ I, MIPI MIPI DSI Differential Data eDP0_TX0- / Lane 0 Negative DSI0_D0- REL1.0 iWave Systems Technologies Pvt. Ltd. Page 31 of 84...
  • Page 32 NAND_DATA02/ I, 1.8V CMOS Display Power Enable. 3_8(NAND_DATA02) S134 LVDS0_CK+ / LVDS0/DSI0_CLK_P MIPI_DSI1_CLK_P/ I, MIPI MIPI DSI Differential eDP0_AUX+ / Clock Positive DSI0_CLK+ Note: Optionally LVDS0_CLK_P/ F29 connected to LVDS0 REL1.0 iWave Systems Technologies Pvt. Ltd. Page 32 of 84...
  • Page 33 Watchdog Time Out Interrupt. S146 PCIE_WAKE# GPIO_PCIe_Wake(G GPIO1_IO14/A4 O, 3.3V CMOS PCIe wake up interrupt to PIO1_IO14) host. S147 VDD_RTC VRTC_3V0 O, 3V Power RTC backup power. Connected to RTC battery holder. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 33 of 84...
  • Page 34 I, 1.8V CMOS Carrier power enable. S155 FORCE_RECOV# FORCE_RECOV# O, 1.8V CMOS Force Recovery. S156 BATLOW# S157 TEST# TEST# I, 1.8V CMOS Connected to 4bit DIP switch (SW6). S158 Power Ground. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 34 of 84...
  • Page 35: Serial Interface Features

    “FT232RQ” via 1.8V to 3.3V level Translator and to USB Micro AB Connector (J24). This USB Micro AB Connector can be used for Debug purpose which is physically located at the top of the board as shown below. Figure 3: Data UART Header REL1.0 iWave Systems Technologies Pvt. Ltd. Page 35 of 84...
  • Page 36: Rs232 Uart Interface (Optional)

    Note: Optionally connected to VCC_3V3 UART1_RX I, 3.3V CMOS UART1 interface Receive signal. UART1_TXD O, 3.3V CMOS UART1 interface Transmit signal. UART1_RTS_B I, 3.3V CMOS UART1 interface Request to Send signal. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 36 of 84...
  • Page 37: Data Uart Header

    Note: Optionally connected to VCC_3V3 UART_RXD UART2_RXD I, 3.3V CMOS UART2 interface Receive signal. UART_TXD UART2_TXD O, 3.3V CMOS UART2 interface Transmit signal. UART_RTS# UART2_RTS_B(SAI3_RXD) I, 3.3V CMOS UART2 interface Request to Send signal. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 37 of 84...
  • Page 38: High Speed Interface Features

    “Table 19: Board Configuration Switch” for more details on selecting PCIe connector. PCIex4 Connector: PCIeX4 connector (J5) is physically located at the top of the board as shown below Figure 6: PCIex4 Connector REL1.0 iWave Systems Technologies Pvt. Ltd. Page 38 of 84...
  • Page 39: Table 6: Pciex4 Connector Pin Out

    Note: Refer SW1 setting from Table 17 to support PCIE0_TX. PERp0 PCIE_RXN_P I, PCIe PCIe Port 0 Receive pair positive. Note: Refer SW1 setting from Table 17 to support PCIE0_RX. GND4 Power Ground. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 39 of 84...
  • Page 40 Note GBE0_SON Connected optionally PERp3 Note: GBE0_SIP Connected optionally GND14 Power Ground. PERn3 Note: GBE0_SIN Connected optionally RSVD3 NC, Reserved Pin. GND21 Power Ground. PRSNT#2_2 RSVD5 NC, Reserved Pin. GND15 Power Ground. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 40 of 84...
  • Page 41: Figure 7: M.2 Connector

    O, 3.3V Power 3.3V Supply Voltage. Power Ground. 1_M.2_PWR_OFF# O, 3.3V CMOS M.2 Full card Power off Signal. FULL_CARD_PO 10K PU WER_OFF# (O)(0/1.8V_3.3V) USB_D+ USB5+ IO, USB USB2.0 Port5 Data Plus. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 41 of 84...
  • Page 42 Serial Audio Interface Channel1 Left WS)(I/O)(0/1.8V) XFS) Right Clock PERN1/USB30_RX- PCIE_RXN_N O, PCIe PCIe1 Receive Negative. Note: To select PCIe Chanel Refer Table /SSIC_RX- UIM-RESET (I) SIM_RST1 O, SIM SIM Card Reset Signal. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 42 of 84...
  • Page 43 Note: To select PCIe Chanel Refer Table GPIO4(TX_BLK/GNSS _1/UIM_PWR2)(I/O)( 0/1.8V) PETP0/SATA_A+ PCIE_TXN_P I, PCIe PCIe0 Transmit Positive. Note: To select PCIe Chanel Refer Table PERST# (O)(0/3.3V) GPIO_PCIE_RST(GPIO O, 3.3V CMOS PCIe Resets Signal. 1_IO12) 10K PU REL1.0 iWave Systems Technologies Pvt. Ltd. Page 43 of 84...
  • Page 44 Ground. VCC_3V3 VCC_3V3 O, 3.3V Power 3.3V Supply Voltage. Power Ground. VCC_3V3 VCC_3V3 O, 3.3V Power 3.3V Supply Voltage. CONFIG_2 1_M.2_CONFIG_2 I, 1.8V CMOS M.2 Configuration Pin 2. 10K PU REL1.0 iWave Systems Technologies Pvt. Ltd. Page 44 of 84...
  • Page 45: Secondary M.2 Interface (Optional)

    O, 3.3V Power 3.3V Supply Voltage. Power Ground. FULL_CARD_POWER 2_M.2_PWR_OFF# O, 3.3V CMOS M.2 Full card Power off Signal. _OFF# 10K PU (O)(0/1.8V_3.3V) USB_D+ USB_HUBOUT2_DP IO, USB USB2.0 Data Plus. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 45 of 84...
  • Page 46 O, SIM SIM Card Reset Signal. PERP1/USB30_RX+/S SIC_RX+ UIM-CLK (I) SIM_CLK2 I, SIM SIM Card Clock Signal. Power Ground. UIM-DATA (I/O) SIM_DAT2 IO, SIM SIM Card Data IO Signal. PETN1/USB3.1-TX- REL1.0 iWave Systems Technologies Pvt. Ltd. Page 46 of 84...
  • Page 47 PETP0/SATA_A+ PERST# (O)(0/3.3V) Power Ground. CLKREQ# (I/O)(0/3.3V) REFCLKN PEWAKE# (I/O)(0/3.3V) REFCLKP MFG_DATA Power Ground. MFG_CLOCK ANTCTL0 (I)(0/1.8 V) COEX3 (I/O)(0/1.8V) SMARC_GPIO_13_GPI O, 1.8V CMOS O3_28(HDMI_CEC) Note: SMARC_GPIO_13_GPIO3_28(HDMI_CEC ) Connected Optionally REL1.0 iWave Systems Technologies Pvt. Ltd. Page 47 of 84...
  • Page 48 Ground. VCC_3V3 VCC_3V3 O, 3.3V Power 3.3V Supply Voltage. Power Ground. VCC_3V3 VCC_3V3 O, 3.3V Power 3.3V Supply Voltage. CONFIG_2 2_M.2_CONFIG_2 I, 1.8V CMOS M.2 Configuration Pin 2. 10K PU REL1.0 iWave Systems Technologies Pvt. Ltd. Page 48 of 84...
  • Page 49: Usb3.0 Host Interface

    SMARC MXM connector USB2 and USB3 ports. This USB3.0 connector is physically located at the top of the board as shown below. Figure 9: USB3.0 Host REL1.0 iWave Systems Technologies Pvt. Ltd. Page 49 of 84...
  • Page 50: Communication Interface Features

    SMARC MXM connector USB1 and USB4 ports. This USB2.0 connector is physically located at the top of the board as shown below REL1.0 iWave Systems Technologies Pvt. Ltd. Page 50 of 84...
  • Page 51: Usb2.0 Otg Interface(Optional)

    (J22). This port can be used as USB OTG functionality which supports USB host and USB device based on USB ID pin status.This USB2.0 OTG connector is physically located at the top of the board as shown below. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 51 of 84...
  • Page 52: Sdio Interface

    This power enable/disable is controlled from the SDIO_PWR_EN pin (P37 ) of SMARC MXM connector. This SD connector (J34) is physically located at the bottom of the board as shown below. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 52 of 84...
  • Page 53: Can Interface

    J9 (CAN1) and J12(CAN0) connectors. Both Connector are placed on Top Side of the Board. Number of Pins Connector Part number : 53047-0610 from Molex Mating Connector Housing : 0510210600 from Molex REL1.0 iWave Systems Technologies Pvt. Ltd. Page 53 of 84...
  • Page 54: Figure 14: Can Header

    Note: Optionally connected to 5V supply Voltage VCC_12V Note: Optionally connected to 12V supply Voltage. CANL FLEXCAN2_TX(SAI5_RXD3) IO, DIFF CAN1 Low-Level Voltage I/O Power Ground. CANH FLEXCAN2_RX(SAI5_MCLK) IO, DIFF CAN1 High-Level Voltage I/O Power Ground. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 54 of 84...
  • Page 55: Audio & Video Features

    SMARC MXM connector is direct connected to I2S Audio Codec “WM8960CGEFL/RV” to support Headphone Stereo output and Mono Mic input through 3.5mm single audio Jack J7. Second Codec is not supported in default BSP, contact iWave support team for enabling second I2S Audio Codec “WM8960CGEFL/RV”. Figure 15: Audio In and Out Ports REL1.0...
  • Page 56: Mipi Dsi Display

    (J1) via EMI protection circuit and is physically located at the top of board as shown below. Number of Pins : 39 Connector Part number :5025983993 from Molex Figure 16: MIPI DSI Display Connector REL1.0 iWave Systems Technologies Pvt. Ltd. Page 56 of 84...
  • Page 57: Table 11: Mipi Dsi Display Connector Pin Out

    MIPI_DSI DATA Lane 1 Positive MIPI_DSI0_D1_N O, MIPI MIPI_DSI DATA Lane 1 Negative Power Ground. MIPI_DSI0_D2_P O, MIPI MIPI_DSI DATA Lane2 Positive MIPI_DSI0_D2_N O, MIPI MIPI_DSI DATA Lane2 Negative Power Ground. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 57 of 84...
  • Page 58: Lvds Connector (Optional)

    The i.MX 8M Plus processor supports both LVDS and MIPI DSI Display but SMARC Edge connector supports any one display interface. Contact iWave Support team for LVDS based SOM module. The LVDS Connector (J30) connector is placed on Bottom side of the board.
  • Page 59: Figure 17: Lvds Display Connector

    LVDS channel differential pair0 positive RIN0+ LVDS0/DSI0_D0_P Power Ground GND3 RIN1- LVDS0/DSI0_D1_N IO, DIFF LVDS channel differential pair1 negative RIN1+ LVDS0/DSI0_D1_P IO, DIFF LVDS channel differential pair1 positive GND4 Power Ground REL1.0 iWave Systems Technologies Pvt. Ltd. Page 59 of 84...
  • Page 60: Hdmi Port

    2.0a interface. HDMI Signals from the SMARC connector is connected to Standard HDMI Type-A connector with ESD protection circuitry. HDMI Output connector (J25) is physically located on top of the board as shown below. Figure 18: HDMI Port REL1.0 iWave Systems Technologies Pvt. Ltd. Page 60 of 84...
  • Page 61: Mipi Csi Camera

    FPC Camera connector, This FPC Camera connector can be used to design Custom Camera module or Customer can make use of the iWave Camera module which is already ready to use. This MIPI CSI0 camera connector (J6) and This MIPI CSI1 camera FPC connector (J4) is physically located on top of the board as shown below.
  • Page 62 MIPI_CSI DATA Lane0 Negative AF-VCC AF-VCC I, Power 1.8V Supply voltage AF-AGND AF-AGND Power AF Ground. Number of Pins J4/J3 : 36/40 Connector Part number J4/J3 : FH12A-36S-0.5SH(55) from Hirose/ FH12A40S-0.5SH(55) from Hirose REL1.0 iWave Systems Technologies Pvt. Ltd. Page 62 of 84...
  • Page 63: Figure 20: Mipi Camera Connector

    I, MIPI MIPI CSI2 differential data lane 2 positive. CAM0_CSI_D2- MIPI_CSI2_D2_N I, MIPI MIPI CSI2 differential data lane 2 negatives. CAM0_RST# SMARC_GPIO_3(GPIO4_1) I, 1.8V CMOS MIPI Camera Reset signal 10K PU REL1.0 iWave Systems Technologies Pvt. Ltd. Page 63 of 84...
  • Page 64 MIPI Camera Reset signal AI1_RXFS) 10K PU CAM1_CSI_D1+ MIPI_CSI1_D1_P I, MIPI MIPI CSI1 differential data lane 1 positive. CAM1_CSI_D1- MIPI_CSI1_D1_N I, MIPI MIPI CSI1 differential data lane 1 negative. Power Ground. CAM0_GPIO CAM1_GPIO REL1.0 iWave Systems Technologies Pvt. Ltd. Page 64 of 84...
  • Page 65: Table 15: Mipi Csi Fpc Camera 40 Pin Connector Pinout (Optional)

    CAMERA_CCMCLKO1(ECSPI I, 1.8V CMOS 2_MISO) CAM1_ENA# CAM1_I2C_CLK I2C3_SCL I, 1.8V OD/ I2C Clock for MIPI_CSI1 Camera. 4.7k PU CAM1_I2C_DAT I2C3_SDA IO, 1.8V OD/ I2C Data for MIPI_CSI1 Camera. 4.7k PU REL1.0 iWave Systems Technologies Pvt. Ltd. Page 65 of 84...
  • Page 66 CAM1_CSI_D1+ MIPI_CSI1_D1_P I, MIPI MIPI CSI1 differential data lane 1 positive. CAM1_CSI_D1- MIPI_CSI1_D1_N I, MIPI MIPI CSI1 differential data lane 1 negative. Power Ground. CAM0_GPIO CAM1_GPIO CAM1_CSI_D2+ CAM1_CSI_D2- CAM1_CSI_D3+ CAM1_CSI_D3- REL1.0 iWave Systems Technologies Pvt. Ltd. Page 66 of 84...
  • Page 67: Lvds1 Connector

    LVDS1 Channel0 negative LV0N+ LVDS1_D0_P I, DIFF LVDS1 Channel0 positive GND1 Power Ground LV1N- LVDS1_D1_N I, DIFF LVDS1 Channel1 negative LV1N+ LVDS1_D1_P I, DIFF LVDS1 Channel1 positive GND2 Power Ground REL1.0 iWave Systems Technologies Pvt. Ltd. Page 67 of 84...
  • Page 68 SMARC_GPIO_12_GPIO3_21( Power Backlight Enable signal NAND_DQS) LED_VCC1 VCC_12V_LVDS Power 12V Supply Voltage LED_VCC2 VCC_12V_LVDS Power 12V Supply Voltage LED_VCC3 VCC_12V_LVDS Power 12V Supply Voltage BIST NC10 NC11 NC12 NC13 NC14 REL1.0 iWave Systems Technologies Pvt. Ltd. Page 68 of 84...
  • Page 69: Additional Features

    The i.MX 8M Plus Q/QL/D SMARC carrier board supports SPI Flash through i.MX 8M Plus SoC’s eCSPI1 interface which is connected from SPI0 port of SMARC MXM connector. This SPI interface signals from SMARC MXM connector is connected to SPI Flash “IS25WP016D-JNLE” and operating at 1.8V Level. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 69 of 84...
  • Page 70: Qspi Flash

    VSS1 Ground VCC_3V3_TFT0 Power Supply Voltage 3.3V I2C2_SCL I, 3.3V CMOS General purpose I2C Clock I2C2_SDA IO, 3.3V CMOS General purpose I2C data RST# RST# O, 3.3V CMOS Hardware Reset REL1.0 iWave Systems Technologies Pvt. Ltd. Page 70 of 84...
  • Page 71: Usb2.0 Header

    The i.MX 8M Plus Q/QL/D SMARC Carrier board supports a 6-pin USB Header (J29) which is placed at bottom side of the board. This connector can be used as general-purpose touch connector using USB interface. Number of Pins Connector Part number : 532610671 from Molex Figure 24: USB2.0 Header REL1.0 iWave Systems Technologies Pvt. Ltd. Page 71 of 84...
  • Page 72: Display Backlight Power Header

    This connector can be used for Display backlight power. Figure 25: Display Backlight Power Header Table 19: Display Backlight Power Header Signal Name Pin Name Signal Type /Termination VCC_12V VCC_12V_LVDS0 12V supply Ground BKLT_EN0 Backlight enable REL1.0 iWave Systems Technologies Pvt. Ltd. Page 72 of 84...
  • Page 73 8M Plus SMARC Development Platform Hardware User Guide Pin Name Signal Name Signal Type /Termination BKLT_PWM0 PWM signal LED_K LED_A REL1.0 iWave Systems Technologies Pvt. Ltd. Page 73 of 84...
  • Page 74: On Board Settings

    (Pulled High) Select [SEL2,SEL1] image 0 -Switch ON (GND) Hi-Z (DIP SW) Note: At a PCIe_A_SEL2 time, do not set Both the M.2 Lane0 PCIe Channel A & B neither REL1.0 iWave Systems Technologies Pvt. Ltd. Page 74 of 84...
  • Page 75 Type A (J17, Top) USB Type C (J20) connector. connector. Carrier Board Main 12V Carrier Board Carrier board (Toggle Carrier Power ON/ OFF Switch Power Power is ON Power is OFF On/Off Switch. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 75 of 84...
  • Page 76: Carrier Expansion Connectors

    Expansion connectors are physically located at the top of board as shown below. Connectors Part number : 20021311-00060T4LF from Amphenol ICC (FCI) Mating Connector : 20021111-00060T4LF from Amphenol ICC (FCI) Figure 27: SMARC Expansion Connector REL1.0 iWave Systems Technologies Pvt. Ltd. Page 76 of 84...
  • Page 77: Table 21: Expansion Connector1 Pinout

    Note: This pin is connected from SMARC Edge connector P135 pin WDT_TIME_OUT# I, 1.8V CMOS Watchdog Time Out Interrupt. Note: This pin is connected from SMARC Edge connector S145 pin Power Ground. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 77 of 84...
  • Page 78: Table 22: Expansion Connector2 Pinout

    8M Plus SMARC Development Platform Hardware User Guide Signal Type / Signal Name Description Termination Table 22: Expansion Connector2 Pinout Signal Type / Signal Name Description Termination REL1.0 iWave Systems Technologies Pvt. Ltd. Page 78 of 84...
  • Page 79 Power Ground. Power Ground. I2C1_SCL I, 1.8V CMOS Note: This is optional feature in SOM. GBE0_SDP O, 3.3V CMOS I2C1_SDA IO, 1.8V CMOS Note: This is optional feature in SOM. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 79 of 84...
  • Page 80 Hard RESET Input to SOM from Reset Push Button Switch (SW3). ESPI_ALERT0# VCC_3V3 Power Supply Voltage 3.3V ESPI_ALERT1# VCC_1V8 Power Supply Voltage 1.8V VCC_5V Power Supply Voltage 5V Power Ground. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 80 of 84...
  • Page 81: Technical Specification

    DC Plugs with an inner dimension of 2.5mm and an outer dimension of 5.5mm. This connector is physically placed at the top of the board as shown below. Figure 28: Power Jack REL1.0 iWave Systems Technologies Pvt. Ltd. Page 81 of 84...
  • Page 82: Power Output Specification

    Power to Add-On Module (through Expansion Connector1) VCC_5V 4.85V 5.15V 1000mA VCC_3V3 3.15 3.45 1000mA VCC_1V8 1000mA Power to Add-On Module (through Expansion Connector2) VCC_5V 4.85V 5.15V 1000mA VCC_3V3 3.15 3.45 1000mA VCC_1V8 1000mA REL1.0 iWave Systems Technologies Pvt. Ltd. Page 82 of 84...
  • Page 83: Environmental Characteristics

    3.3.3 Electrostatic Discharge iWave’s i.MX 8M Plus Q/QL/D SMARC Development Platform is sensitive to electro static discharge and so high voltages caused by static electricity could damage some of the devices on board. It is packed with necessary protection while shipping.
  • Page 84: Mechanical Characteristics

    The i.MX 8M Plus Q/QL/D SMARC Development Platform PCB size is 120 mm x 120 mm x 1.6mm. SMARC Carrier card mechanical dimension is shown below. (All dimensions are shown in mm) Figure 29: Mechanical dimension of i.MX 8M Plus Q/QL/D SMARC Carrier Board- Top View REL1.0 iWave Systems Technologies Pvt. Ltd. Page 84 of 84...
  • Page 85: Figure 30: Mechanical Dimension Of I.mx 8M Plus Q/Ql/D Smarc Carrier Board- Bottom View

    Ethernet Jack J8 (28.58mm) followed by USB3.0 Stack slot J17(15.6mm) and bottom side maximum height component is inductor (7.3mm). Please refer the below figure which gives height details of the i.MX 8M Plus Q/QL/D SMARC Development kit. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 85 of 84...
  • Page 86: Guidelines To Insert The Smarc Som Into Carrier Board

    Once the SMARC module is inserted to the MXM connector properly, press the board vertically down as shown below, such that the board is fixed firmly into the expansion connectors and fix the board by screwing. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 86 of 84...
  • Page 87: Figure 32: Som Insertion Guideline

    8M Plus SMARC Development Platform Hardware User Guide Figure 32: SOM Insertion Guideline REL1.0 iWave Systems Technologies Pvt. Ltd. Page 87 of 84...
  • Page 88: Ordering Information

    Plus Quad CPU, 4GB RAM, 16GB eMMC, Wi-Fi & BT iW-G40D-SCPQ-4L004G-E016G-ACD Commercial - SMARC development kit-Android Note: For Development platform identification purpose, Product part number is pasted as Label with Barcode readable format. REL1.0 iWave Systems Technologies Pvt. Ltd. Page 88 of 84...
  • Page 89 8M Plus SMARC Development Platform Hardware User Guide REL1.0 iWave Systems Technologies Pvt. Ltd. Page 89 of 84...

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