Texas Instruments SimpleLink CC2651R3SIPA Manual page 76

MOU0050A
4 X ( 0.5)
7 X (0.6)
(0.5)
TYP
(1)
(6.2)
(1.6)
13
0.05 MIN
ALL AROUND
NOTES: (continued)
3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments
literature number SLUA271 (www.ti.com/lit/slua271).
39
1
57
54
51
40
15
LAND PATTERN EXAMPLE
SOLDER MASK DEFINED
EXAMPLE BOARD LAYOUT
QFM - 1.51 mm max height
(6.2)
(1)
59
56
53
9 X ( 0.3)
46 x (0.3)
PKG
SCALE:15X
www.ti.com
QUAD FLAT MODULE
28
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
46 X (0.5)
PKG
(R0.05)
TYP
50
16
4226342/B 12/2020