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4.7
PARAMETERS FOR FILLING IN THE PACKAGE FICHE
If an assembly is to be made from this device, use the assembly sheets shown in (Fig. 73 and 75).
For the correct compilation, insert into the appropriate spaces (as shown in the facsimile package fiche (Fig. 72 and 74) the values set out
in the tables "Parameters for compiling package fiche" and "Parameters for compiling DHW pack package fiche".
The remaining values must be obtained from the technical data sheets of the products used to make up the assembly (e.g. solar devices,
integration heat pumps, temperature controllers).
Use sheet (Fig. 73) for "assemblies" related to the heating function (e.g.: boiler + temperature controller).
Use board (Fig. 75) for "assemblies" related to the domestic hot water function (e.g.: boiler + solar thermal system).
Facsimile for filling in the package fiche for room central heating systems.
Temperature control
From temperature
control board
Supplementary boiler
From boiler board
Solar contribution
From the board of the solar device
Dimensions of the
( 'III' x
Supplementary heat pump
From the heat pump
board
Solar contribution and supplementary heat pump
Select the lowest
value
Boiler and supplementary heat pump installed with low temperature heat emitters
at 35 °C?
FFrom the board of the heat
pump
in the distribution system and the size of the products compared to the size and features of the building.
Class I = 1 %, Class II = 2 %,
Class III = 1.5 %, Class IV = 2 %,
Class V = 3 %, Class VI = 4 %,
Class VII = 3.5 %, Class VIII = 5 %
Volume of the
manifold (in m
)
tank (in m
)
2
3
+ 'IV' x
0.5 x
G
F
E
< 30 % ≥ 30 % ≥ 34 % ≥ 36 % ≥ 75 % ≥ 82 % ≥ 90 % ≥ 98 % ≥ 125 %≥ 150 %
(%)
(
- 'I'
) x 0.1
tank
A* = 0.95, A = 0.91,
B = 0.86, C = 0.83,
manifold (in %)
D-G = 0.81
) x (0.9 x (
/ 100) x
room (%)
(
- 'I' ) x 'II'
4
5
O
0.5 x
D
C
B
A
7
+
( 50
x
1
%
'I'
2
+
%
3
±
%
=
4
+
%
=
5
+
%
=
6
-
%
=
7
%
A
A
A
+
++
+++
'II'
)
=
%
72
103
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