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Processors
Intel Xeon 82xx/62xx/52xx/42xx/32xx or 81xx/61xx/51xx/41xx/31xx processor (socket P (LGA3647)) with up to 28 cores and a
thermal design power (TDP) of up to 165W
Note: The X11SPL-F motherboard does not support FPGA or Fabric processors
Note: Please refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel C621
BIOS
256 Mb AMI BIOS
SPI Flash ROM
®
Memory
Up to 512GB of RDIMM, 1TB of LRDIMM, and 2TB of 3DS LRDIMM DDR4 (288-pin) ECC memory with speeds of up to
2933MHz in eight memory slots
See the memory section in Chapter 3 for details and our website for updates to supported memory.
Storage
Forty-five top-loaded hot-swap 3.5" drives, with 2.5" option
Two hot-swap 2.5" SATA drives (rear)
(Optional) Two hot-swap 2.5" NVMe drives (rear)
PCI Expansion Slots
One PCI-Express 3.0 x4 (in x8) Slot (PCH SLOT1)
Three PCI-Express 3.0 x8 Slots (CPU SLOT2, SLOT3, SLOT5); (SLOT7 used by AOC-S3108-H8IR/AOC-S3008-S3008L-L8E
SAS HBA card.)
Two PCI-Express 3.0 x8 (in x16) Slot (CPU SLOT4, SLOT6)
Motherboard
X11SPL-F; ATX 12" (W) x 9.6" (L) (305 mm x 244 mm)
Chassis
SC946LTS-R1K66P1; 4U Rackmount, 17.2 x 7.0 x 26 in. / 437 x 178 x 660 mm. (W x H x D)
System Cooling
Five 8-cm 14.4K RPM PWM fans, one CPU heatsink
Power Supply
Model: Dual PWR-1K66A-1R, 80Plus Titanium level
Total Output Power: 1000 W/1600 W
Input:
100-127 Vac / 12.9 A Max / 50-60 Hz
200-240 Vac / 9.5 A Max / 50-60 Hz
Rated Output Power:
+12 V
Max: 82 A / Min: 0.1 A (100-127 Vac)
Max: 132 A / Min: 0.1 A (200-240 Vac)
1 2 V SB
Max: 2 A / Min: 0. 2 A
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 60º C (-40º to 140º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Appendix C
System Specifications
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Appendix C: System Specifications
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