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Table 30. Thermal restriction matrix for air cooling configuration (continued)
Configuration
Rear configuration
CPU
CPU
Model
TDP
cTDP
Max
280 W 300 W
9354
320 W 400 W
9174F
320 W 400 W
9274F
320 W 400 W
9374F
360 W 400 W
9474F
360 W 400 W
9554
360 W 400 W
9654
NOTE:
● * Supported ambient temperature is 30°C.
● Three dual fan modules are required for single processor, and four dual fan modules are required for dual processor
system.
● All air-cooling configurations require CPU shroud.
● OCP Shroud is required to be installed with No Riser Configuration (RC0) when OCP card is present.
● For CPU power > 240 W, DIMM Blank is required to be installed in all empty DIMM slots. For single processor
configuration, it follows the same rule for DIMM blanks support.
● For single processor configuration with 3 sets of fan, Fan1 location requires fan blank to be installed if there is no fan.
● For air cooling with 2 x 2.5-inch rear drive configuration, it is required to install Rear Drive Shroud in the system.
Table 31. Thermal restriction matrix for memory configuration
Configurat
4 x 3.5-inch SAS
ion
Rear
3 LP/ 2 FH
configurati
on
DIMM
STD Fan
Configurat
ion
16 GB
35°C
RDIMM
32 GB
35°C
RDIMM
4 x 3.5-inch
SAS
3 LP/ 2 FH
Core
Count
32
STD Fan*
16
N/A
24
N/A
32
N/A
48
N/A
64
N/A
96
N/A
10 x 2.5-inch SAS
3 LP/ 2 FH
35°C
35°C
10 x 2.5-inch SAS
3 LP/ 2
Rear 2 x
FH
2.5-
inch
SAS
Fan Type
HPR Gold
HPR
HPR
fan*
Gold
Gold fan
fan*
N/A
N/A
HPR
Gold
fan*
N/A
N/A
HPR
Gold
fan*
N/A
N/A
HPR
Gold
fan*
N/A
N/A
HPR
Gold
fan*
N/A
N/A
N/A
N/A
N/A
HPR
Gold
fan*
8 x 2.5-inch NVMe
Rear 2 x 2.5-
3 LP/ 2 FH
inch SAS
HPR Gold fan
35°C
35°C
35°C
35°C
8 x 2.5-inch
No BP
NVMe
3 LP/ 2
2LP
3 LP
FH
HPR
HPR
Gold fan
Gold fan
HPR
HPR
Gold
Gold
fan*
fan*
HPR
HPR
Gold
Gold
fan*
fan*
HPR
HPR
Gold
Gold
fan*
fan*
HPR
HPR
Gold
Gold
fan*
fan*
N/A
N/A
HPR
HPR
Gold
Gold
fan*
fan*
2LP
35°C
35°C
Technical specifications
Ambient
Tempera
ture
35°C
35°C
35°C
35°C
35°C
35°C
35°C
No BP
3 LP
35°C
35°C
35
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