Technical Specifications - Lenovo ThinkSystem SR650 V2 Maintenance Manual

Technical specifications

Table 1. Technical specifications
Specification
Dimension
Weight
Processor (depending
on the model)
Memory
Description
• 2U
• Height: 86.5 mm (3.4 inches)
• Width:
– With rack latches: 482.1 mm (19.0 inches)
– Without rack latches: 445.0 mm (17.5 inches)
• Depth: 763.7 mm (30.1 inches)
Note: The depth is measured with rack latches installed, but without the security bezel
installed.
Up to 38.8 kg (85.5 lb), depending on the server configuration
• Up to two 3rd Gen Intel Xeon scalable processors
• Designed for Land Grid Array (LGA) 4189 socket
• Up to 40 cores per socket
• Supports 3 Intel Ultra Path Interconnect (UPI) links at 11.2 GT/s
• Thermal Design Power (TDP): up to 270 watts
For a list of supported processors, see
.
index.shtml
• Slots: 32 memory module slots
Supports up to 16 Intel Optane Persistent Memory (PMEM) modules
• Supported memory module type:
– TruDDR4 3200, dual-rank, 16 GB/32 GB/64 GB RDIMM
– TruDDR4 3200, quad-rank, 128 GB 3DS RDIMM
– TruDDR4 3200, 128 GB/256 GB PMEM
• Minimum memory:
– 16 GB using RDIMMs
– 128 GB using 3DS RDIMMs
• Maximum memory:
– Without PMEMs:
– 2 TB using RDIMMs
– 4 TB using 3DS RDIMMs
– With PMEMs:
– 5 TB using both RDIMMs and PMEMs in Memory Mode
– 6 TB using both 3DS RDIMMs and PMEMs in App Direct Mode
Note: The operating speed and total memory capacity depend on the processor model and
UEFI settings.
For a list of supported memory options, see
.
index.shtml
https://static.lenovo.com/us/en/serverproven/
https://static.lenovo.com/us/en/serverproven/
.
Chapter 1 ThinkSystem SR650 V2 (7Z72 and 7Z73)
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