2.11 Thermal Management - Avnet Xilinx Zynq 7Z045 Manual

SW15 selects the FMC_ADJ voltage rail to be 2.5 V or 3.3 V. The FMC_VADJ rail powers the
7Z045 VCCO pins for the banks that the baseboard's FMC LPC interface is connected to, banks
10, 11, 12 and 13. The 2.5 V or 3.3 V selection depends on what hardware or application is
connected to the baseboard's FMC LPC connector.
It is VERY IMPORTANT to insure SW13 and SW14 on the Mini-
Module Plus Baseboard 2 are in the UP (K7) position while operating
the Zynq 7Z045 Mini-Module Plus!!! Failure to insure the correct
switch positions prior to powering up the system can cause
damage to the module.
All versions of the Mini-module Plus Baseboard 2 ship with SW13 and SW14 in the UP position to
support K7 and Zynq series Mini-Modules. SW15 is placed in the DOWN position to select 2.5 V
for the FMC_VADJ rail.
Later versions (Rev C and later) only have SW15 (FMC_VADJ) populated. SW13 (DDR Voltage)
and SW14 (VCC_AUX) voltage rails are hard wired to support DDR3 memory and K7 and Zynq
series devices. These voltage settings can be modified by changing the position of the 0-ohm
resistor(s) on the back side of the baseboard.
Refer the Mini-Module plus Baseboard 2 User's Guide on the DRC for more detailed information
about the baseboard power system.
www.em.avnet.com/en-us/design/drc/Pages/Mini-Module-Plus-Baseboard-2.aspx

2.11 Thermal Management

An active heat sink is used to dissipate heat from the 7Z045. A Cool Innovations heat sink
(PN: 3-121204UBFA) and an NMB 12 V fan (PN: 1204KL-04W-B50-B00) are assembled together
and shipped with the Zynq 7Z045 Mini-Module Plus. The active heat sink is powered by connecting
the three position connector (TE PN: 173977-3) to the mating connector on the Mini-Module Plus
Baseboard 2. Earlier versions (Rev B) of the baseboard will not have a mating connector but will
have a pigtail provided with the board to connect to the fan connector.
For aggressive applications that utilize large amounts of ZYNQ PL resources it is recommended
that an accurate worst-case power analysis be performed to avoid the pitfalls of overdesigning or
under designing your product's power or cooling system, using the Xilinx Power Estimator (XPE).
NOTICE!
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