Packaging - Quectel EG91 Series Hardware Design

Table 51: Recommended Thermal Profile Parameters
Factor
Soak Zone
Max slope
Soak time (between A and B: 150 °C and 200 °C)
Reflow Zone
Max slope
Reflow time (D: over 220°C)
Max temperature
Cooling down slope
Reflow Cycle
Max reflow cycle

8.3. Packaging

EG91 series module is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be
opened until the devices are ready to be soldered onto the application.
The reel is 330mm in diameter and each reel contains 250 modules. The following figures show the
packaging details, measured in mm.
EG91_Series_Hardware_Design
LTE Standard Module Series
EG91 Series Hardware Design
Recommendation
1–3 °C/s
70–120 s
2–3 °C/s
45–70 s
238 °C to 246 °C
-1.5 to -3 °C/s
1
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