Quectel EG91 Series Hardware Design page 93

2.75
0 . 5 0
1 . 5 8
1.10
1.90
1.10
0.70
62x0.7
62x1.15
Figure 43: EG91-EX Module Bottom Dimensions (Top View)
NOTE
1. The package warpage level of the module conforms to the JEITA ED-7306 standard.
EG91_Series_Hardware_Design
7.45
1.10
4 . 8 5
4 . 2 5
0.85
1.70
1.70
0.55
1.15
40x1.0
40x1.0
LTE Standard Module Series
EG91 Series Hardware Design
25±0.15
7.15
1.95
0 . 3 3
2 . 9 3
5.10
1.70
0.85
5 . 9 5
1.00
1.00
1 . 7 0
0 . 4 0
1 . 7 0
1.10
1 . 6 3
1.00
0.20
8.50
2.75
1 . 7 0
1.70
0 . 4 0
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0 . 5 0