Specifications And Documents - Beckhoff CB3053 Manual

Chapter: Overview

2.2 Specifications and Documents

In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.

PCI Specification
Version 2.3 resp. 3.0
www.pcisig.com

ACPI Specification
Version 3.0
www.acpi.info

ATA/ATAPI Specification
Version 7 Rev. 1
www.t13.org

USB Specifications
www.usb.org

SM-Bus Specification
Version 2.0
www.smbus.org

Intel® Chipset Documentation
SCH Datasheet
www.intel.com

Intel® Chip Documentation
Atom Datasheet
www.intel.com

Winbond® Chip Documentation
W83627HG
www.winbond-usa.com oder www.winbond.com.tw

Intel® Chip Documentation
82575EB Datasheet
www.intel.com
page 14
Specifications and Documents
Beckhoff New Automation Technology CB3053