Specifications And Documents - Beckhoff CB2050 Manual

Chapter: Overview

2.2 Specifications and Documents

In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.

PISA Specification
Version 1.8
us.kontron.com

PCI Specification
Version 2.3 resp. 3.0
www.pcisig.com

Mini-PCI Specification
Version 1.0
www.pcisig.com

ACPI Specification
Version 3.0
www.acpi.info

ATA/ATAPI Specification
Version 7 Rev. 1
www.t13.org

USB Specifications
www.usb.org

SM-Bus Specification
Version 2.0
www.smbus.org

Intel Chipset Description
Intel 855GM/855GME Chipset Graphics and Memory Controller Hub
www.intel.com

Intel Chip Description
ICH4 Datasheet
www.intel.com

Intel Chip Descriptions
Celeron M, Pentium M
www.intel.com

Winbond Chip Description
W83627HF Datasheet
www.winbond-usa.com oder www.winbond.com.tw

Intel Chip Description
82562EZ/GZ Datasheet
www.intel.com

Intel Chip Description
82541ER Datasheet
www.intel.com

ICS Chip Description
ICS950813 Datasheet
www.idt.com
page 14
Specifications and Documents
Beckhoff New Automation Technology CB2050