Specifications And Documents - Beckhoff CB1050 Manual

Chapter: Overview

2.2 Specifications and Documents

In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.

ATX specification
Version 2.2
www.formfactors.org

PCI specification
Version 2.3 resp. 3.0
www.pcisig.com

AGP specification
Version 3.0
http://members.datafast.net.au/~dft0802/

ACPI specification
Version 3.0
www.acpi.info

ATA/ATAPI specification
Version 7 Rev. 1
www.t13.org

USB specifications
www.usb.org

SM-Bus specification
Version 2.0
www.smbus.org

Intel® chip set description
Intel® 855GM/855GME Chipset Graphics and Memory Controller Hub
www.intel.com

Intel® chip descriptions
ICH4 Datasheet
www.intel.com

Intel® chip descriptions
Celeron® M, Pentium® M
www.intel.com

Winbond® chip description
W83627HF Datasheet
www.winbond-usa.com oder www.winbond.com.tw

Intel® chip description
82562EZ/GZ Datasheet
www.intel.com

Intel® chip description
82541ER Datasheet
www.intel.com

ICS® chip description
ICS950813 Datasheet
www.idt.com
page 14
Specifications and Documents
Beckhoff New Automation Technology CB1050