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Thermal Specifications
Chapter: Technical Data
8.3 Thermal Specifications
The board is specified to operate in an environmental temperature range from 0°C to +60°C (extended
temperature on request). Maximum die temperature is 90°C. To keep the processor under this threshold an
appropriate cooling solution needs to be applied. This solution has to take typical and maximum power
consumption into account. The maximum power consumption may be twice as high and should be used as
a basis for the cooling concept. Additional controllers may also affect the cooling concept. The power
consumption of such components may be comparable to the consumption of the processor.
The board design includes thermal solution mounting points that will provide the best possible thermal
interface between die and solution. Since we take thermal solutions seriously we have several advanced,
aggressive cooling solutions in our product portfolio. Please contact your sales representative to order or
discuss your thermal solution needs.
C
AUTION
The end customer has the responsibility to ensure that the die temperature of the processor does not
exceed 90°C. Permanent overheating may destroy the board!
In case the temperature exceeds 90°C the environmental temperature must be reduced. Under certain
circumstances sufficient air circulation must be provided.
Beckhoff New Automation Technology CB3053
page 65
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