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1.1.14
Rack
● The rack must be bonded to the grounding/equipotential busbar using the shortest
● All modules and front panels must be screwed onto the rack. This rule also applies to
● Unused slots must be provided with SIMATIC TDC dummy front panels type SR 51 6DD
● The connectors must be screwed/interlocked to the front panel.
● The limit of the air intake temperature may not be exceeded on the rack; refer to Air
● The air intake of the rack must be free of dust as far as possible. The air intake of the
SIMATIC TDC hardware
System Manual, 12/2013, A5E01114865-07
possible conductor with a minimum cross-section of 6 mm
(Page 21).
commissioning phase!
1682-0DA1.
intake temperature (Page 28). The rack must be installed in a way that safely excludes
heat accumulation; refer toArrangement and clearances (Page 20).
rack (bottom) must be cleaned at cyclic intervals depending on the degree of soiling.
Note
With the exception of the MC5xx memory submodule, it is not allowed to hot-swap the
modules. As a matter of principle it is not advisable to remove and insert memory sub-
modules or front connectors on the live component.
For module-specific notes, refer to the corresponding user documentation (hardware).
General technical specifications
1.1 Installation and EMC guidelines
; refer to Equipotential bonding
2
31
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