Fan Module Configuration Guidelines - Huawei E9000 User Manual

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Figure 2-23 Fan speed curve

2.6.4 Fan Module Configuration Guidelines

This section describes the guidelines for configuring fan modules if a chassis houses different
numbers of compute nodes.
Fan modules in the chassis must have sufficient heat dissipation capabilities to ensure that the
compute nodes and the system operate properly.
Issue 25 (2019-11-30)
T < 25°C (77°F): The fan speed is 25%.
25°C (77°F) ≤ T < 30°C (86°F): The fan speed linearly changes between 25% and 40%.
30°C (86°F) ≤ T < 35°C (95°F): The fan speed linearly changes between 40% and 50%.
35°C (95°F) ≤ T < 45°C (113°F): The fan speed linearly changes between 50% and 80%.
45°C (113°F) ≤ T < 55°C (131°F): The fan speed linearly changes between 80% and
100%.
55°C (131°F) ≤ T: The fan speed is 100%.
Possible causes of sudden increases in fan speed are as follows:
l Certain fan units in the fan module zone are abnormal.
l The management modules fail to obtain the temperature of the air intake vent sensor.
l The fan modules fail to communicate with the management modules.
l A board temperature alarm is generated or there are high-temperature board components in the fan
module zone.
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