Technical Specifications - Raise3D Pro2 Manual

Technical Specifications

ITEM
12×12×11.8 inch
CONSTRUCTION
305×305×300 mm
24.4×23.2×29.9 inch / 620×590×760 mm
ELECTRICAL
Max Build Plate Temperature
PRINTER
Operating Ambient Temperature
SOFTWARE
PRINTER
CONTROLLER
Resume Print after Power Outage
Pro2
Single Print Dual
11×12×11.8 inch
280×305×300 mm
Power Supply Input
Power Supply Output
Print Technology
Print Head
Filament Diameter
XYZ Step Size
Print Head Travel Speed
Build Plate
Heated Bed Material
Build Plate Leveling
Supported Materials
Nozzle Diameter
Max Nozzle Temperature
Connectivity
Noise emission (acoustic)
Storage Temperature
Slicing Software
Supported File Types
Supported OS
Machine Code Type
User Interface
Network
WLAN
Screen Resolution
www.raise3d.com
3D PRINTER MANUAL- RAISE3D PRO2 SERIES
Build Volume (W×D×H)
Print* Single Print
12×12×23.8 inch
305×305×605 mm
Machine Size (W×D×H)
24.4×23.2×43.5 inch / 620×590×1105 mm
100-240 V AC, 50/60 Hz 230 V @ 3.3 A
24 V DC, 600 W
FFF
Dual-head with electronic lifting system
1.75 mm
0.78125, 0.78125, 0.078125 micron
30 - 150 mm/s
Heated aluminum build plate with magnetic holding
110 °C
Silicone
Pre-calibrated leveling
PLA/ ABS/ HIPS/ PC/ TPU/ TPE/ NYLON/ PETG/ ASA/ PP/ PVA/
Glass Fiber Filled/ Carbon Fiber Enforced/ Metal Particles Filled
/ Wood Filled
0.4 mm (Default), 0.2/ 0.6/ 0.8/ 1.0 mm (Available)
300 °C
Wi-Fi, LAN, USB port, Live camera
<50 dB(A) when building
15 - 30 °C, 10 - 90% RH non-condensing
-25 °C to +55 °C, 10 - 90% RH non-condensing
ideaMaker
STL, OBJ, 3MF
WINDOWS/ macOS/ LINUX
GCODE
7 inch Touch Screen
10/100 Mbps
IEEE802.11b/g: 2412MHz
IEEE802.11n HT20: 2412MHz
IEEE802.11a: 5150 - 5250MHz, 5725 -5850 MHz
IEEE802.11an HT20: 5150 – 5250 MHz, 5725 - 5850 MHz
IEEE802.11an HT :5150 – 5250 MHz, 5725 - 5850 MHz
Second Generation
1024*600
- 6-
Pro2 Plus
Dual Print*
11×12×23.8 inch
280×305×605 mm