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Thermal Metrology
Figure 5-2.
FCBGA7 Chipset Package Reference Groove Drawing
The orientation of the groove relative to the package pin 1 indicator (gold triangle in
one corner of the package) is shown in
Figure 5-3.
IHS Groove on the FCBGA7 Chipset Package on the Live Board
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Figure 5-3
for the FCBGA7 chipset package IHS.
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