Reference Documents - Intel 3210 Thermal/Mechanical Design Manual

Introduction
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CA
1.3

Reference Documents

The reader of this specification should also be familiar with material and concepts
presented in the following documents:
®
Intel I/O Controller Hub9 (ICH9) Thermal Design Guidelines
®
Intel 3210 and 3200 Chipset Datasheet
®
Intel 3210 and 3200 Chipset Specification Update
Dual-Core Intel
Quad-Core Intel
BGA/OLGA Assembly Development Guide
Various system thermal design suggestions
Note: Contact your Intel field sales representative for the latest revision and order number of this document.
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
upstream of airflow for a passive heatsink or at the fan inlet for
an active heatsink.
Case-to-ambient thermal solution characterization parameter
(Psi). A measure of thermal solution performance using total
package power. Defined as (T
source size should always be specified for Ψ measurements.
Document Title
® ®
Xeon Processor 3000 Series Datasheet
® ®
Xeon Processor 3200 Series Datasheet
- T )/Total Package Power. Heat
C LA
Document Number / Location
Contact your Intel Field Sales
Representative
www.developer.intel.com
www.developer.intel.com
www.developer.intel.com
www.developer.intel.com
Contact your Intel Field Sales
Representative
http://www.formfactors.org
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