Extruded Heatsink Profiles; Design Concept For Reference Thermal Solution; Heatsink Extrusion Profiles - Intel 3210 Thermal/Mechanical Design Manual

Reference Thermal Solution
Figure 6-2.

Design Concept for Reference Thermal Solution

6.4.1

Extruded Heatsink Profiles

The reference thermal solution uses an extruded heatsink for cooling the chipset MCH.
Figure 6-3
increased thermal performance may be available. A full mechanical drawing of this
heatsink is provided in
Figure 6-3.

Heatsink Extrusion Profiles

Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
shows the heatsink profile. Other heatsinks with similar dimensions and
Appendix B.
37