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Summary of Contents for Intel 3210
- Page 1 ® Intel 3210 and 3200 Chipset Thermal/Mechanical Design Guide November 2007 Reference Number: 318465 Revision: 001...
- Page 2 The Intel 3210 and 3200 Chipset, Dual Core Intel Xeon processor 3000 Sequence, and Intel Xeon processor 3200 Sequence may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
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Page 3: Table Of Contents
Inspection of Insulation on Thermocouple ............. 23 Bending the Tip of the Thermocouple ..............23 Extending Slightly the Exposed Wire over the End of Groove ........24 Securing Thermocouple Wire with Kapton* Tape Prior to Attach....... 24 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... - Page 4 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Fastener Nut ....52 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Bracket (1 of 2) ....53 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Bracket (2 of 2) ....54 B-10 Intel®...
- Page 5 Revision History Document Revision Description Date Number Number 318465 • Initial release of the document. November 2007 § Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide...
- Page 6 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide...
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Page 7: Introduction
By maintaining ® Intel 3210 and 3200 Chipsets die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component. -
Page 8: Design Flow
Thermal Interface Material. Thermally conductive material installed between two surfaces to improve heat transfer and reduce interface contact resistance. The local ambient air temperature at the component of interest. The local ambient temperature should be measured just Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 9: Reference Documents
BGA/OLGA Assembly Development Guide Contact your Intel Field Sales Representative Various system thermal design suggestions http://www.formfactors.org Note: Contact your Intel field sales representative for the latest revision and order number of this document. § Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... - Page 10 Introduction Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide...
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Page 11: Packaging Technology
Packaging Technology Packaging Technology ® The Intel 3210 and 3200 Chipset consists of two individual components: the Memory ® ® ® Controller Hub (MCH) and the Intel I/O Controller (Intel ICH9). The Intel 3210 and 3200 Chipset MCH component uses a 40 mm [1.57 in] x 40 mm [1.57 in] Flip Chip Ball Grid Array (FC-BGA) package with an integrated heat spreader (IHS) and 1300 solder balls. -
Page 12: Mch Package Dimensions (Bottom View)
Packaging Technology Figure 2-3. MCH Package Dimensions (Bottom View) Notes: All dimensions are in millimeters. All dimensions and tolerances conform to ANSI Y14.5 - 1994. Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 13: Non-Critical To Function Solder Joints
Figure 2-4. Non-Critical to Function Solder Joints Intel has defined selected solder joints of the MCH as non-critical to function (NCTF) when evaluating package solder joints post environmental testing. The MCH signals at NCTF locations are typically redundant ground or no-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. -
Page 14: Package Height
Please refer to the package drawing in Figure 2-1 to perform a detailed analysis. Figure 2-5. Package Height § Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 15: Thermal Specifications
Analysis indicates that real applications are unlikely to cause the MCH component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). - Page 16 Thermal Specifications Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide...
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Page 17: Thermal Simulation
Computational Fluid Dynamics (CFD)-based thermal analysis tool FLOTHERM* (version 5.1 or higher) by Flomerics, Inc. Contact your Intel field sales representative for the information of the thermal models and user's guides. §... - Page 18 Thermal Simulation Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide...
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Page 19: Thermal Metrology
Thermal Metrology Thermal Metrology The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the MCH IHS temperatures. Section 5.1 provides guidelines on how to accurately measure the MCH case temperature. -
Page 20: Thermal Calibration And Controls
1. It is recommended to follow company-standard procedures and wear safety items like glasses for cutting the IHS and gloves for chemical handling. 2. Please ask your Intel field sales representative if you need assistance to groove and/or install a thermocouple according to the reference process. -
Page 21: Fcbga7 Chipset Package Reference Groove Drawing
The orientation of the groove relative to the package pin 1 indicator (gold triangle in one corner of the package) is shown in Figure 5-3 for the FCBGA7 chipset package IHS. Figure 5-3. IHS Groove on the FCBGA7 Chipset Package on the Live Board Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 22: Thermocouple Attach Procedure
2. Under a microscope verify the thermocouple insulation meets the quality requirements. The insulation should be about 1/16 inch (0.062 ± 0.030) from the end of the bead. Refer to Figure 5-5. Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 23: Inspection Of Insulation On Thermocouple
6. Clean groove and IHS with Isopropyl Alcohol (IPA) and a lint free cloth removing all residues prior to thermocouple attachment. 7. Place the Thermocouple wire inside the groove and let the exposed wire extend slightly over the end of groove. Refer to Figure 5-7. Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 24: Extending Slightly The Exposed Wire Over The End Of Groove
The purpose of this step is to ensure that the Thermocouple tip is in contact with the bottom of groove. Refer Figure 5-9. Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 25: Detailed Thermocouple Bead Placement
12. Thermocouple bead is placed into the bottom of the groove (Refer to Figure 5-11) and a small piece of tape is installed to secure it under the microscope to perform this task. Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 26: Placing Thermocouple Bead Into The Bottom Of The Groove
IHS surface, this should display the same value as read during Thermocouple conditioning Section 5.1.4.1 step 3. This step insures the bead is still making good contact to the IHS. Refer to Figure 5-13. Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 27: Measuring Resistance Between Thermocouple And Ihs
16. Cut two small pieces of solder 1/16 inch (0.065 inch/ 1.5 mm) from the roll using tweezers to hold the solder while cutting with a fine blade. Refer to Figure 5-15. Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 28: Cutting Solder
IHS can reach 150 °C - 155 °C. Make sure to monitor the Thermocouple meter when waiting for solder to flow. Damage to the package may occur if a temperature of 155 °C is exceeded on the IHS. Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 29: Solder Block Setup
Device in place; Two temperature monitoring meters; Heater block fixture. The heater block is currently reading 157 °C and the Thermocouple inside IHS is reading 23 °C. 22. Place the solder fixture on the IHS device. Refer to Figure 5-18. Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 30: Observing The Solder Melting
Use fine tip tweezers to push solder into the end of groove until a solder ball is built up. Refer to Figure 5-19. Figure 5-19. Pushing Solder Back into the End of Groove Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 31: Remove Excess Solder
Note: The wire needs to be straighten in order to keep it at or below the IHS surface. Refer to Figure 5-21. Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 32: Remove Excess Solder
29. Fill the test of the groove with Loctite* 498 Adhesive. Verify under the microscope that the Thermocouple wire is below the surface along the entire IHS groove. Refer Figure 5-23. Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 33: Fill Groove With Adhesive
IHS after attachment is complete. 34. Wind the thermocouple wire into loops and now it’s ready to be used for thermal testing use. Refer to Figure 5-24. Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 34: Finished Thermocouple Installation
Thermal Metrology Figure 5-24. Finished Thermocouple Installation § Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 35: Reference Thermal Solution
Reference Thermal Solution Reference Thermal Solution ® The design strategy of the reference thermal solution for the Intel 3210 and 3200 Chipset uses backing plate stiffness/design to show significant improvement in MB strain and BGA forces. The thermal interface material and extrusion design ®... -
Page 36: Mechanical Design Envelope
® on the Intel 3210 and 3200 Chipset thermal solution are shown in Appendix The location of hole patens and keepout zones for the reference thermal solution are shown in... -
Page 37: Extruded Heatsink Profiles
Other heatsinks with similar dimensions and increased thermal performance may be available. A full mechanical drawing of this heatsink is provided in Appendix Figure 6-3. Heatsink Extrusion Profiles Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 38: Retention Mechanism Responding In Shock And Vibration
TIM is shown in Table 6.1. Intel provides both End of Line and End of Life TIM thermal resistance values of Honeywell PCM45F. End of Line and End of Life TIM thermal resistance values are ® obtained through measurement on a Test Vehicle similar to Intel 3210 and 3200 Chipset’s physical attributes using an extruded aluminum heatsink. -
Page 39: Reference Thermal Solution Assembly Process
Reference Thermal Solution Assembly Process - Heatsink Sub-Assembly (Step 1) 2. Populate the backplate to the motherboard and align the nuts with the studs on the backplate, as shown in Figure 6-5. Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 40: Reliability Guidelines
The testing will be performed with the sample board mounted on a test fixture. The test profiles are unpacked board level. Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 41: Reference Thermal Solution Environmental Reliability Guidelines
It is recommended that the above tests be performed on a sample size of at least twelve assemblies from three lots of material. Additional pass/fail criteria may be added at the discretion of the user. § Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... - Page 42 Reference Thermal Solution Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide...
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Page 43: A Thermal Solution Component Suppliers
Thermal Solution Component Suppliers Heatsink Thermal Solution Intel Part Part Quantity Contact Information Number Heatsink Assembly D96730-001 Monika Chih monika_chih@ccic.com.tw Heatsink D96729-001 886-2-29952666-1131 Retainer D92698-001 Nuts-Inserts D92621-001 Bracket E11663-001 Stiffener-backplate D94244-001 § Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... - Page 44 Thermal Solution Component Suppliers Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide...
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Page 45: B Mechanical Drawings
Intel® 3210 and 3200 Chipset Reference Thermal Solution - Fastener Nut page 52 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Bracket (1 of 2) page 53 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Bracket (2 of 2) page 54 Intel®... -
Page 46: B-1 Intel® 3210 And 3200 Chipset Package Drawing
Mechanical Drawings ® Figure B-1. Intel 3210 and 3200 Chipset Package Drawing Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 47: B-2 Intel® 3210 And 3200 Chipset Motherboard Component Top-Side Keep-Out Restrictions
Mechanical Drawings ® Figure B-2. Intel 3210 and 3200 Chipset Motherboard Component Top-Side Keep-Out Restrictions Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 48: B-3 Intel® 3210 And 3200 Chipset Motherboard Component Back-Side Keep-Out Restrictions
Mechanical Drawings ® Figure B-3. Intel 3210 and 3200 Chipset Motherboard Component Back-Side Keep-Out Restrictions Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 49: B-4 Intel® 3210 And 3200 Chipset Reference Thermal Solution Assembly
Mechanical Drawings ® Figure B-4. Intel 3210 and 3200 Chipset Reference Thermal Solution Assembly Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 50: B-5 Intel® 3210 And 3200 Chipset Reference Thermal Solution - Heatsink Drawing
Mechanical Drawings ® Figure B-5. Intel 3210 and 3200 Chipset Reference Thermal Solution - Heatsink Drawing Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 51: B-6 Intel® 3210 And 3200 Chipset Reference Thermal Solution - Spring Preload Clip
Mechanical Drawings ® Figure B-6. Intel 3210 and 3200 Chipset Reference Thermal Solution - Spring Preload Clip Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 52: B-7 Intel® 3210 And 3200 Chipset Reference Thermal Solution - Fastener Nut
Mechanical Drawings ® Figure B-7. Intel 3210 and 3200 Chipset Reference Thermal Solution - Fastener Nut Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... - Page 53 Mechanical Drawings ® Figure B-8. Intel 3210 and 3200 Chipset Reference Thermal Solution - Bracket (1 of 2) Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide...
- Page 54 Mechanical Drawings ® Figure B-9. Intel 3210 and 3200 Chipset Reference Thermal Solution - Bracket (2 of 2) Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide...
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Page 55: B-10 Intel® 3210 And 3200 Chipset Reference Thermal Solution - Backplate Assembly
Mechanical Drawings ® Figure B-10. Intel 3210 and 3200 Chipset Reference Thermal Solution - Backplate Assembly Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 56: B-11 Intel® 3210 And 3200 Chipset Reference Thermal Solution - Backplate
Mechanical Drawings ® Figure B-11. Intel 3210 and 3200 Chipset Reference Thermal Solution - Backplate Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 57: B-12 Intel® 3210 And 3200 Chipset Reference Thermal Solution - Insulator
Mechanical Drawings ® Figure B-12. Intel 3210 and 3200 Chipset Reference Thermal Solution - Insulator Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide... -
Page 58: B-13 Intel® 3210 And 3200 Chipset Reference Thermal Solution - Flush Mount Stud
Mechanical Drawings ® Figure B-13. Intel 3210 and 3200 Chipset Reference Thermal Solution - Flush Mount Stud § Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide...