Thermal Specifications; Thermal Design Power (Tdp); Thermal Specification - Intel 3210 Thermal/Mechanical Design Manual

Thermal Specifications

3
Thermal Specifications
3.1

Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the MCH component to
consume maximum power dissipation for sustained time periods. Therefore, in order to
arrive at a more realistic power level for thermal design purposes, Intel characterizes
power consumption based on known platform benchmark applications. The resulting
power consumption is referred to as the Thermal Design Power (TDP). TDP is the target
power level that the thermal solutions should be designed to. TDP is not the maximum
power that the chipset can dissipate.
For TDP specifications, see
3200. FC-BGA packages have poor heat transfer capability into the board and have
minimal thermal capability without a thermal solution. Intel recommends that system
designers plan for a heatsink when using the Intel
3.2

Thermal Specification

To ensure proper operation and reliability of the Intel
case temperatures must be at or between the maximum/minimum operating
temperature ranges as specified in
level thermal solutions are required to maintain these temperature specifications. Refer
to Chapter 5
Table 3-1. Intel ® 3210 Chipset Thermal Specifications
TDP
TDP
Notes:
1. The above specifications are based on post-si analysis.
2. The maximum idle power is the worst-case idle power with L1 ASPM state.
®
Table 3-2. Intel 3200 Chipset Thermal Specifications
TDP
TDP
Notes:
1. The above specifications are based on post-silicon analysis.
2. The maximum idle power is the worst case idle power with L1 ASPM state.
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Table 3-1
for guidelines on accurately measuring package die temperatures.
Parameter
T
case_max
T
case_min
dual channel
dual channel
P
Idle_max
Parameter
T
case_max
T
case_min
dual channel
dual channel
P
Idle_max
®
for Intel 3210 Chipset and
®
3210 and 3200 Chipset.
®
3210 and 3200 Chipset, the
Table 3-1 and Table 3-2. System and/or component
Value Notes
96 °C
5 °C
20.2 W DDR2-667
21.3 W DDR2-800
11.3 W
Value Notes
97 °C
5 °C
18.9 W DDR2-667
20.0 W DDR2-800
11.3 W
§
®
Table 3-2 for Intel
15