Packaging Technology; Mch Package Dimensions (Top View); Mch Package Height - Intel 3210 Thermal/Mechanical Design Manual

Packaging Technology

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Packaging Technology
The Intel
Controller Hub (MCH) and the Intel
3200 Chipset MCH component uses a 40 mm [1.57 in] x 40 mm [1.57 in] Flip Chip Ball
Grid Array (FC-BGA) package with an integrated heat spreader (IHS) and 1300 solder
balls. A mechanical drawing of the package is shown in
®
the Intel
Design Guidelines.
Figure 2-1.

MCH Package Dimensions (Top View)

Figure 2-2.

MCH Package Height

Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
®
3210 and 3200 Chipset consists of two individual components: the Memory
ICH9 package, refer to the Intel
® ®
I/O Controller (Intel
Figure
®
I/O Controller Hub9 (ICH9) Thermal
®
ICH9). The Intel 3210 and
2-1. For information on
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