Reference Thermal Solution Environmental Reliability Guidelines - Intel 3210 Thermal/Mechanical Design Manual

Reference Thermal Solution
Table 6-2.

Reference Thermal Solution Environmental Reliability Guidelines

Test
Mechanical Shock
Random Vibration
Temperature Life
Thermal Cycling
Notes:
1. It is recommended that the above tests be performed on a sample size of at least twelve assemblies from
three lots of material.
2. Additional pass/fail criteria may be added at the discretion of the user.
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
(1)
3 drops for + and – directions in each of 3
perpendicular axes
Profile: 50 G, Trapezoidal waveform, 4.3 m/s [170
in/s] minimum velocity change
Duration: 10 min/axis, 3 axes
Frequency Range: 5 Hz to 500 Hz
Power Spectral Density (PSD) Profile: 3.13 g RMS
85 °C, 2000 hours total, checkpoints at 168, 500,
1000, and 2000 hours
-40 °C to +70 °C, 50 cycles
Requirement
§
(2)
Pass/Fail Criteria
Visual Check and Electrical
Functional Test
Visual Check and Electrical
Functional Test
Visual Check
Visual Check
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