Atmel AT24C16C Datasheet page 21

13.7 8U3-1 — 8-ball VFBGA
Notes:
1. This drawing is for general information only.
2. Dimension 'b' is measured at maximum solder ball diameter.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
Package Drawing Contact:
packagedrawings@atmel.com
E
PIN 1 BALL PAD CORNER
TOP VIEW
PIN 1 BALL PAD CORNER
3 4
1 2
6 5
8 7
e
(e1)
BOTTOM VIEW
8 SOLDER BALLS
TITLE
8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch,
Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA)
D
A2
A
SIDE VIEW
d
(d1)
COMMON DIMENSIONS
(Unit of Measure - mm)
SYMBOL
MIN
A 0.73
A1 0.09
A2 0.40
b 0.20
D
E
e
e1
d
d1
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
2. b
A1
NOM
MAX NOTE
0.79 0.85
0.14 0.19
0.45 0.50
0.25 0.30 2
1.50 BSC
2.0 BSC
0.50 BSC
0.25 REF
1.00 BSC
0.25 REF
DRAWING NO.
GPC
GXU
8U3-1
6/11/13
REV.
F
21