Atmel AT24C16C Datasheet
Atmel AT24C16C Datasheet

Atmel AT24C16C Datasheet

I2c-compatible, 2-wire serial eeprom 16-kbit 2048 x 8

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I

Standard Features

Low-voltage and Standard-voltage Operation
̶
V
= 1.7V to 5.5V
CC
Internally Organized as 2,048 x 8 (16K)
2
I
C-compatible (2-wire) Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
1MHz (2.5V, 2.7V, 5V), 400kHz (1.7V) Compatibility
Write Protect Pin for Hardware Data Protection
16-byte Page Write Mode
̶
Partial Page Writes Allowed
Self-timed Write Cycle (5ms Max)
High-reliability
̶
Endurance: 1,000,000 Write Cycles
̶
Data Retention: 100 Years
Green Package Options (Pb/Halide-free/RoHS Compliant)
̶
8-lead PDIP, 8-lead SOIC, 8-lead TSSOP, 8-pad UDFN, 8-pad XDFN,
5-lead SOT23, and 8-ball VFBGA
Die Options: Wafer Form and Tape and Reel
Description
®
The Atmel
AT24C16C provides 16,384 bits of Serial Electrically Erasable and
Programmable Read-Only Memory (EEPROM) organized as 2,048 words of 8 bits
each. The device is optimized for use in many industrial and commercial
applications where low-power and low-voltage operation are essential.
AT24C16C is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead
TSSOP, 8-pad UDFN
8-pad XDFN, 5-lead SOT23, and 8-ball VFBGA packages
,
and is accessed via a 2-wire serial interface.
2
C-Compatible, (2-Wire) Serial EEPROM
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
AT24C16C
16-Kbit (2048 x 8)
DATASHEET

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Summary of Contents for Atmel AT24C16C

  • Page 1: Standard Features

    The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. AT24C16C is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-pad UDFN 8-pad XDFN, 5-lead SOT23, and 8-ball VFBGA packages and is accessed via a 2-wire serial interface.
  • Page 2: Absolute Maximum Ratings

    Maximum Operating Voltage ....6.25V conditions for extended periods may affect device reliability. DC Output Current ..... . .5.0mA AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 3: Block Diagram

    Serial Data (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may be wire-ORed with any number of other open-drain or open-collector devices. Device/Page Addresses: The AT24C16C does not use the device address pins, which limits the number of devices on a single bus to one (see Section 7.
  • Page 4: Memory Organization

    Memory Organization AT24C16C, 16K Serial EEPROM: Internally organized with 128 pages of 16 bytes each, the 16K requires a 11-bit data word address for random word addressing. Pin Capacitance Table 5-1. Pin Capacitance Applicable over recommended operating range from T = 25°C, f = 1.0MHz, V...
  • Page 5 Inputs Rise Time μs Inputs Fall Time Stop Condition Setup Time μs SU.STO Data Out Hold Time Write Cycle Time  Endurance 3.3V, 25 C, Page Mode 1,000,000 Write Cycles Note: This parameter is ensured by characterization only. AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 6: Device Operation

    Stop Condition: A low-to-high transition of SDA with SCL high is a Stop Condition. After a read sequence, the Stop Condition command will place the EEPROM in a standby power mode. Figure 6-2. Start Condition and Stop Condition Definition Start Stop Condition Condition AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 7 DATA IN DATA OUT Start Acknowledge Condition Standby Mode: The AT24C16C features a low-power standby mode which is enabled: Upon power-up.  After the receipt of the Stop Condition and the completion of any internal operations.  2-wire Software Reset: After an interruption in protocol, power loss or system reset, any 2-wire part can be reset by following these steps: Create a Start Condition (if possible).
  • Page 8 SCL: Serial Clock, SDA: Serial Data I/O 8th bit WORDn Start Stop Condition Condition Note: The write cycle time t is the time from a valid Stop Condition of a Write sequence to the end of the internal clear/write cycle. AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 9: Device Addressing

    The EEPROM will respond with a zero after each data word received. The microcontroller must terminate the Page Write sequence with a Stop Condition (see Figure 8-2). AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 10: Read Operations

    EEPROM, the current address data word is serially clocked out. The microcontroller does not respond with an input zero but does generate a following Stop Condition (see Figure 9-1). Figure 9-1. Current Address Read Device Address Data SDA Line AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 11 Sequential Read will continue. The Sequential Read operation is terminated when the microcontroller does not respond with a zero but does generate a following Stop Condition. Figure 9-3. Sequential Read Device Data (n) Data (n + 1) Data (n + 2) Data (n + x) Address SDA Line AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 12: Ordering Code Detail

    = Green, Matte Sn Lead Finish, Industrial Temperature Range (-40˚C to +85˚C) = 11mil Wafer Thickness Package Option = PDIP = JEDEC SOIC = TSSOP = UDFN = XDFN = SOT23 = VFBGA WWU = Wafer Unsawn AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 13: Product Markings

    @ = Country of Assembly AAA...A = Atmel Wafer Lot Number H: Industrial/NiPdAu U: Industrial/Matte Tin/SnAgCu Trace Code Atmel Truncation XX = Trace Code (Atmel Lot Numbers Correspond to Code) AT: Atmel Example: AA, AB..YZ, ZZ ATM: Atmel ATML: Atmel 12/6/16 TITLE DRAWING NO.
  • Page 14: Ordering Information

    AT24C16C-WWU11M Wafer Sale Note 1 Note: For Wafer sales, please contact Atmel Sales. Package Type 8-lead, 0.300" wide, Plastic Dual Inline Package (PDIP) 8-lead, 0.150" wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP) 8MA2 8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Plastic Ultra Thin Dual Flat No Lead (UDFN)
  • Page 15: Packaging Information

    6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 07/31/14 TITLE DRAWING NO. REV. 8P3, 8-lead, 0.300” Wide Body, Plastic Dual Package Drawing Contact: In-line Package (PDIP) packagedrawings@atmel.com AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 16 Refer to JEDEC Drawing MS-012, Variation AA Ø Ø 0° – 8° for proper dimensions, tolerances, datums, etc. 6/22/11 TITLE DRAWING NO. REV. 8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing Package Drawing Contact: Small Outline (JEDEC SOIC) packagedrawings@atmel.com AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 17 0.07mm. 0.09 0.20 5. Dimension D and E1 to be determined at Datum Plane H. 2/27/14 TITLE DRAWING NO. REV. 8X, 8-lead 4.4mm Body, Plastic Thin Package Drawing Contact: Shrink Small Outline Package (TSSOP) packagedrawings@atmel.com AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 18 4. The Pin #1 ID on the Bottom View is an orientation feature on the thermal pad. 11/26/14 TITLE DRAWING NO. REV. 8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally 8MA2 Package Drawing Contact: Enhanced Plastic Ultra Thin Dual Flat No-Lead Package (UDFN) packagedrawings@atmel.com AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 19 1.80 0.15 2.10 2.20 2.30 0.15 0.20 0.25 0.40 TYP 1.20 REF 0.35 0.26 0.30 End View 9/10/2012 DRAWING NO. TITLE REV. 8ME1, 8-pad (1.80mm x 2.20mm body) 8ME1 Package Drawing Contact: Extra Thin DFN (XDFN) packagedrawings@atmel.com AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 20 This drawing is for general information only. Refer to JEDEC 0.30 0.50 Drawing MO-193, Variation AB for additional information. 5/31/12 TITLE DRAWING NO. REV. 5TS1, 5-lead 1.60mm Body, Plastic Thin 5TS1 Package Drawing Contact: Shrink Small Outline Package (Shrink SOT) packagedrawings@atmel.com AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 21 3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu. 1.00 BSC 0.25 REF 6/11/13 TITLE DRAWING NO. REV. 8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, 8U3-1 Package Drawing Contact: Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA) packagedrawings@atmel.com AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 22: Revision History

    Add the UDFN Expanded Quantity Option. 8719C 01/2015 Update the 8X, 8MA2, 8P3, and 8U3-1 package outline drawings, the ordering information section, and the disclaimer page. Minor grammatical corrections. 8719B 07/2013 Update Atmel logos and template. 8719A 09/2010 Initial document release. AT24C16C [DATASHEET] Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016...
  • Page 23 DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT.

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