Packaging Information - Atmel AT24C16C Datasheet

13.

Packaging Information

13.1 8P3 — 8-lead PDIP
D1
A1
b3
4 PLCS
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
Package Drawing Contact:
packagedrawings@atmel.com
1
N
Top View
D
e
A2 A
b2
L
v
m C
b
0.254
Side View
TITLE
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
E
E1
.381
c
eA
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN NOM
SYMBOL
A -
A1 0.381
A2 2.921
b 0.356
b2 1.143
b3 0.762
c 0.203
D 9.017
D1 0.127
E 7.620
E1 6.096
e 2.540 BSC
eA 7.620 BSC
L 2.921 3.302
GPC
PTC
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
Gage Plane
MAX NOTE
- 5.334 2
- -
3.302 4.953
0.457 0.559 5
1.524 1.778 6
0.991 1.143 6
0.254 0.356
9.271 10.160 3
0.000 0.000 3
7.874 8.255 4
6.350 7.112 3
4
3.810 2
07/31/14
DRAWING NO. REV.
8P3 E
15