Design Notes; Power Supply Design; Board Layout - Digi XBee3-PRO Hardware Reference Manual

Hardware
Pin# Name
28 AD3/DIO3
29 AD2/DIO2
30 AD1/DIO1
31 AD0 /DIO0
32 GND
33 RF
34 GND
Signal direction is specified with respect to the device.
This is a complete list of functionalities. See the applicable software manual for available
functionalities.
See

Design notes

* Refer to Writing custom firmware
Design notes
XBee3 modules do not require any external circuitry or specific connections for proper operation.
However, there are some general design guidelines that we recommend to build and troubleshoot a
robust design.

Power supply design

A poor power supply can lead to poor radio performance, especially if you do not keep the supply
voltage within tolerance or if it is excessively noisy. To help reduce noise, place a 1.0 µF and 8.2 pF
capacitor as near as possible to XBee3 pad 2 (VCC) on the PCB. Adding a 10uF decoupling capacitor is
also recommended. If you are using a switching regulator for the power supply, switch the frequencies
above 500 kHz. Limit the power supply ripple to a maximum 50 mV peak to peak. For best results,
place the lower capacitance capacitors closest to the XBee3 module.

Board layout

We design XBee3 modules to be self-sufficient and have minimal sensitivity to nearby processors,
crystals or other printed circuit board (PCB) components. Keep power and ground traces thicker than
signal traces and make sure that they are able to comfortably support the maximum current
specifications. There are no other special PCB design considerations to integrate XBee3 modules, with
the exception of antennas.
XBee3™ RF Module Hardware Reference Manual
for details on pin connections.
for instructions on using these pins if JTAG functions are needed.
Default
Direction state Description
Both Disabled Analog
input/GPIO.
Both Disabled Analog
input/GPIO.
Both Disabled Analog
input/GPIO.
Both Input Analog input /
GPIO /
Commissioning
button.
- - Ground.
Both - RF I/O for RF
pad variant.
- - Ground.
Design notes
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