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6.5.2
Trouble-Detection Sequence
1. Evaluate records of routine alignment.
2. Evaluate any symptoms detected audibly or
visually.
3. Replace suspected plug-in components.
4. Further isolation of faults includes:
• Voltage readings
• Resistance readings
• Signal injection
• Re-alignment
• Sensitivity measurements
• Gain measurements
5. Replace suspected faulty components.
6. Check-out and adjust affected circuits.
It is highly recommended that you do not try to repair or modify modules in the field. Call cus-
tomer service for an RMA number. 800-85-7275 or +1954-344-9822.
May 2012
6.5.3
Servicing Components
Soldered Directly to Terminals
1. Avoid overheating from soldering by using a
low-wattage soldering iron (60W maximum).
2. Make sure there is no current leakage from the
soldering iron.
You may use an isolation transformer to pre-
vent current leakage.
3. When soldering leads from transistors or
diodes, use heat sinks, e.g., alligator clips.
4. You can remove molten solder from the board
with a solder-sucker.
5. When removing a multi-lead component from
a printed circuit board, first cut all leads and
then remove the leads individually (to prevent
overheating). If there are only a few leads,
you can use a broad-tip soldering iron.
NOTE
Chapter 6. Maintenance
Page 6–3
6
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Table of Contents
Troubleshooting
