Sagem myX-5 Technical Documentation Manual page 93

myX-3 & myX-5
4.76 Preliminary operation
1. Control of the IMEI label integrity
2. Remove the electronic board (Proc sheet 1 04)
3. Control of any oxidation marks (on the electronic board and under the metal dome)
4.77 Return procedure :
(a) The electronic boards are packaged in individual electrostatic envelopes . They must be
stocked in their original package of reception , to insure a good protection against external
attacks (see enclosed photos)
During the electronic boards manipulation , gloves and electrostatic strap must be worn at all
(b)
times.
The defective electronic boards have to be returned to SAGEM factory, packaged individually,
(c)
in the original package (see enclosed photos) , in the appropriate ESD box : One box per
Sagem reference (check reference written on the box).
The defective board should display the defect code written on a sticker (placed on the
(d)
shielding) and have the label provided with OMM on each ESD bag .
Note : The defective board must never be mixed with the complete mobiles
4.78 Placement procedure :
1. Take a board in the stock of swap boards from the same Sagem reference.
4.79 Further operations :
1. Place the new electronic board on the assembly plate.
2. Replace the customer housing (Proc Sheet 0 03 et 1 01)
3. Follow stages ( see enclosed photos)
Ref. SCT U38 SSC DTS 009 – Index B - December 12 , 2002
ELECTRONIC BOARD EXCHANGE
.(Proc sheet 1
Proc Sheet 1 11
1/3
04)
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