Samsung MultiXpress M537x series Service Manual page 3

2.6.2. Fuser unit drive ........................................................................................................... 2 − 39
2.6.3. Fuser unit temperature control........................................................................................ 2 − 40
2.7. Laser Scanning Unit (LSU)........................................................................................................ 2 − 41
2.7.1. LSU overview............................................................................................................. 2 − 41
2.7.2. Laser Scanning Optical path .......................................................................................... 2 − 43
2.7.3. Laser synchronizing detectors ........................................................................................ 2 − 44
2.8. Drive System .......................................................................................................................... 2 − 46
2.8.1. Drive Motors .............................................................................................................. 2 − 46
2.8.2. Main Drive Unit.......................................................................................................... 2 − 47
2.8.2.1.
2.8.2.2.
2.8.3. Fuser_Exit Drive ......................................................................................................... 2 − 50
2.9. Scanner System ....................................................................................................................... 2 − 51
2.9.1. Scanner System overview ............................................................................................. 2 − 51
2.9.2. Scanning System Components ....................................................................................... 2 − 52
2.10. Dual Scan Document Feeder(DSDF) ........................................................................................... 2 − 53
2.10.1. DSDF(Dual Scan Document Feeder) overview.................................................................. 2 − 53
2.10.2. Electrical parts location ................................................................................................ 2 − 54
2.10.3. DSDF Drive System .................................................................................................... 2 − 56
2.11. Hardware Configuration ............................................................................................................ 2 − 58
2.11.1. Main board................................................................................................................. 2 − 61
2.11.2. MSOK ...................................................................................................................... 2 − 63
2.11.3. Fax Joint PBA ............................................................................................................ 2 − 63
2.11.4. Fax Card (Optional) ..................................................................................................... 2 − 64
2.11.5. FDI (Optional) ............................................................................................................ 2 − 64
2.11.6. OPE Hub PBA ............................................................................................................ 2 − 65
2.11.7. SMPS board ............................................................................................................... 2 − 66
2.11.8. Fuser Drive Board (FDB).............................................................................................. 2 − 68
2.11.9. HVPS board ............................................................................................................... 2 − 69
2.11.10. Finisher PBA.............................................................................................................. 2 − 71
2.11.11. SCF_HCF board.......................................................................................................... 2 − 72
2.11.12. CRUM Joint PBA........................................................................................................ 2 − 72
2.11.13. Sub-Cassette PBA ....................................................................................................... 2 − 73
2.11.14. CRUM PBA .............................................................................................................. 2 − 73
2.11.15. Eraser PBA ................................................................................................................ 2 − 74
2.11.16. Fuser CRUM PBA....................................................................................................... 2 − 74
3. Disassembly and Reassembly ................................................................................................................3 − 1
3.1. Precautions when replacing parts ..................................................................................................3 − 1
3.1.1. Precautions when assembling and disassembling .................................................................3 − 1
3.1.2. Precautions when handling PBA.......................................................................................3 − 1
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Main Drive (OPC_Regi._Pick-up_MP_Duplex) .................................................. 2 − 48
Main Drive (Deve_Agitaitor_Toner Supply) ....................................................... 2 − 49
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