FrameMaker Ver.5.5E(PC) Di151 DIS/REASSEMBLY, ADJUSTMENT
00.03.21
1.
SERVICE INSTRUCTIONS
1-1.
IDENTIFICATION OF FUSES
1-2.
PRECAUTIONS FOR HANDLING THE LASER EQUIPMENT
• The laser used in this copier is a semiconductor laser with the following specifications:
• When laser protective goggles are to be used, select ones with a lens conforming to the
above specifications.
• When a disassembly job needs to be performed in the laser beam path, such as when
working around the PH and PC Drum, be sure to turn the copier OFF first.
• If the job requires that the copier be left ON, take off your watch and ring and wear laser
protective goggles.
• A highly reflective tool can be dangerous if it is brought into the laser beam path. Use
utmost care when handling such tools near the laser.
• The PH is not maintainable in the field. It is to be replaced as a unit including the control
board. Never, therefore, attempt to remove the laser diode or adjust trimmers on the con-
trol board.
Control Board PWB-I
250V 3A (F1)
4007D040AA
Max. power: 5 mW
Output wavelength: 770 to 795 nm
D-1
Power Supply Board PU1
100V Area
250V 6.3A (F1)
250V 15A (F2)
200V Area
250V 4A(F1)
250V 6.3A(F2)