Sony HXCU-100 Service Manual page 169
Hd camera control unit
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Also See for HXCU-100:
- Operating instructions manual (149 pages) ,
- Operating instructions manual (32 pages)
Table of Contents
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(SY-364 BOARD)
Ref. No.
or Q'ty Part No.
SP Description
C730
1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C731
1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C732
1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C733
1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C734
1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C735
1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C736
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C737
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C738
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C739
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C740
1-100-581-81 s CAP,CHIP CERAMIC0.0047MF B1005
C741
1-100-581-81 s CAP,CHIP CERAMIC0.0047MF B1005
C742
1-100-581-81 s CAP,CHIP CERAMIC0.0047MF B1005
C743
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C744
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C746
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C747
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C748
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C749
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C750
1-119-869-91 s CAP, CHIP CERAMIC 10MF 3225
C751
1-119-869-91 s CAP, CHIP CERAMIC 10MF 3225
C753
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C754
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C756
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C757
1-100-581-81 s CAP,CHIP CERAMIC0.0047MF B1005
C758
1-100-581-81 s CAP,CHIP CERAMIC0.0047MF B1005
C759
1-164-940-81 s CAP,CHIP CERAMIC 3300PF B 1005
C760
1-164-940-81 s CAP,CHIP CERAMIC 3300PF B 1005
C761
1-164-940-81 s CAP,CHIP CERAMIC 3300PF B 1005
C762
1-164-940-81 s CAP,CHIP CERAMIC 3300PF B 1005
C800
1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C801
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C802
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C803
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C804
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C805
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C806
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C807
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C808
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C809
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C810
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C811
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C812
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C813
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C814
1-114-999-11 s CAP, DOUBLE LAYERS 0.22F
C815
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C816
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C817
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C818
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C819
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C820
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C822
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C823
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C824
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C825
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C826
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C827
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C828
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C829
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
HXCU-100
(SY-364 BOARD)
Ref. No.
or Q'ty Part No.
SP Description
C830
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C831
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C832
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C833
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C834
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C835
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C836
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C837
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C838
1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005
C839
1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005
C840
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C841
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C842
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C843
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C844
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C845
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C846
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C847
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C848
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C849
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C850
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C851
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C852
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C853
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C854
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C855
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C856
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C857
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C858
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C859
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C860
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C861
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C862
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C863
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C864
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C865
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C866
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C867
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C868
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C869
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C870
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C871
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C872
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C873
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C874
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C875
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C876
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C877
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C878
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C879
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C880
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C881
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C882
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C883
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C884
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C885
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C886
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C887
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C888
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
7-63
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