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Thermal Specifications
5
Thermal Specifications
A complete thermal solution includes both component and system level thermal
management features. The processor requires a thermal solution to maintain
temperatures within operating limits.
Caution:
Any attempt to operate the processor outside operating limits may result in permanent
damage to the processor and potentially other components in the system.
The system/processor thermal solution should remain within the minimum and
maximum junction temperature (Tj) specifications at the corresponding thermal design
power (TDP) value listed in
Table 16.
Standard Voltage Power Specifications
Symbol
TDP
Symbol
P
AH,
P
SGNT
P
SLP
P
DSLP
T
J
NOTES:
1.
The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3.
As measured by the activation of the on-die Intel® Thermal Monitor. The Intel Thermal
Monitor's automatic mode is used to indicate that the maximum T
Refer to
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specifications.
5.
At Tj of 100°C.
6.
At 50°C.
7.
At 35°C.
Datasheet
Table
Processor
Core Frequency
Number
and Voltage
530
1.73 GHz
540
1.86 GHz
550
2.00 GHz
560
2.13 GHz
Parameter
Auto Halt, Stop Grant Power at V
Sleep Power at V
CC
Deep Sleep Power at V
CC
Junction Temperature
Section 5.1
for more details.
16.
Thermal Design
Die Variant
1-M Fused
1 M
1-M Fused
1 M
1-M Fused
1 M
1-M Fused
1M
Min
CC
0
Unit
Notes
Power
31
27
31
27
W
1, 4, 5
31
27
31
27
Typ
Max
Unit
10.9
W
2, 6
10.1
W
2, 6
6.8
W
2, 7
100
°C
3, 4
has been reached.
J
61
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