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Electrical Specifications
Table 8.
AGTL+ Signal Group DC Specifications
Symbol
Parameter
V
I/O Voltage
CCP
GTLREF
Reference Voltage
R
Compensation Resistor
COMP
R
Termination Resistor
ODT
V
Input High Voltage
IH
V
Input Low Voltage
IL
V
Output High Voltage
OH
R
Termination Resistance
TT
R
Buffer On Resistance
ON
I
Input Leakage Current
LI
C
Pad Capacitance
PAD
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
V
is defined as the minimum voltage level at a receiving agent that interprets as a logical high value.
IH
3.
V
is defined as the maximum voltage level at a receiving agent that interprets as a logical low value.
IL
4.
V
and V
may experience excursions above V
IH
OH
signal quality specifications.
5.
This is the pull-down driver resistance. Refer to processor I/O Buffer Models for I/V characteristics.
Measured at 0.31*V
6.
GTLREF should be generated from V
specifications is the instantaneous V
7.
R
is the on-die termination resistance measured at V
TT
0.31*V
. R
is connected to V
CCP
TT
8.
Specified with on die R
9.
Cpad includes die capacitance only. No package parasitics are included.
10.
This is the external resistor on the comp pins.
11.
On die termination resistance, measured at 0.33*V
Datasheet
27.23
GTLREF+0.10
-0.10
V
CCP
. R
(min) = 0.38*R
CCP
ON
TT
with a 1% tolerance resistor divider. The V
CCP
.
CCP
on die. Refer to processor I/O buffer models for I/V characteristics.
CCP
and R
are turned off. Vin between 0 and V
TT
ON
Min
Typ
1.00
1.05
2/3 V
CCP
27.5
55
V
CCP
0
-0.10
V
CCP
50
55
22
25
1.6
2.1
. However, input signal drivers must comply with the
CCP
. R
(typ) = 0.45*R
. R
ON
ON
TT
of the AGTL+ output driver. Measured at
OL
CCP
.
CCP
Max
Unit
Notes
1.10
V
V
27.78
Ω
Ω
V
+0.10
V
CCP
GTLREF-0.10
V
V
CCP
61
Ω
28
Ω
±100
µA
2.55
pF
(max) = 0.52*R
TT.
referred to in these
CCP
.
1
6
10
11
2, 6
3, 4
6
7
5
8
9
27
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